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AD9777BSVADIN/a200avai16-Bit, 160 MSPS 2X/4X/8X Interpolating Dual TxDAC+ D/A Converter


AD9777BSV ,16-Bit, 160 MSPS 2X/4X/8X Interpolating Dual TxDAC+ D/A Converterfeatures the ability to perform f /2, f /4, and f /8S S S2. Direct IF transmission is possible for ..
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AD9777BSV
16-Bit, 160 MSPS 2X/4X/8X Interpolating Dual TxDAC+ D/A Converter
REV.0
16-Bit, 160 MSPS 2�/4�/8�
Interpolating Dual TxDAC+ D/A Converter
FEATURES
16-Bit Resolution, 160/400 MSPS Input/Output Data Rate
Selectable 2�/4�/8� Interpolating Filter
Programmable Channel Gain and Offset Adjustment
fS/4, fS/8 Digital Quadrature Modulation
Capability
Direct IF Transmission Mode for 70 MHz + IFs
Enables Image Rejection Architecture
Fully Compatible SPI Port
Excellent AC Performance
SFDR –73 dBc @ 2 MHz–35 MHz
WCDMA ACPR 71 dB @ IF = 71 MHz
Internal PLL Clock Multiplier
Selectable Internal Clock Divider
Versatile Clock Input
Differential/Single-Ended Sine Wave or
TTL/CMOS/LVPECL Compatible
Versatile Input Data Interface
Two’s Complement/Straight Binary Data Coding
Dual-Port or Single-Port Interleaved Input Data
Single 3.3 V Supply Operation
Power Dissipation: Typical 1.2 W @ 3.3 V
On-Chip 1.2 V Reference
80-Lead Thermally Enhanced TQFP Package
FUNCTIONAL BLOCK DIAGRAM
GENERAL DESCRIPTION

The AD9777 is the 16-bit member of the AD977x pin compatible,
high performance, programmable 2×/4×/8× interpolating TxDAC+
family. The AD977x family features a serial port interface (SPI)
providing a high level of programmability, thus allowing for
enhanced system level options. These options include: selectable
2×/4×/8× interpolation filters; fS/2, fS/4, or fS/8 digital quadrature
modulation with image rejection; a direct IF mode; programmable
channel gain and offset control; programmable internal clock
divider; straight binary or two’s complement data interface; and
a single-port or dual-port data interface.
The selectable 2×/4×/8× interpolation filters simplify the require-
ments of the reconstruction filters while simultaneously enhancing
the TxDAC+ family’s pass-band noise/distortion performance.
The independent channel gain and offset adjust registers allow
the user to calibrate LO feedthrough and sideband suppression
(continued on page 2)
APPLICATIONS
Communications
Analog Quadrature Modulation Architectures
3G, Multicarrier GSM, TDMA, CDMA Systems
Broadband Wireless, Point-to-Point Microwave Radios
Instrumentation/ATE

