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BUK7575-100A |BUK7575100APHILIPSN/a445avaiTrenchMOS TM standard level FET
BUK7675-100A |BUK7675100APHN/a385avaiTrenchMOS TM standard level FET


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BUK7575-100A ,TrenchMOS TM standard level FET
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BUK7575-100A-BUK7675-100A
TrenchMOS TM standard level FET
BUK7575-100A;
BUK7675-100A
renchMOS™ standard level FET
Rev. 01 — 24 October 2000 Product specification
Description
N-channel enhancement mode field-effect power transistorina plastic package using
TrenchMOS™ technology, featuring very low on-state resistance.
Product availability:
BUK7575-100A in SOT78 (TO-220AB)
BUK7675-100A in SOT404(D 2 -PAK). Features TrenchMOS™ technology Q101 compliant 175 °C rated Standard level compatible. Applications Automotive and general purpose power switching: 12 V, 24 V and 42 V loads Motors, lamps and solenoids. Pinning information
Table 1: Pinning - SOT78 and SOT404, simplified outline and symbol
gate (g)
SOT78 (TO-220AB) SOT404 (D2 -PAK)
drain (d) source (s) mounting base;
connected to drain (d)
MBK106
MBK116
MBB076
Philips Semiconductors BUK7575-100A; BUK7675-100A
TrenchMOS™ standard level FET Quick reference data Limiting values
Table 2: Quick reference data

VDS drain-source voltage (DC) − 100 V drain current (DC) Tmb =25 °C; VGS =10V − 23 A
Ptot total power dissipation Tmb =25°C − 99 W junction temperature − 175 °C
RDSon drain-source on-state resistance VGS=10 V; ID =13A =25°C − 75 mΩ= 175°C − 187 mΩ
Table 3: Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).
VDS drain-source voltage (DC) − 100 V
VDGR drain-gate voltage (DC) RGS =20kΩ− 100 V
VGS gate-source voltage (DC) −±20 V drain current (DC) Tmb =25 °C; VGS =10V;
Figure2 and3 23 A
Tmb= 100 °C; VGS =10V; Figure2 − 16.2 A
IDM peak drain current Tmb =25 °C; pulsed; tp≤10 μs;
Figure3 92 A
Ptot total power dissipation Tmb =25 °C; Figure1 − 99 W
Tstg storage temperature −55 +175 °C operating junction temperature −55 +175 °C
Source-drain diode

IDR reverse drain current (DC) Tmb =25°C − 23 A
IDRM pulsed reverse drain current Tmb =25 °C; pulsed; tp≤10μs − 92 A
Avalanche ruggedness

WDSS non-repetitive avalanche energy unclamped inductive load; ID =14A;
VDS≤ 100 V; VGS =10V; RGS =50Ω;
starting Tmb =25°C 100 mJ
Philips Semiconductors BUK7575-100A; BUK7675-100A
TrenchMOS™ standard level FET
Philips Semiconductors BUK7575-100A; BUK7675-100A
TrenchMOS™ standard level FET Thermal characteristics
7.1 Transient thermal impedance
Table 4: Thermal characteristics

Rth(j-a) thermal resistance from junction to ambient vertical in still air; SOT78 package 60 K/W
mounted on printed circuit board;
minimum footprint; SOT404
package K/W
Rth(j-mb) thermal resistance from junction to mounting
base
Figure4 1.5 K/W
Philips Semiconductors BUK7575-100A; BUK7675-100A
TrenchMOS™ standard level FET Characteristics
Table 5: Characteristics
=25 °C unless otherwise specified
Static characteristics

V(BR)DSS drain-source breakdown
voltage= 0.25 mA; VGS =0V =25°C 100 −− V= −55 °C89 −− V
VGS(th) gate-source threshold voltageID=1 mA; VDS =VGS;
Figure9 =25 °C2 3 4 V= 175 °C1 −− V= −55°C −− 4.4 V
IDSS drain-source leakage current VDS= 100 V; VGS =0V =25°C − 0.05 10 μA= 175°C −− 500 μA
IGSS gate-source leakage current VGS= ±20 V; VDS =0V − 2 100 nA
RDSon drain-source on-state
resistance
VGS =10V; ID =13A;
Figure7 and8 =25°C − 64 75 mΩ= 175°C −− 187 mΩ
Dynamic characteristics

Ciss input capacitance VGS =0V; VDS =25V;=1 MHz; Figure12 907 1210 pF
Coss output capacitance − 127 150 pF
Crss reverse transfer capacitance − 78 110 pF
td(on) turn-on delay time VDD=30 V; RL= 2.2Ω;
VGS =10V; RG= 5.6Ω; 8 − ns rise time − 39 − ns
td(off) turn-off delay time − 26 − ns fall time − 24 − ns internal drain inductance from drain lead 6 mm from
package to centre of die 4.5 − nH
from contact screw on
mounting base to centre of
die SOT78 3.5 − nH
from upper edge of drain
mounting base to centre of
die SOT404 2.5 − nH internal source inductance from source lead to source
bond pad 7.5 − nH
Philips Semiconductors BUK7575-100A; BUK7675-100A
TrenchMOS™ standard level FET
Source-drain diode

VSD source-drain (diode forward)
voltage=25 A; VGS =0V;
Figure15 0.85 1.2 V
trr reverse recovery time IS =13A; dIS/dt= −100 A/μs
VGS= −10 V; VDS =30V 64 − ns recovered charge − 120 − nC
Table 5: Characteristics…continued
=25 °C unless otherwise specified
Philips Semiconductors BUK7575-100A; BUK7675-100A
TrenchMOS™ standard level FET
Philips Semiconductors BUK7575-100A; BUK7675-100A
TrenchMOS™ standard level FET
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