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ADP3522ACP-3-REEL-ADP3522ACP-3-REEL7
GSM Power Management System
REV.0
GSM Power Management System
FEATURES
Handles all GSM Baseband Power Management
6 LDOs Optimized for Specific GSM Subsystems
Li-Ion Battery Charge Function
Optimized for the AD20msp430 Baseband Chipset
Reduced Package Size: 5 mm � 5 mm LFCSP-32
APPLICATIONS
GSM/GPRS Handsets
FUNCTIONAL BLOCK DIAGRAM
GENERAL DESCRIPTIONThe ADP3522 is a multifunction power system chip optimized
for GSM/GPRS handsets, especially those based on the Analog
Devices AD20msp430 system solution with 1.8 V digital
baseband processors, such as the AD6525, AD6526, and
AD6528. It contains six LDOs, one to power each of the critical
GSM subblocks. Sophisticated controls are available for power-
up during battery charging, keypad interface, and RTC alarm.
The charge circuit maintains low current charging during the
initial charge phase and provides an end of charge (EOC) signal
when a Li-Ion battery is being charged. This product also meets
the market trend of reduced size with a new LFCSP package.
Its footprint is only 5 mm � 5 mm and yet offers excellent ther-
mal performance due to the exposed die attached paddle.
The ADP3522 is specified over the temperature range of
–20°C to +85°C.
ADP3522–SPECIFICATIONS
ELECTRICAL CHARACTERISTICS1PWRONKEY INPUT PULL-UP
(–20�C < TA < +85�C, VBAT = VBAT2 = 3 V–5.5 V, CVSIM = CVCORE = CVAN =
CVMEM = 2.2 �F, VTCXO = 0.22 �F, CVRTC = 0.1 �F, CVBAT = 10 �F, minimum
loads applied on all outputs, unless otherwise noted.)
ADP3522RTC LDO
REAL-TIME CLOCK LDO/
COIN CELL CHARGER (VRTC)
ANALOG LDO (VAN)
ADP3522
ELECTRICAL CHARACTERISTICS1
(–20�C < TA < +85�C, VBAT = VBAT2 = 3 V–5.5 V, CVSIM = CVCORE = CVAN = CVMEM =
2.2 �F, VTCXO = 0.22 �F, CVRTC = 0.1 �F, CVBAT = 10 �F, minimum loads applied on
all outputs, unless otherwise noted.)RESET GENERATOR (RESET)
ADP3522NOTESAll limits at temperature extremes are guaranteed via correlation using standard Statistical Quality Control (SQC) methods.This feature is intended to protect against catastrophic failure of the device. Maximum allowed operating junction temperature is 125ºC. Operation beyond 125ºC
could cause permanent damage to the device.No isolation diode is present between the charger input and the battery.Delay set by external capacitor on the RESCAP pin.
Specifications subject to change without notice.
ADP3522
CAUTIONESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
ADP3522 features proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended
to avoid performance degradation or loss of functionality.
ABSOLUTE MAXIMUM RATINGS*Voltage on Any Pin with Respect to
Any GND Pin . . . . . . . . . . . . . . . . . . . . . . .–0.3 V to +10 V
Voltage on Any Pin May Not Exceed VBAT, with the Following
Exceptions: CHRIN, BASE, ISENSE
Storage Temperature Range . . . . . . . . . . . . .–65∞C to +150∞C
Operating Ambient Temperature Range . . . . .–20∞C to +85∞C
Maximum Junction Temperature . . . . . . . . . . . . . . . . .125∞C
�JA, Thermal Impedance (LFCSP 5 mm � 5 mm)
4-Layer JEDEC PCB . . . . . . . . . . . . . . . . . . . . . . . . . .32∞C/W
2-Layer SEMI PCB . . . . . . . . . . . . . . . . . . . . . . . . . .108∞C/W
Lead Temperature Range (Soldering, 60 sec.) . . . . . . . .300∞C
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Absolute maximum
ratings apply individually only, not in combination. Unless otherwise specified all
other voltages are referenced to GND.
PIN CONFIGURATION
ORDERING GUIDE
ModelADP3522ACP-3
ADP3522ACP-1.8
PIN FUNCTION DESCRIPTIONS
Pin17, 24, 32
TPC1.Ground Current vs.
Battery Voltage
TPC4.Dropout Voltage vs.
Load Current
TPC7.Line Transient
Response, Minimum Loads
TPC2.RTC I/V Characteristic
TPC5.Line Transient
Response, Minimum Loads
TPC 8. Line Transient
Response, Maximum Loads
TPC 3. VRTC Reverse Leakage
Current vs. Temperature
TPC6.Line Transient
Response, Maximum Loads
TPC 9.VTCXO Load Step
ADP3522TPC 10. VSIM Load Step
TPC 13.VAN Load Step
TPC 16. Turn On Transient
by PWRONIN, Minimum
Load (Part 3)
TPC 11.VMEM Load Step
TPC 14.Turn On Transient
by PWRONIN, Minimum
Load (Part 1)
TPC 17. Turn On Transient
by PWRONIN, Minimum
Load (Part 4)
TPC 12.VCORE Load Setup
TPC 15.Turn On Transient
by PWRONIN, Minimum
Load (Part 2)
TPC 18. Turn On Transient
by PWRONIN, Maximum
Load (Part 1)
TPC 19.Turn On Transient
by PWRONIN, Maximum
Load (Part 2)
TPC 22.Ripple Rejection vs.
Frequency
TPC 25.Charger VOUT vs.
Temperature, VIN = 5.0V,
ILOAD = 10 mA
TPC 20.Turn On Transient
by PWRONIN, Maximum
Load (Part 3)
TPC 23.Ripple Rejection vs.
Battery Voltage
TPC 26.Charger VOUT vs.
ILOAD (VIN = 5.0V)
TPC 21.Turn On Transient
by PWRONIN, Maximum
Load (Part 4)
TPC 24.Output Noise Density
TPC 27. Charger VOUT vs. VIN
ADP3522
Table I. LDO Control Logic*The state of MVBAT is determined by TCXOEN. When TCXOEN is high, MVBAT is ON.
