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BSO350N03INFINEONN/a30000avaiLow Voltage MOSFETs


BSO350N03 ,Low Voltage MOSFETsapplications• Dual n-channel• Logic levelP-DSO-8• Excellent gate charge x R product (FOM)DS(on)• Ve ..
BSO4410 ,Low Voltage MOSFETsapplicationsType Package Ordering Code MarkingBSO4410 SO 8 Q67042-S40964410Maximum Ratings,at T = ..
BSO4410 . ,Low Voltage MOSFETsCharacteristicsV 30 - - VDrain-source breakdown voltage(BR)DSSV =0V, I =1mAGS D1.2 1.6 2Gate thresh ..
BSO4420 ,Low Voltage MOSFETsCharacteristics30 - - VDrain-source breakdown voltage V(BR)DSSV =0V, I =1mAGS D1.2 1.6 2Gate thresh ..
BSO4804 ,Low Voltage MOSFETsFeatureV30 VDS

BSO350N03
Low Voltage MOSFETs
CP""''"
Infineon
lechnologies
BSO350N03
optiMosh Power-Transistor
Product Summary
Features VDS 30 V
. Fast switching MOSFET for SMPS RDSWmax 35 m Q
. Optimized technology for notebook DC/DC l 6 A
. Qualified according to JEDEC1 for target applications
. Dual n-channel
. Logic level
. Excellent gate charge x RDSM product (FOM) P-DSO-8
. Very low on-resistance R DS(on)
. Avalanche rated
. dv/dt rated
Type Package Ordering Code Marking ''11liiiiee-j,ij7y/,,1
BSO350N03 P-DSO-8 Q67042-S4217 350N3 :3 :57}; r: 'ld
Maximum ratings, at Tj=25 "C, unless otherwise specified
Parameter Symbol Conditions Value Unit
10 secs steady state
Continuous drain current ID TA=25 002) 6 5 A
TA=7O oc2) 4.8 4
Pulsed drain current I Mum TA=25 °C3) 24
Avalanche energy, single pulse EAS /D=6 A, Rss=25 Q 8 m]
ID=6 A, VDS=20 V,
Reverse diode dv/dt dv/dt dildt=200 Alps, 6 kV/ps
Tj,max=150 °C
Gate source voltage VGS $20 V
Power dissipation Ptot TA=25 oc') 2.0 1.4 W
Operating and storage temperature Tj, Tsta -55 ... 150 'C
IEC climatic category; DIN IEC 68-1 55/150/56
Rev. 1.11 page 1 2004-02-09
CP""''"
Infineon
lechnologies
BSO350N03
Parameter Symbol Conditions Values Unit
min. typ. max.
Thermal characteristics
Thermal resistance,
junction - soldering point Rmos - - 50 KAN
Thermal resistance, R minimal footprint, - - 110
junction - ambient thJA tps10 s
minimal footprint, - - 150
steady state
6 cm2 cooling area'", - - 63
tps10 s
6 cm2 cooling areaz), - - 90
steady state
Electrical characteristics, at Tr=25 ''C, unless otherwise specified
Static characteristics
Drain-source breakdown voltage V(BR)DSS VGS=O V, I D=1 mA 30 - - V
Gate threshold voltage Vsath) VDS=VGS, ID=6 pA 1.2 1.6 2
V =30 V, V =0 V,
Zero gate voltage drain current loss T3825 0 C GS - 0.1 1 HA
VDS=30 V, VGS=0 V,
Tr=125 "C - 10 100
Gate-source leakage current less Vss=20 V, VDS=0 V - 10 100 nA
Drain-source on-state resistance Roswn, VGS=4.5 V, I D=5 A - 42 52 m9
Vss=10 V, ID=6 A - 29 35
Gate resistance Rs - 0.8 - 9
V >2 I R ,
Transconductance " ll 32' A I DI DS(on)max 6 12 - S
“J-STDZO and JESD22
2) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 pm thick) copper area for drain
connection. PCB is vertical in still air.
3) See figure 3
Rev.1.11
page 2
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