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ADM3485EAN-ADM3485EAR
ESD Protected, EMC Compliant, 3.3 V, 20 Mbps, EIA RS-485 Transceiver
REV.A
ESD Protected, EMC Compliant, 3.3 V,
20 Mbps, EIA RS-485 Transceiver
FUNCTIONAL BLOCK DIAGRAM
FEATURES
Operates with +3.3 V Supply
ESD Protection: 8 kV Meets IEC1000-4-2
EFT Protection: 2 kV Meets IEC1000-4-4
EIA RS-422 and RS-485 Compliant Over Full CM Range
19 k� Input Impedance
Up to 50 Transceivers on Bus
20 Mbps Data Rate
Short Circuit Protection
Specified Over Full Temperature Range
Thermal Shutdown
Interoperable with 5 V Logic
1 mA Supply Current
2 nA Shutdown Current
8 ns Skew
APPLICATIONS
Telecommunications
DTE-DCE Interface
Packet Switching
Local Area Networks
Data Concentration
Data Multiplexers
Integrated Services Digital Network (ISDN)
AppleTalk
Industrial Controls
GENERAL DESCRIPTIONThe ADM3485E is a low power differential line transceiver
designed to operate using a single +3.3 V power supply. Low
power consumption makes it ideal for power sensitive applica-
tions. It is suitable for communication on multipoint bus trans-
mission lines. Internal protection against electrostatic discharge
(ESD) and electrical fast transient (EFT) allows operation in
electrically harsh environments.
It is intended for balanced data transmission and complies with
both EIA Standards RS-485 and RS-422. It contains a differen-
tial line driver and a differential line receiver, and is suitable for
half duplex data transfer.
The input impedance is 19 kΩ allowing up to 50 transceivers to
be connected on the bus.
Excessive power dissipation caused by bus contention or by
output shorting is prevented by a thermal shutdown circuit.
This feature forces the driver output into a high impedance
state if, during fault conditions, a significant temperature
increase is detected in the internal driver circuitry.
The receiver contains a fail-safe feature that results in a
logic high output state if the inputs are unconnected
(floating).
The ADM3485E is fabricated on BiCMOS, an advanced
mixed technology process combining low power CMOS
with fast switching bipolar technology.
The ADM3485E is fully specified over the industrial tem-
perature range and is available in 8-lead DIP and SOIC
packages.
ADM3485E–SPECIFICATIONS(VCC = +3.3 V � 0.3 V. All specifications TMIN to TMAX unless otherwise noted.)Specifications subject to change without notice.
TIMING SPECIFICATIONSSpecifications subject to change without notice.
(VCC = +3.3 V, TA = +25�C)
TIMING SPECIFICATIONSSpecifications subject to change without notice.
(VCC = +3.3 V � 0.3 V, TA = TMIN to TMAX)
ADM3485E
ORDERING GUIDE
ABSOLUTE MAXIMUM RATINGS*(TA = +25°C unless otherwise noted)
VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +7 V
Inputs
Driver Input (DI) . . . . . . . . . . . . . . . . –0.3 V to VCC + 0.3 V
Control Inputs (DE, RE) . . . . . . . . . . –0.3 V to VCC + 0.3 V
Receiver Inputs (A, B) . . . . . . . . . . . . . . . –7.5 V to +12.5 V
Outputs
Driver Outputs . . . . . . . . . . . . . . . . . . . . . –7.5 V to +12.5 V
Receiver Output . . . . . . . . . . . . . . . . . –0.5 V to VCC + 0.5 V
Power Dissipation 8-Lead DIP . . . . . . . . . . . . . . . . . 800 mW
θJA, Thermal Impedance . . . . . . . . . . . . . . . . . . . . 140°C/W
Power Dissipation 8-Lead SOIC . . . . . . . . . . . . . . . . 650 mW
θJA, Thermal Impedance . . . . . . . . . . . . . . . . . . . . 115°C/W
Operating Temperature Range
Industrial (A Version) . . . . . . . . . . . . . . . . –40°C to +85°C
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Lead Temperature (Soldering, 10 sec) . . . . . . . . . . . .+300°C
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . .+215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . .. +220°C
ESD Rating:Air (Human Body Model, All Pins) . . . . . >4 kV
ESD Rating:IEC1000-4-2 Contact (A, B Pins) . . . . . . >8 kV
EFT Rating:IEC1000-4-4 (A, B Pins) . . . . . . . . . . . . . >2 kV
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute maximum ratings for
extended periods of time may affect device reliability.
PIN CONFIGURATION
DIP/SOIC
PIN FUNCTION DESCRIPTIONS
Test CircuitsFigure 1.Driver Voltage Measurement Test Circuit
Figure 2.Driver Enable/Disable Test Circuit
Figure 3.Driver Differential Output Delay Test Circuit
Figure 4.Driver/Receiver Propagation Delay Test Circuit
Figure 5.Driver Voltage Measurement Test Circuit 2
Figure 6.Receiver Enable/Disable Test Circuit
Figure 7.Driver Propagation Delay Test Circuit
Figure 8.Receiver Propagation Delay Test Circuit
ADM3485EFigure 9.Driver Propagation Delay, Rise/Fall Timing
Figure 10.Receiver Propagation Delay
Switching CharacteristicsFigure 11.Driver Enable/Disable Timing
Figure 12.Receiver Enable/Disable Timing
