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ADP3335ARM-2.5-RL-ADP3335ARMZ-2.5RL7-ADP3335ARMZ-3.3-RL-ADP3335ARMZ-5-R7
High Accuracy Ultralow Quiescent Current, 500mA, anyCAP® Low Dropout
High Accuracy, Ultralow IQ, 500 mA,
anyCAP® Low Dropout Regulator
Rev. A
FEATURES
High accuracy over line and load: ±0.9% @ 25°C,
±1.8% over temperature
Ultralow dropout voltage: 200 mV (typ) @ 500 mA
Requires only CO = 1.0 µF for stability
anyCAP = stable with any type of capacitor
(Including MLCC)
Current and thermal limiting
Low noise
Low shutdown current: < 10 nA (typ)
2.6 V to 12 V supply range
–40°C to +85°C ambient temperature range
APPLICATIONS
PCMCIA cards
Cellular phones
Camcorders, cameras
Networking systems, DSL/cable modems
Cable set-top box
MP3/CD players
DSP supplies
FUNCTIONAL BLOCK DIAGRAM INOUT
GND00147-0-001Figure 1.
OFF
VINVOUTCOUT
1µFFigure 2. Typical Application Circuit
GENERAL DESCRIPTION The ADP3335 is a member of the ADP333x family of precision,
low dropout, anyCAP voltage regulators. It operates with an
input voltage range of 2.6 V to 12 V, and delivers a continuous
load current up to 500 mA. The ADP3335 stands out from
conventional low dropout regulators (LDOs) by using an
enhanced process enabling it to offer performance advantages
beyond its competition. Its patented design requires only a
1.0 µF output capacitor for stability. This device is insensitive to
output capacitor equivalent series resistance (ESR), and is stable
with any good quality capacitor—including ceramic (MLCC)
types for space-restricted applications. The ADP3335 achieves
exceptional accuracy of ±0.9% at room temperature and ±1.8%
over temperature, line, and load.
The dropout voltage of the ADP3335 is only 200 mV (typical) at
500 mA. This device also includes a safety current limit, thermal
overload protection, and a shutdown feature. In shutdown
mode, the ground current is reduced to less than 1 µA. The
ADP3335 has a low quiescent current of 80 µA (typical) in light
load situations.
TABLE OF CONTENTS Specifications.....................................................................................3
Absolute Maximum Ratings............................................................4
Pin Configuration and Function Descriptions.............................5
Typical Performance Characteristics.............................................6
Theory of Operation........................................................................9
Application Information................................................................10
Output Capacitor Selection.......................................................10
Input Bypass Capacitor..............................................................10
Noise Reduction.........................................................................10
Thermal Overload Protection..................................................10
Calculating Junction Temperature...........................................10
Printed Circuit Board Layout Considerations........................11
LFCSP Layout Considerations..................................................11
Shutdown Mode.........................................................................11
Outline Dimensions.......................................................................12
Ordering Guide..........................................................................13
REVISION HISTORY
1/04 changed from Rev. 0 to Rev. A Format updated...............................................................Universal
Renumbered figures.......................................................Universal
Removed Figure 22.......................................................................6
Change to Printed Circuit Board
Layout Considerations section..................................................11
Added LFCSP Layout Considerations section........................11
Added Package Drawing................................................Universal
Changes to Ordering Guide......................................................16
SPECIFICATIONSAll limits at temperature extremes are guaranteed via correlation using standard statistical quality control (SQC) methods. Ambient
temperature of 85°C corresponds to a junction temperature of 125°C under pulsed full-load test conditions. Application stable with no
load. V = 6.0 V, C = C = 1.0 µF, T = –40°C to +85°C, unless otherwise noted. ININOUTA
Table 1. VIN = 2.6 V to 12 V for models with VOUT(NOM) ≤ 2.2 V.
ABSOLUTE MAXIMUM RATINGS
Table 2. Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
PIN CONFIGURATIONS AND FUNCTIONAL DESCRIPTIONS
OUT1
OUT2
OUT3
GND400147-0-022 Figure 3. 8-Lead MSOP
TOP VIEW
(Not to Scale)
ADP3335
OUT
OUT
OUT
GND00147-0-025 Figure 4. 8-Lead LFCSP
Table 3. Pin Function Descriptions TYPICAL PERFORMANCE CHARACTERISTICS
TA = 25°C, unless otherwise noted INPUT VOLTAGE (V)
OUTPUT VOLTAGE (V)
24681012
Figure 5. Line Regulation Output Voltage vs. Supply Voltage
LOAD CURRENT (mA)
OUTPUT VOLTAGE (V)100200300400500
Figure 6. Output Voltage vs. Load Current
INPUT VOLTAGE (V)
GROUND CURRENT (681012 Figure 7. Ground Current vs. Supply Voltage
LOAD CURRENT (mA)
GROUND CURRE
NT (
100200300400500 Figure 8. Ground Current vs. Load Current
JUNCTION TEMPERATURE (°C)
OUTP
UT CHANGE
(%)
–15525
Figure 9. Output Voltage Variation vs. Junction Temperature
JUNCTION TEMPERATURE (°C)
GROUND CURRE
NT (mA)
–15525
Figure 10. Ground Current vs. Junction Temperature
OUTPUT (mA)
POU
VOLTA
E (4005000
100200300
Figure 11. Dropout Voltage vs. Output Current
TIME (sec)
INPUT/OUTPUT VOLTAGE (V) Figure 12. Power-Up/Power-Down
TIME (µs)
(V
OUT
(V Figure 13. Power-Up Response
TIME (µs)
OUT
(V
(VFigure 14. Line Transient Response
TIME (µs)
OUT
(V
(V Figure 15. Line Transient Response
TIME (µs)
ILOAD
(mA)
OUT Figure 16. Load Transient Response
TIME (µs)
ILOAD
(mA)
OUT
(V Figure 17. Load Transient Response
TIME (µs)
LOAD
(A)
OUT
(V Figure 18. Short-Circuit Current
TIME (µs)
OUT Figure 19. Turn On/Turn Off Response
FREQUENCY (Hz)
RIP
RE
CTION (dB)1k10k100k1M10M
100
Figure 20. Power Supply Ripple Rejection
CL (µF)
S NOISE (
1020304050 Figure 21. RMS Noise versus CL (10 Hz to 100 kHz)
FREQUENCY (Hz)
VOLTA
GE N
ISE SPEC
ITY
V/ H1k10k100k1M100 Figure 22. Output Noise Density
