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BCW31KECN/a211avaiSMD Small Signal Transistor NPN Low Noise
BCW32NXPN/a950avaiSurface mount Si-Epitaxial PlanarTransistors
BCW33NXP/PHILIPSN/a3000avaiNPN general purpose transistors


BCW33 ,NPN general purpose transistors
BCW33 ,NPN general purpose transistorsFEATURES PINNING• Low current (100 mA)PIN DESCRIPTION• Low voltage (32 V).1 base2 emitter
BCW33 ,NPN general purpose transistors
BCW33 ,NPN general purpose transistors
BCW33 ,NPN general purpose transistors
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BCW31-BCW32-BCW33
NPN general purpose transistors

NXP Semiconductors Product data sheet
NPN general purpose transistors BCW31; BCW32;
BCW33
FEATURES
Low current (100 mA) Low voltage (32 V).
APPLICATIONS
General purpose switching and amplification.
DESCRIPTION

NPN transistors in a plastic SOT23 package.
PNP complements: BCW29 and BCW30.
MARKING
Note
* = p : Made in Hong Kong.
* = t : Made in Malaysia.
* = W : Made in China.
ORDERING INFORMATION
LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134).
NXP Semiconductors Product data sheet
NPN general purpose transistors BCW31; BCW32; BCW33
THERMAL CHARACTERISTICS
Note
Transistor mounted on an FR4 printed-circuit board.
CHARACTERISTICS

Tj = 25 °C unless otherwise specified.
NXP Semiconductors Product data sheet
NPN general purpose transistors BCW31; BCW32; BCW33
PACKAGE OUTLINE
NXP Semiconductors Product data sheet
NPN general purpose transistors BCW31; BCW32; BCW33
DATA SHEET STATUS
Notes
Please consult the most recently issued document before initiating or completing a design. The product status of device(s) described in this document may have changed since this document was published
and may differ in case of multiple devices. The latest product status information is available on the Internet at
URL http://.
DISCLAIMERS
General ⎯ Information in this document is believed to be

accurate and reliable. However, NXP Semiconductors
does not give any representations or warranties,
expressed or implied, as to the accuracy or completeness
of such information and shall have no liability for the
consequences of use of such information.
Right to make changes ⎯ NXP Semiconductors

reserves the right to make changes to information
published in this document, including without limitation
specifications and product descriptions, at any time and
without notice. This document supersedes and replaces all
information supplied prior to the publication hereof.
Suitability for use ⎯ NXP Semiconductors products are

not designed, authorized or warranted to be suitable for
use in medical, military, aircraft, space or life support
equipment, nor in applications where failure or malfunction
of an NXP Semiconductors product can reasonably be
expected to result in personal injury, death or severe
property or environmental damage. NXP Semiconductors
accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at
the customer’s own risk.
Applications ⎯ Applications that are described herein for

any of these products are for illustrative purposes only.
NXP Semiconductors makes no representation or
warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values ⎯ Stress above one or more limiting

values (as defined in the Absolute Maximum Ratings
System of IEC 60134) may cause permanent damage to
the device. Limiting values are stress ratings only and
operation of the device at these or any other conditions
above those given in the Characteristics sections of this
document is not implied. Exposure to limiting values for
extended periods may affect device reliability.
Terms and conditions of sale ⎯ NXP Semiconductors

products are sold subject to the general terms and
conditions of commercial sale, as published at
http:///profile/terms, including those
pertaining to warranty, intellectual property rights
infringement and limitation of liability, unless explicitly
otherwise agreed to in writing by NXP Semiconductors. In
case of any inconsistency or conflict between information
in this document and such terms and conditions, the latter
will prevail.
No offer to sell or license ⎯ Nothing in this document

may be interpreted or construed as an offer to sell products
that is open for acceptance or the grant, conveyance or
implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control ⎯ This document as well as the item(s)

described herein may be subject to export control
regulations. Export might require a prior authorization from
national authorities.
Quick reference data ⎯ The Quick reference data is an

extract of the product data given in the Limiting values and
Characteristics sections of this document, and as such is
not complete, exhaustive or legally binding.
Contact information
For additional information please visit: http://
For sales offices addresses send e-mail to:
© NXP B.V. 2009
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Customer notification

This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal
definitions and disclaimers. No changes were made to the technical content, except for package outline
drawings which were updated to the latest version.
Printed in The Netherlands R75/05/pp6 Date of release: 2004 Feb 06 Document order number: 9397 750 12404
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