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BT258X-500R |BT258X500RPHIN/a1000avaiThyristors logic level
BT258X-800R |BT258X800RPHILIPSN/a1210avaiThyristors logic level


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BT258X-500R-BT258X-800R
Thyristors logic level
Philips Semiconductors Product specification
Thyristors BT258X series
logic level
GENERAL DESCRIPTION QUICK REFERENCE DATA

Passivated, sensitive gate thyristors SYMBOL PARAMETER MAX. MAX. MAX. UNITa full pack, plastic envelope,intended for usein general purpose BT258X- 500R 600R 800R
switching and phase control VDRM, Repetitive peak off-state 500 600 800 V
applications. These devices are VRRM voltagesintendedto be interfaced directlyto I T(AV) Average on-state current 5 5 5 A
microcontrollers, logic integrated IT(RMS) RMS on-state current 8 8 8 A
circuits and other low power gate ITSM Non-repetitive peak on-state 75 75 75 Atrigger circuits. current
PINNING - SOT186A PIN CONFIGURATION SYMBOL
PIN DESCRIPTION
cathode anode gate
case isolated
LIMITING VALUES

Limiting values in accordance with the Absolute Maximum System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
-500R -600R -800R

VDRM, VRRM Repetitive peak off-state - 5001 6001 800 V
voltages
IT(AV) Average on-state current half sine wave; Ths ≤ 90 ˚C - 5 A
IT(RMS) RMS on-state current all conduction angles - 8 A
ITSM Non-repetitive peak half sine wave; Tj = 25 ˚C prior to
on-state current surge
t = 10 ms - 75 A
t = 8.3 ms - 82 A2 tI2 t for fusing t = 10 ms - 28 A2s
dIT/dt Repetitive rate of rise of ITM = 10 A; IG = 50 mA; - 50 A/μs
on-state current after dIG/dt = 50 mA/μs
triggering
IGM Peak gate current - 2 A
VRGM Peak reverse gate voltage - 5 V
PGM Peak gate power - 5 W
PG(AV) Average gate power over any 20 ms period - 0.5 W
Tstg Storage temperature -40 150 ˚C Operating junction - 1252 ˚C
temperature123
case
1 Although not recommended, off-state voltages up to 800V may be applied without damage, but the thyristor may
Philips Semiconductors Product specification
Thyristors
BT258X series
logic level
ISOLATION LIMITING VALUE & CHARACTERISTIC

Ths = 25 ˚C unless otherwise specified
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Visol R.M.S. isolation voltage from all f = 50-60 Hz; sinusoidal - - 2500 V
three terminals to external waveform;
heatsink R.H. ≤ 65% ; clean and dustfree
Cisol Capacitance from T2 to external f = 1 MHz - 10 - pFheatsink
THERMAL RESISTANCES
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Rth j-hs Thermal resistance with heatsink compound - - 5.0 K/W
junction to heatsink without heatsink compound - - 6.9 K/W
Rth j-a Thermal resistance in free air - 55 - K/W
junction to ambient
STATIC CHARACTERISTICS

Tj = 25 ˚C unless otherwise stated
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

IGT Gate trigger current VD = 12 V; IT = 0.1 A - 50 200 μA Latching current VD = 12 V; IGT = 0.1 A - 0.4 10 mA Holding current VD = 12 V; IGT = 0.1 A - 0.3 6 mA On-state voltage IT = 16 A - 1.3 1.6 V
VGT Gate trigger voltage VD = 12 V; IT = 0.1 A - 0.4 1.5 V
VD = VDRM(max); IT = 0.1 A; Tj = 110 ˚C 0.1 0.2 - V
ID, IR Off-state leakage current VD = VDRM(max); VR = VRRM(max); Tj = 125 ˚C - 0.1 0.5 mA
DYNAMIC CHARACTERISTICS

