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EMIF08-1502M16 |EMIF081502M16STN/a5200avai8-line low capacitance EMI filter and ESD protection


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EMIF08-1502M16
8-line low capacitance EMI filter and ESD protection
February 2008 Rev 2 1/10
EMIF08-1502M16

8-line IP AD™
low capacitance EMI filter and ESD protection in micro QFN package
Features
EMI (I/O) low-pass filter High efficiency in EMI filtering: Greater than 30 dB attenuation at
frequencies from 900 MHz to 1.8 GHz Cut-off frequency: 300 MHz Very low PCB space consumption:
3.3 mm x 1.5 mm Very thin package: 0.6 mm max. High efficiency in ESD suppression on inputs
pins (IEC 61000-4-2 level 4) High reliability offered by monolithic integration High reduction of parasitic elements through
integration Lead-free package
Complies with following standards:
IEC 61000-4-2 level 4 input pins 15 kV (air discharge) 8 kV (contact discharge) MIL STD 883G - Method 3015-7 Class 3A
(all pins)
Applications

Where EMI filtering in ESD sensitive equipment is
required: LCD and camera for Mobile phones Computers and printers Communication systems MCU boards
Figure 1. Basic cell configuration
Description

The EMIF08-1502M16 is an 8-line, highly
integrated device designed to suppress EMI/RFI
noise in all systems exposed to electromagnetic
interference.
This filter includes an ESD protection circuitry,
which prevents damage to the application when
subjected to ESD surges up to 15 kV on the input
pins.
TM: IPAD is a trademark of STMicroelectronics
Characteristics EMIF08-1502M16
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1 Characteristics
Figure 2. Pin configuration (top view)

Table 1. Absolute ratings (limiting values)
EMIF08-1502M16 Characteristics
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Table 2. Electrical characteristics (Tamb = 25 °C)
Figure 3. S21 attenuation measurement Figure 4. Analog cross talk measurements
Ordering information scheme EMIF08-1502M16
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Figure 7. Line capacitance versus reverse voltage applied (typical value) Ordering information scheme
Figure 8. Ordering information scheme
Figure 5. ESD response to IEC 61000-4-2
(+15 kV air discharge) on one input
(Vin) and on one output (Vout)
Figure 6. ESD response to IEC 61000-4-2 15 kV air discharge) on one input
(Vin) and on one output (Vout)
EMIF08-1502M16 Package information
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3 Package information
Epoxy meets UL94, V0
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the inner box label, in compliance with JEDEC
Standard JESD97. The maximum ratings related to soldering conditions are also marked on
the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at
.


Table 3. Micro QFN 3.3x1.5 16L dimensions
Figure 9. Micro QFN 3.3x1.5 16L
footprint (dimensions in mm)
Figure 10. Marking
Package information EMIF08-1502M16
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Figure 11. Tape and reel specification

Note: Product marking may be rotated by 90° for assembly plant differentiation. In no case should
this product marking be used to orient the component for its placement on a PCB. Only pin1
mark is to be used for this purpose.
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