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BC868NXP/PHILIPSN/a1380avai20 V, 2 A NPN medium power transistor
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BC868-BC868-25-BCP6825-BCP68-25
20 V, 2 A NPN medium power transistor
1. Product profile
1.1 General description

NPN medium power transistor series in Surface-Mounted Device (SMD) plastic packages.
[1] Valid for all available selection groups.
1.2 Features and benefits
High current Two current gain selections High power dissipation capability Exposed heatsink for excellent thermal and electrical conductivity (SOT89, SOT1061) Leadless very small SMD plastic package with medium power capability (SOT1061) AEC-Q101 qualified
1.3 Applications

1.4 Quick reference data

BCP68; BC868; BC68PA
20 V , 2 A NPN medium power transistors
Rev. 8 — 18 October 2011 Product data sheet
Table 1. Product overview

BCP68 SOT223 SC-73 - BCP69
BC868 SOT89 SC-62 TO-243 BC869
BC68PA SOT1061 - - BC69PA Linear voltage regulators  Power management Low-side switches  MOSFET drivers Battery-driven devices  Amplifiers
Table 2. Quick reference data

VCEO collector-emitter voltage open base - - 20 V collector current - - 2 A
ICM peak collector current single pulse; tp 1ms - - 3 A
NXP Semiconductors BCP68; BC868; BC68PA
20 V, 2 A NPN medium power transistors

[1] Pulse test: tp 300 s; = 0.02.
2. Pinning information

hFE DC current gain VCE =1V; IC =500 mA [1] 85 - 375
hFE selection -25 VCE =1V; IC =500 mA [1] 160 - 375
Table 2. Quick reference data …continued
Table 3. Pinning
SOT223
SOT89
SOT1061
NXP Semiconductors BCP68; BC868; BC68PA
20 V, 2 A NPN medium power transistors
3. Ordering information

[1] Valid for all available selection groups.
4. Marking

Table 4. Ordering information

BCP68 SC-73 plastic surface-mounted package with increased
heatsink; 4 leads
SOT223
BC868 SC-62 plastic surface-mounted package; exposed die pad for
good heat transfer; 3 leads
SOT89
BC68PA HUSON3 plastic thermal enhanced ultra thin small outline
package; no leads; 3 terminals; body 2 2 0.65 mm
SOT1061
Table 5. Marking codes

BCP68 BCP68
BCP68-25 BCP68/25
BC868 CAC
BC868-25 CDC
BC68PA AR
BC68-25PA AS
NXP Semiconductors BCP68; BC868; BC68PA
20 V, 2 A NPN medium power transistors
5. Limiting values

[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2.
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm2.
[4] Device mounted on an FR4 PCB, 4-layer copper, tin-plated and standard footprint.
[5] Device mounted on an FR4 PCB, 4-layer copper, tin-plated, mounting pad for collector 1 cm2.
Table 6. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).
VCBO collector-base voltage open emitter - 32 V
VCEO collector-emitter voltage open base - 20 V
VEBO emitter-base voltage open collector - 5 V collector current - 2 A
ICM peak collector current single pulse;  1ms A base current - 0.4 A
IBM peak base current single pulse;  1ms
-0.4 A
Ptot total power dissipation Tamb25C
BCP68 [1] -0.65 W
[2] -1.00 W
[3] -1.35 W
BC868 [1] -0.50 W
[2] -0.95 W
[3] -1.35 W
BC68PA [1] -0.42 W
[2] -0.83 W
[3] -1.10 W
[4] -0.81 W
[5] -1.65 W junction temperature - 150 C
Tamb ambient temperature 55 +150 C
Tstg storage temperature 65 +150 C
NXP Semiconductors BCP68; BC868; BC68PA
20 V, 2 A NPN medium power transistors

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