TxDAC+ is a registered trademark of Analog Devices, Inc.
*. Patent Numbers, 5568145, 5689257, and 5703519. Other patents pending.
AD9777
(continued from page 1)
errors associated with analog quadrature modulators. The 6 dB
of gain adjustment range can also be used to control the output
power level of each DAC.
The AD9777 features the ability to perform fS/2, fS/4, and fS/8
digital modulation and image rejection when combined with an
analog quadrature modulator. In this mode, the AD9777 accepts
I and Q complex data (representing a single or multicarrier wave-
form), generates a quadrature modulated IF signal along with its
orthogonal representation via its dual DACs, and presents these
two reconstructed orthogonal IF carriers to an analog quadrature
modulator to complete the image rejection upconversion process.
Another digital modulation mode (i.e., the Direct IF Mode)
allows the original baseband signal representation to be frequency
translated such that pairs of images fall at multiples of one-half
the DAC update rate.
The AD977x family includes a flexible clock interface accepting
differential or single-ended sine wave or digital logic inputs. An
internal PLL clock multiplier is included and generates the
necessary on-chip high frequency clocks. It can also be disabled
to allow the use of a higher performance external clock source. An
internal programmable divider simplifies clock generation in the
converter when using an external clock source. A flexible data
input interface allows for straight binary or two’s complement
formats and supports single-port interleaved or dual-port data.
Dual high performance DAC outputs provide a differential
current output programmable over a 2 mA to 20 mA range. The
AD9777 is manufactured on an advanced 0.35 micron CMOS
process, operates from a single supply of 3.1 V to 3.5 V, and
consumes 1.2 W of power.
Targeted at wide dynamic range, multicarrier and multistandard
systems, the superb baseband performance of the AD9777 is
ideal for wideband CDMA, multicarrier CDMA, multicarrier
TDMA, multicarrier GSM, and high performance systems
employing high order QAM modulation schemes. The image
rejection feature simplifies and can help to reduce the number
of signal band filters needed in a transmit signal chain. The
direct IF mode helps to eliminate a costly mixer stage for a
variety of communications systems.
PRODUCT HIGHLIGHTS
The AD9777 is the 16-bit member of the AD977x pin-
compatible, high performance, programmable 2× /4×/8×
interpolating TxDAC+ family.Direct IF transmission is possible for 70 MHz + IFs through
a novel digital mixing process.fS/2, fS/4, and fS/8 digital quadrature modulation and
user-selectable image rejection simplify/remove cascaded
SAW filter stages.A 2×/4×/8× user-selectable interpolating filter eases data
rate and output signal reconstruction filter requirements.User-selectable two’s complement/straight binary data
coding.User programmable channel gain control over 1 dB range
in 0.01 dB increments.User-programmable channel offset control ±10% over
the FSR.Ultra high speed 400 MSPS DAC conversion rate.Internal clock divider provides data rate clock for easy
interfacing.
10.Flexible clock input with single-ended or differential input,
CMOS, or 1 V p-p LO sine wave input capability.
11.Low power: Complete CMOS DAC operates on 1.2 W
from a 3.1 V to 3.5 V single supply. The 20 mA full-scale
current can be reduced for lower power operation, and
several sleep functions are provided to reduce power during
idle periods.
12.On-chip voltage reference: The AD9777 includes a 1.20 V
temperature compensated band gap voltage reference.
13.80-lead thermally enhanced TQFP.
AD9777
DC SPECIFICATIONS

REFERENCE INPUT
POWER SUPPLY
NOTESMeasured at IOUTA driving a virtual ground.Nominal full-scale current, IOUTFS, is 32× the IREF current.Use an external amplifier to drive any external load.100 MSPS fDAC with fOUT = 1 MHz, all supplies = 3.3 V, no interpolation, no modulation.400 MSPS fDAC, fDATA = 50 MSPS, fS/2 modulation, PLL enabled.
Specifications subject to change without notice.
(TMIN to TMAX, AVDD = 3.3 V, CLKVDD = 3.3 V, DVDD = 3.3 V, PLLVDD = 3.3 V, IOUTFS = 20 mA, unless
otherwise noted.)
AD9777–SPECIFICATIONS
AD9777
DYNAMIC SPECIFICATIONS

*Measured single ended into 50 Ω load.
Specifications subject to change without notice.
(TMIN to TMAX, AVDD = 3.3 V, CLKVDD = 3.3 V, DVDD = 3.3 V, PLLVDD = 0 V, IOUTFS = 20 mA,
Interpolation = 2�, Differential Transformer Coupled Output, 50 � Doubly Terminated,
unless otherwise noted.)
AD9777
CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
AD9777 features proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended
to avoid performance degradation or loss of functionality.
DIGITAL SPECIFICATIONS

Specifications subject to change without notice.
(TMIN to TMAX, AVDD = 3.3 V, CLKVDD = 3.3 V, PLLVDD = 0 V, DVDD = 3.3V, IOUTFS = 20 mA, unless
otherwise noted.)
ABSOLUTE MAXIMUM RATINGS*

P1B15–P1B0, P2B15–P2B0
DATACLK, PLL_LOCK
CLK+, CLK–, RESET
LPF
SPI_CSB, SPI_CLK,
SPI_SDIO, SPI_SDO
Junction Temperature
Storage Temperature
*Stresses above those listed under the ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only; functional
operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute
maximum ratings for extended periods may affect device reliability.
THERMAL CHARACTERISTICS
Thermal Resistance

80-Lead Thermally Enhanced
TQFP Package �JA = 23.5 °C/W*
*With thermal pad soldered to PCB.
ORDERING GUIDE

AD9777BSV
*SV = Thin Plastic Quad Flatpack
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