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DAC8426FPPMIN/a1avaiQuad 8-Bit Voltage Out CMOS DAC Complete with Internal 10 V Reference
DAC8426FSADIN/a12avaiQuad 8-Bit Voltage Out CMOS DAC Complete with Internal 10 V Reference


DAC8426FS ,Quad 8-Bit Voltage Out CMOS DAC Complete with Internal 10 V ReferenceSPECIFICATIONS (V = +15 V 6 10%, AGND = DGND = 0 V, V = 0 V, T = –558C to +1258CDD SS Aapplies for ..
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DAC8426FP-DAC8426FS
Quad 8-Bit Voltage Out CMOS DAC Complete with Internal 10 V Reference
REV.CQuad 8-Bit Voltage Out CMOS DAC
Complete with Internal 10 V Reference
GENERAL DESCRIPTION

The DAC8426 is a complete quad voltage output D/A converter
with internal reference. This product fits directly into any exist-
ing 7226 socket where the user currently has a 10 V external
reference. The external reference is no longer necessary. The
internal reference of the DAC8426 is laser-trimmed to ±0.4%
FEATURES
No Adjustments Required, Total Error 61 LSB Max
Over Temperature
Four Voltage-Output DACs on a Single Chip
Internal 10 V Bandgap Reference
Operates from Single 115 V Supply
Fast 50 ns Data Load Time, All Temperatures
Pin-for-Pin Replacement for PM-7226 and AD7226,
Eliminates External Reference
APPLICATIONS
Process Controls
Multichannel Microprocessor Controlled:
System Calibration
Op Amp Offset and Gain Adjust
Level and Threshold Setting

offering a 25 ppm/°C temperature coefficient and 5 mA of exter-
nal load driving capability.
The DAC8426 contains four 8-bit voltage-output CMOS D/A
converters on a single chip. A 10 V output bandgap reference
sets the output full-scale voltage. The circuit also includes four
input latches and interface control logic.
One of the four latches, selected by the address inputs, is loaded
from the 8-bit data bus input when the write strobe is active
low. All digital inputs are TTL/CMOS (5 V) compatible. The
on-board amplifiers can drive up to 10 mA from either a single
or dual supply. The on-board reference that is always connected
to the internal DACs has 5 mA available to drive external devices.
Its compact size, low power, and economical cost-per-channel,
make the DAC8426 attractive for applications requiring mul-
tiple D/A converters without sacrificing circuit-board space. Sys-
tem reliability is also increased due to reduced parts count.
PMI’s advanced oxide-based, silicon-gate, CMOS process al-
lows the DAC8426’s analog and digital circuitry to be manufac-
tured on the same chip. This, coupled with PMI’s highly stable
thin-film R-2R resistor ladder, aids in matching and tempera-
ture tracking between DACs.
FUNCTIONAL BLOCK DIAGRAM
DAC8426–SPECIFICATIONS(VDD = +15 V 6 10%, AGND = DGND = 0 V, VSS = 0 V, TA = –558C to +1258C
applies for DAC8426AR/BR, TA = –408C to +858C applies for DAC8426ER/EP/FR/FP/FS, unless otherwise noted.)

NOTESIncludes Full-Scale Error, Relative Accuracy, and Zero Code Error. Note ±1 LSB = ±0.39% error.All devices guaranteed monotonic over the full operating temperature range.Guaranteed and not subject to production test.Digital inputs VIN = VINL or VINH; VOUT and VREFOUT unloaded.
ELECTRICAL CHARACTERISTICSVDD = +15 V 6 10%, AGND = DGND = 0 V, VSS = 0 V, TA = –558C to +1258C applies for
DAC8426AR/BR, TA = –408C to +858C applies for DAC8426ER/EP/FR/FP/FS, unless otherwise noted.
CAUTIONDo not apply voltages higher than VDD or less than VSS po-
tential on any terminal.The digital control inputs are zener-protected; however,
permanent damage may occur on unprotected units from
high-energy electrostatic fields. Keep units in conductive
foam at all times until ready to use.Do not insert this device into powered sockets. Remove
power before insertion or removal.Stresses above those listed under “Absolute Maximum Rat-
ings” may cause permanent damage to device.
ABSOLUTE MAXIMUM RATINGS

