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EMIF02-MIC03M6
2-line EMI filter and ESD protection for microphones
EMIF02-MIC03M62-line IP AD™, EMI filter and ESD protection for microphone
Features EMI symmetrical (I/O) low-pass filter High efficiency in EMI filtering Very low PCB space consumption:
1.0 mm x 1.45 mm Very thin package: 0.6 mm max High efficiency in ESD suppression High reliability offered by monolithic integration High reduction of parasitic elements through
integration and wafer level packaging Lead-free and halogen-free package
Complies with following standards IEC 61000-4-2 level 4, input and output pins IEC 61000-4-2 level 4 requirements 8 kV (contact discharge) 15 kV (air discharge)
Application Mobile phones
DescriptionThe EMIF02-MIC03M6 is a 2-line highly
integrated device designed to suppress EMI/RFI
noise in all systems exposed to electromagnetic
interference.
This filter includes ESD protection circuitry, which
prevents damage to the application when
subjected to ESD surges up to 8 kV on all pins.
Figure 1. Pin configuration (top view)
Figure 2. Basic cell configuration
TM: IP AD is a trademark of STMicroelectronics
Characteristics EMIF02-MIC03M6
1 Characteristics
Table 1. Absolute ratings(1) limiting values at Tamb = 25 °C unless otherwise specified According to IEC61000-4-2 test conditions with ungrounded table top equipment set-up, PCB board on insulated plane
(dimensions 25 x 25 mm2 ), 2 serial resistors of 470 kΩ to GND reference plane
Table 2. Electrical characteristics (Tamb = 25 °C) Tolerance ± 20%
EMIF02-MIC03M6 Characteristics
Figure 3. S21 attenuation measurement Figure 4. Analog cross talk measurements
(MIC R / MIC L)
Figure 5. ESD response to IEC 61000-4-2
(+8 kV contact discharge) on MIC
lines
Figure 6. ESD response to IEC 61000-4-2
(-8 kV contact discharge) on MIC
lines
Ordering information scheme EMIF02-MIC03M6 Ordering information scheme
Figure 7. Ordering information scheme
EMIF02-MIC03M6 Package information
3 Package information Epoxy meets UL94, V0 Lead-free packages
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: .
ECOPACK® is an ST trademark.
Table 3. Micro QFN 1.45 x 1.00 6L dimensions
Figure 8. Footprint in mm [inches] Figure 9. Marking
Package information EMIF02-MIC03M6
Figure 10. Tape and reel specificationNote: Product marking may be rotated by 90° for assembly plant differentiation. In no case should
this product marking be used to orient the component for its placement on a PCB. Only pin
1 mark is to be used for this purpose.