Tj = 25 ˚C unless otherwise stated
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

dVD/dt Critical rate of rise of VDM = 67% VDRM(max); Tj = 125 ˚C; 50 100 - V/μs
off-state voltage exponential waveform; RGK = 100 Ω
tgt Gate controlled turn-on ITM = 10 A; VD = VDRM(max); IG = 5 mA; - 2 - μs
time dIG/dt = 0.2 A/μs Circuit commutated VD = 67% VDRM(max); Tj = 125 ˚C; - 100 - μs
turn-off time ITM = 12 A; VR = 24 V; dITM/dt = 10 A/μs;
dVD/dt = 2 V/μs; RGK = 1 kΩ
Philips Semiconductors Product specification
Thyristors
BT258X series
logic level
Fig.1. Maximum on-state dissipation, Ptot, versus
average on-state current, IT(AV), where
a = form factor = IT(RMS)/ IT(AV).
Fig.2. Maximum permissible non-repetitive peak
on-state current ITSM, versus pulse width tp, for
sinusoidal currents, tp ≤ 10ms.
Fig.4. Maximum permissible non-repetitive peak
on-state current ITSM, versus number of cycles, for
sinusoidal currents, f = 50 Hz.
Fig.5. Maximum permissible repetitive rms on-state
current IT(RMS), versus surge duration, for sinusoidal
currents, f = 50 Hz; Ths ≤ 90˚C. 2 4 6
IT(AV) (A)
Ptot (W) Ths(max) (˚C)
100 10 100 10000
Number of half cycles at 50Hz
ITSM / A
10us 100us 1ms 10ms
T / s
ITSM / A
0.01 0.1 1 100
surge duration / s
IT(RMS) / A
-50 0 50 100 1500
Ths / C
IT(RMS) / A
-50 0 50 100 1500.4
Tj / C
VGT(Tj)
VGT(25 C)
Philips Semiconductors Product specification
Thyristors
BT258X series
logic level
Fig.7. Normalised gate trigger current
IGT(Tj)/ IGT(25˚C), versus junction temperature Tj.
Fig.8. Normalised latching current IL(Tj)/ IL(25˚C),
versus junction temperature Tj.
Fig.9. Normalised holding current IH(Tj)/ IH(25˚C),
versus junction temperature Tj.
Fig.10. Typical and maximum on-state characteristic.
Fig.11. Transient thermal impedance Zth j-hs, versus
pulse width tp.
Fig.12. Typical, critical rate of rise of off-state voltage,
dVD/dt versus junction temperature Tj.
-50 0 50 100 1500
Tj / C
IGT(Tj)
IGT(25 C) 0.5 1 1.5 20
VT / V
IT / A
-50 0 50 100 1500
Tj / C
IL(Tj)
IL(25 C)
10us 0.1ms 1ms 10ms 0.1s 1s 10s0.01
tp / s
Zth j-hs (K/W)
-50 0 50 100 1500
Tj / C
IH(Tj)
IH(25 C) 50 100 1501
Tj / C
dVD/dt (V/us)
Philips Semiconductors Product specification
Thyristors
BT258X series
logic level
MECHANICAL DATA

Dimensions in mm
Net Mass: 2 g
Fig.13. SOT186A; The seating plane is electrically isolated from all terminals.
Notes

1. Refer to mounting instructions for F-pack envelopes.
2. Epoxy meets UL94 V0 at 1/8".
max
seating
plane
max
3 max.
not tinned
max.
min.
Recesses (2x)
0.8 max. depth
1.0 (2x)
1.3
Philips Semiconductors Product specification
Thyristors
BT258X series
logic level
DEFINITIONS
DATA SHEET STATUS
DATA SHEET PRODUCT DEFINITIONS
STATUS
3 STATUS4
Objective data Development This data sheet contains data from the objective specification for
product development. Philips Semiconductors reserves the right to
change the specification in any manner without notice
Preliminary data Qualification This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product
Product data Production This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in
order to improve the design, manufacturing and supply. Changes will
be communicated according to the Customer Product/Process
Change Notification (CPCN) procedure SNW-SQ-650A
Limiting values

Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and
operation of the device at these or at any other conditions above those given in the Characteristics sections of
this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information

Where application information is given, it is advisory and does not form part of the specification.
 Philips Electronics N.V. 2003
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the
copyright owner.
The information presented in this document does not form part of any quotation or contract, it is believed to be
accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under patent or other
industrial or intellectual property rights.
LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices or systems where malfunction of these
products can be reasonably expected to result in personal injury. Philips customers using or selling these products
for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resultingfrom such improper use or sale.
3 Please consult the most recently issued datasheet before initiating or completing a design.
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