VDD to AGND or DGND . . . . . . . . . . . . . . . . .–0.3 V, +17 V
VSS to AGND or DGND . . . . . . . . . . . . . . . . . . . . .–7 V, VDD
VDD to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . .–0.3 V, +24 V
AGND to DGND . . . . . . . . . . . . . . . . . . . . . . . .–0.3 V, +5 V
Digital Input Voltage to DGND . . . . . . . . . . . . .–0.3 V, VDD
VREFOUT to AGND1 . . . . . . . . . . . . . . . . . . . . .–0.3 V, VDD
VOUT to AGND1 . . . . . . . . . . . . . . . . . . . . . . . . . . . .VSS, VDD
Operating Temperature
Military AR/BR . . . . . . . . . . . . . . . . . . . .–55°C to +125°C
Extended Industrial ER/EP/FR/FP/FS . . . .–40°C to +85°C
Maximum Junction Temperature . . . . . . . . . . . . . . . .+150°C
Storage Temperature . . . . . . . . . . . . . . . . . .–65°C to +150°C
Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . .+300°C
THERMAL RESISTANCE

NOTESOutputs may be shorted to any terminal provided the package power dissipation
is not exceeded. Typical output short-circuit current to AGND is 50 mA.θJA is specified for worst case mounting conditions, i.e., θJA is specified for de-
vice in socket for cerdip and P-DIP packages; θJA is specified for device sol-
dered to printed circuit board for SOL package.
20-Pin Cerdip
(R Suffix)
20-Pin Epoxy DIP
(P Suffix)
20-Pin SOL
(S Suffix)
PIN CONNECTIONS
ORDERING GUIDE1

NOTESBurn-in is available on commercial and industrial temperature range parts in cerdip, plastic DIP, and TO-can packages.For devices processed in total compliance to MIL-STD-883, add /883 after part number. Consult factory for 883 data sheet.For availability and burn-in information on SO and PLCC packages, contact your local sales office.
DAC8426
DICE CHARACTERISTICS

DIE SIZE 0.129 × 0.152 inch, 19,608 sq. mils
(3.28 × 3.86 mm, 12.65 sq. mm)
1. VOUT B11. DB3
2. VOUT A12. DB2
3. VSS13. DB1
4. VREF OUT14. DB0 (LSB)
5. AGND15. WR
6. DGND16. A1
7. DB7 (MSB)17. A0
8. DB618. VDD
9. DB519. VOUT D
10. DB420. VOUT C
CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the DAC8426 features proprietary ESD protection circuitry, permanent damage may
NOTE
Electrical tests are performed at wafer probe to the limits shown. Due to variations in assembly methods and normal yield loss, yield after packaging is not guaranteed
for standard product dice. Consult factory to negotiate specifications based on dice lot qualifications through sample lot assembly and testing.
WAFER TEST LIMITSat VDD = +15 V 6 5%; VSS = AGND = DGND = 0 V; unless otherwise specified. TA = +258C. All specifications
apply for DACs A, B, C, and D.
Channel-to-Channel Matching (DACs
A, B, C, D, Superimposed)
Long Term Drift Accelerated by
Burn-In
Power Supply Current vs.
Temperature
Zero Code Error vs. Temperature
Broadband Noise (DC to 200 kHz)
PSRR(+) = –20 LOG

VOUT(0)

DVDD,
VDD = +15 V 61 VP, VSS = 0 V
PSRR(–) = –20 LOG
OUT(0)
DVSS,
VDD = +15 V, VSS = –4 V 61 VP

Relative Accuracy vs. Code
at TA = –55°C, +25°C, +125°C
(All Superimposed)
VOUT Noise Density vs. Frequency
PSRR vs. Frequency
DAC8426–Typical Performance Characteristics
VREFOUT Error from 10.000 V
vs. Temperature
Output Impedance (VREFOUT)
vs. Frequency
VREFOUT Load Regulation
vs. Temperature
VREFOUT Start UpVREFOUT Line Regulation vs. Temperature
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