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ADG333ABN-ADG333ABR-ADG333ABRS
Quad SPDT Switch
FUNCTIONAL BLOCK DIAGRAMREV.0
Quad SPDT Switch
FEATURES
44 V Supply Maximum Ratings
VSS to VDD Analog Signal Range
Low On Resistance (45 V max)
Low ΔRON (5 V max)
Low RON Match (4 V max)
Low Power Dissipation
Fast Switching Times
tON < 175 ns
tOFF < 145 ns
Low Leakage Currents (5 nA max)
Low Charge Injection (10 pC max)
Break-Before-Make Switching Action
APPLICATIONS
Audio and Video Switching
Battery Powered Systems
Test Equipment
Communication Systems
GENERAL DESCRIPTIONThe ADG333A is a monolithic CMOS device comprising four
independently selectable SPDT switches. It is designed on an2MOS process which provides low power dissipation yet
achieves a high switching speed and a low on resistance.
The on resistance profile is very flat over the full analog input
range ensuring good linearity and low distortion when switching
audio signals. High switching speed also makes the part suitable
for video signal switching. CMOS construction ensures ultralow
power dissipation making the part ideally suited for portable,
battery powered instruments.
When they are ON, each switch conducts equally well in both
directions and has an input signal range which extends to the
power supplies. In the OFF condition, signal levels up to the
supplies are blocked. All switches exhibit break-before-make
switching action for use in multiplexer applications. Inherent in
the design is low charge injection for minimum transients when
switching the digital inputs.
PRODUCT HIGHLIGHTSExtended Signal Range
The ADG333A is fabricated on an enhanced LC2MOS
process, giving an increased signal range which extends
to the supply rails.Low Power DissipationLow RONSingle Supply Operation
For applications where the analog signal is unipolar,
the ADG333A can be operated from a single rail power
supply. The part is fully specified with a single +12 V
supply.
ADG333A–SPECIFICATIONS1
DUAL SUPPLYANALOG SWITCH
POWER REQUIREMENTS
NOTESTemperature range is as follows: B Version: –40°C to +85°C.Guaranteed by design, not subject to production test.
Specifications subject to change without notice.
(VDD = +15 V, VSS = –15 V, GND = 0 V, unless otherwise noted)
SINGLE SUPPLYANALOG SWITCH
POWER REQUIREMENTS
NOTESTemperature range is as follows: B Version: –40°C to +85°C.Guaranteed by design, not subject to production test.
Specifications subject to change without notice.
ADG333A
(VDD = +12 V, VSS = 0 V 6 10%, GND = 0 V, unless otherwise noted)
ADG333A
ABSOLUTE MAXIMUM RATINGS1(TA = +25°C unless otherwise noted)
VDD to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+44 V
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . .–0.3 V to +30 V
VSS to GND . . . . . . . . . . . . . . . . . . . . . . . . . .+0.3 V to –30 V
Analog, Digital Inputs2 . . . . . . . . . . . .VSS – 2 V to VDD + 2 V
. . . . . . . . . . . . . . . . . . . . . .or 20 mA, Whichever Occurs First
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . .20 mA
Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . .40 mA
(Pulsed at 1 ms, 10% Duty Cycle Max)
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . .–40°C to +85°C
Storage Temperature Range . . . . . . . . . . . .–65°C to +125°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . .+150°C
Plastic Package
θJA, Thermal Impedance . . . . . . . . . . . . . . . . . . . .103°C/W
Lead Temperature, Soldering (10 sec) . . . . . . . . . .+260°C
SOIC Package
θJA, Thermal Impedance . . . . . . . . . . . . . . . . . . . . .74°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . .+215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . .+220°C
SSOP Package
θJA, Thermal Impedance . . . . . . . . . . . . . . . . . . . .130°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . .+215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . .+220°C
NOTES
1Stresses above those listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions above those listed in the
operational sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Only one absolute maximum rating may be applied at any one time.
2Overvoltages at IN, S or D will be clamped by internal diodes. Current should be
limited to the maximum ratings given.
CAUTIONESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the ADG333A features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
ORDERING GUIDEADG333ABR
*N = Plastic DIP, R = Small Outline IC (SOIC). RS = Shrink Small Outline
Package (SSOP).
Table I.Truth Table
TERMINOLOGYSource Terminal. May be an input or output.Drain Terminal. May be an input or output.Logic Control Input.
RONOhmic resistance between D and S.
ΔRONRON variation due to a change in the analog
input voltage with a constant load current.
RON MatchDifference between the RON of any two
channels.
IS (OFF)Source leakage current with the switch
“OFF.”
ID (OFF)Drain leakage current with the switch
“OFF.”
ID, IS (ON)Channel leakage current with the switch
“ON.”
VD (VS)Analog voltage on terminals D, S.
CS (OFF)“OFF” Switch Source Capacitance.
CD (OFF)“OFF” Switch Drain Capacitance.
CD, CS (ON)“ON” Switch Capacitance.
tONDelay between applying the digital control in-
put and the output switching on.
tOFFDelay between applying the digital control in-
put and the output switching off.
tOPENBreak Before Make delay when switches are
configured as a multiplexer.
VINLMaximum input voltage for logic “0.”
VINHMinimum input voltage for logic “1.”
IINL (IINH)Input current of the digital input.
CrosstalkA measure of unwanted signal which is
coupled through from one channel to another
as a result of parasitic capacitance.
Off IsolationA measure of unwanted signal coupling
through an “OFF” switch.
Charge InjectionA measure of the glitch impulse transferred
from the digital input to the analog output
during switching.
PIN CONFIGURATION
DIP/SOIC/SSOP
NC = NO CONNECT
IN1
S4B
S4A
IN4
S1A
S1B
S3B
VDDVSS
GND
S2B
S2A
IN2IN3
S3A
VD, VS – Volts
– –15–1015–50510Figure 1.RON as a Function of VD
(VS): Dual Supply
VD, VS – Volts
–
10003156912Figure 2.RON as a Function of VD (VS):
Single Power Supply
–15–1015–50510
VD, VS – Volts
– Figure 3.RON as a Function of VD (VS)
for Different Temperatures: Dual
Supply
03156912
VD, VS – Volts
– Figure 4.RON as a Function of VD (VS)
for Different Temperatures: Single
Supply
LEAKAGE CURRENT – nA
VD, VS – VoltsFigure 5.Leakage Currents as a
Function of VD (VS): Dual Supply
LEAKAGE CURRENT – nA
VD, VS – VoltsFigure 6.Leakage Currents as a
Function of VD (VS): Single Supply
VS – Volts
Q – pC
–15–1015–50510Figure 7.Charge Injection as a
Function of VS
Figure 8.Switching Time as a
Function of VDD
Figure 9.IDD as a Function of
Switching Frequency
ADG333A–Typical Performance Graphs
