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74VCX16374G-74VCX16374GX-74VCX16374MTD-74VCX16374MTDX Fast Delivery,Good Price
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74VCX16374GFAIN/a2520avaiLow Voltage 16-Bit D-Type Flip-Flop with 3.6V Tolerant Inputs and Outputs
74VCX16374GFAIRCHILDN/a13avaiLow Voltage 16-Bit D-Type Flip-Flop with 3.6V Tolerant Inputs and Outputs
74VCX16374GXFAIN/a2avaiLow Voltage 16-Bit D-Type Flip-Flop with 3.6V Tolerant Inputs and Outputs
74VCX16374MTDFAIN/a1100avaiLow Voltage 16-Bit D-Type Flip-Flop with 3.6V Tolerant Inputs and Outputs
74VCX16374MTDXFAIN/a4252avaiLow Voltage 16-Bit D-Type Flip-Flop with 3.6V Tolerant Inputs and Outputs
74VCX16374MTDXFAIRCHILDN/a2000avaiLow Voltage 16-Bit D-Type Flip-Flop with 3.6V Tolerant Inputs and Outputs
74VCX16374MTDXFAIRCHILN/a2000avaiLow Voltage 16-Bit D-Type Flip-Flop with 3.6V Tolerant Inputs and Outputs


74VCX16374MTDX ,Low Voltage 16-Bit D-Type Flip-Flop with 3.6V Tolerant Inputs and Outputsapplications. The device is byte controlled. A buffered clock

74VCX16374G-74VCX16374GX-74VCX16374MTD-74VCX16374MTDX
Low Voltage 16-Bit D-Type Flip-Flop with 3.6V Tolerant Inputs and Outputs
74VCX16374 Low Voltage 16-Bit D-Type Flip-Flops with 3.6V Tolerant Inputs and Outputs October 1997 Revised November 2002 74VCX16374 Low Voltage 16-Bit D-Type Flip-Flops with 3.6V Tolerant Inputs and Outputs General Description Features The VCX16374 contains sixteen non-inverting D-type flip-1.2V to 3.6V V supply operation CC flops with 3-STATE outputs and is intended for bus oriented 3.6V tolerant inputs and outputs applications. The device is byte controlled. A buffered clock t PD (CP) and output enable (OE) are common to each byte and can be shorted together for full 16-bit operation. 3.0 ns max for 3.0V to 3.6V V CC The 74VCX16374 is designed for low voltage (1.2V toPower-off high impedance inputs and outputs 3.6V) V applications with I/O compatibility up to 3.6V. CCSupports live insertion and withdrawal (Note 1) The 74VCX16374 is fabricated with an advanced CMOSStatic Drive (I /I ) OH OL technology to achieve high speed operation while maintain- ±24 mA @ 3.0V V CC ing low CMOS power dissipation. Uses patented noise/EMI reduction circuitry Latch-up performance exceeds 300 mA ESD performance: Human body model > 2000V Machine model > 200V Also packaged in plastic Fine-Pitch Ball Grid Array (FBGA) Note 1: To ensure the high-impedance state during power up or power down, OE should be tied to V through a pull-up resistor; the minimum CC value of the resistor is determined by the current-sourcing capability of the driver. Ordering Code: Order Number Package Number Package Descriptions 74VCX16374G BGA54A 54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide (Note 2)(Note 3) 74VCX16374MTD MTD48 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide (Note 3) Note 2: Ordering code “G” indicates Trays. Note 3: Devices also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code. Logic Symbol © 2002 DS500066
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