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BT145-800R |BT145800RNXPN/a129avaiSCR


BT145-800R ,SCRapplications I Average on-state current 16 16 16 AT(AV)include motor control, industrial and I RMS ..
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BT145-800R
SCR
Philips Semiconductors Product specification
Thyristors BT145 series
GENERAL DESCRIPTION QUICK REFERENCE DATA

Glasspassivatedthyristorsina plastic SYMBOL PARAMETER MAX. MAX. MAX. UNIT
envelope, intended for use inapplications requiring high BT145- 500R 600R 800R
bidirectional blocking voltage VDRM, Repetitive peak off-state 500 600 800 V
capability and high thermal cycling VRRM voltagesperformance. Typical applications I T(AV) Average on-state current 16 16 16 A
include motor control, industrial and IT(RMS) RMS on-state current 25 25 25 A
domestic lighting, heating and static ITSM Non-repetitive peak on-state 300 300 300 Aswitching. current
PINNING - TO220AB PIN CONFIGURATION SYMBOL
PIN DESCRIPTION
cathode anode gate
tab anode
LIMITING VALUES

Limiting values in accordance with the Absolute Maximum System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
-500R -600R -800R

VDRM, VRRM Repetitive peak off-state - 5001 6001 800 V
voltages
IT(AV) Average on-state current half sine wave; Tmb ≤ 101 ˚C - 16 A
IT(RMS) RMS on-state current all conduction angles - 25 A
ITSM Non-repetitive peak half sine wave; Tj = 25 ˚C prior to
on-state current surge
t = 10 ms - 300 A
t = 8.3 ms - 330 A2 tI2 t for fusing t = 10 ms - 450 A2s
dIT/dt Repetitive rate of rise of ITM = 50 A; IG = 0.2 A; - 200 A/μs
on-state current after dIG/dt = 0.2 A/μs
triggering
IGM Peak gate current - 5 A
VGM Peak gate voltage - 5 V
VRGM Peak reverse gate voltage - 5 V
PGM Peak gate power - 20 W
PG(AV) Average gate power over any 20 ms period - 0.5 W
Tstg Storage temperature -40 150 ˚C Operating junction - 125 ˚C
temperature123
tab
Philips Semiconductors Product specification
Thyristors
BT145 series
THERMAL RESISTANCES
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Rth j-mb Thermal resistance - - 1.0 K/W
junction to mounting base
Rth j-a Thermal resistance in free air - 60 - K/W
junction to ambient
STATIC CHARACTERISTICS
j = 25 ˚C unless otherwise stated
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

IGT Gate trigger current VD = 12 V; IT = 0.1 A - 5 35 mA Latching current VD = 12 V; IGT = 0.1 A - 25 80 mA Holding current VD = 12 V; IGT = 0.1 A - 20 60 mA On-state voltage IT = 30 A - 1.1 1.5 V
VGT Gate trigger voltage VD = 12 V; IT = 0.1 A - 0.6 1.0 V
VD = VDRM(max); IT = 0.1 A; Tj = 125 ˚C 0.25 0.4 - V
ID, IR Off-state leakage current VD = VDRM(max); VR = VRRM(max); Tj = 125 ˚C - 0.2 1.0 mA
DYNAMIC CHARACTERISTICS

Tj = 25 ˚C unless otherwise stated
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
D/dt Critical rate of rise of VDM = 67% V DRM(max); Tj = 125 ˚C; 200 500 - V/μs
off-state voltage exponential waveform; gate open circuit
tgt Gate controlled turn-on ITM = 40 A; VD = VDRM(max); IG = 0.1 A; - 2 - μstime dIG /dt = 5 A/μs Circuit commutated VD = 67% VDRM(max); Tj = 125 ˚C; - 70 - μs
turn-off time ITM = 50 A; VR = 25 V; dITM/dt = 30 A/μs;dVD /dt = 50 V/μs
Philips Semiconductors Product specification
Thyristors
BT145 series
Fig.1. Maximum on-state dissipation, Ptot, versus
average on-state current, IT(AV), where a = form
factor = IT(RMS)/ IT(AV).
Fig.2. Maximum permissible non-repetitive peak
on-state current ITSM, versus pulse width tp, for
sinusoidal currents, tp ≤ 10ms.
Fig.4. Maximum permissible non-repetitive peak
on-state current ITSM, versus number of cycles, for
sinusoidal currents, f = 50 Hz.
Fig.5. Maximum permissible repetitive rms on-state
current IT(RMS), versus surge duration, for sinusoidal
currents, f = 50 Hz; Tmb ≤ 101˚C. 5 10 15 200
IF(AV) / A
Ptot / W Tmb(max) / C
125 10 100 10000
Number of half cycles at 50Hz
10us 100us 1ms 10ms100
T / s
0.01 0.1 1 100
surge duration / s
-50 0 50 100 1500
Tmb / C
IT(RMS) / A
-50 0 50 100 1500.4
Tj / C
VGT(Tj)
VGT(25 C)
Philips Semiconductors Product specification
Thyristors
BT145 series
Fig.7. Normalised gate trigger current
IGT(Tj)/ IGT(25˚C), versus junction temperature Tj.
Fig.8. Normalised latching current IL(Tj)/ IL(25˚C),
versus junction temperature Tj.
Fig.9. Normalised holding current IH(Tj)/ IH(25˚C),
versus junction temperature Tj.
Fig.10. Typical and maximum on-state characteristic.
Fig.11. Transient thermal impedance Zth j-mb, versus
pulse width tp.
Fig.12. Typical, critical rate of rise of off-state voltage,
dVD/dt versus junction temperature Tj.
-50 0 50 100 1500
Tj / C
IGT(Tj)
IGT(25 C) 0.5 1 1.5 20
VT / V
IT / A
-50 0 50 100 1500
Tj / C
IL(Tj)
IL(25 C)
tp / s
Zth j-mb (K/W)
10us 0.1ms 1ms 10ms 0.1s 1s 10s
-50 0 50 100 1500
Tj / C
IH(Tj)
IH(25 C) 50 100 15010
Tj / C
dVD/dt (V/us)
Philips Semiconductors Product specification
Thyristors
BT145 series
MECHANICAL DATA

Dimensions in mm
Net Mass: 2 g
Fig.13. TO220AB; pin 2 connected to mounting base.
Notes

1. Refer to mounting instructions for TO220 envelopes.
2. Epoxy meets UL94 V0 at 1/8".
10,3
max3,0 max
not tinned
2,4
0,6
4,5
max
15,8max
1,3
2,54 2,54
13,5min
Philips Semiconductors Product specification
Thyristors
BT145 series
DEFINITIONS
Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values

Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and
operation of the device at these or at any other conditions above those given in the Characteristics sections of
this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information

Where application information is given, it is advisory and does not form part of the specification.
 Philips Electronics N.V. 1997
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the
copyright owner.
The information presented in this document does not form part of any quotation or contract, it is believed to be
accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under patent or other
industrial or intellectual property rights.
LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices or systems where malfunction of these
products can be reasonably expected to result in personal injury. Philips customers using or selling these products
for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting
from such improper use or sale.
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