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74HC3G34DCNXP/PHILN/a9000avai74HC3G34; 74HCT3G34; Triple buffer gate


74HC3G34DC ,74HC3G34; 74HCT3G34; Triple buffer gateFeatures and benefits Wide supply voltage range from 2.0 V to 6.0 V Input levels: For 74HC3G34: ..
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74HC3G34DC
Triple buffer gate
1. General description
The 74HC3G34; 74HCT3G34 is a triple buffer. Inputs include clamp diodes. This enables
the use of current limiting resistors to interface inputs to voltages in excess of VCC.
2. Features and benefits
Wide supply voltage range from 2.0 V to 6.0V Input levels: For 74HC3G34: CMOS level For 74HCT3G34: TTL level Complies with JEDEC standard no. 7 A Symmetrical output impedance High noise immunity Low-power dissipation Balanced propagation delays Multiple package options ESD protection: HBM JESD22-A114E exceeds 2000V MM JESD22-A115-A exceeds 200V Specified from 40 Cto+85 C and 40 Cto+125C
3. Ordering information

74HC3G34; 74HCT3G34
Triple buffer gate
Rev. 6 — 11 December 2013 Product data sheet
Table 1. Ordering information

74HC3G34DP 40 C to +125 C TSSOP8 plastic thin shrink small outline package; 8 leads;
body width 3 mm; lead length 0.5 mm
SOT505-2
74HCT3G34DP
74HC3G34DC 40 C to +125 C VSSOP8 plastic very thin shrink small outline package; 8 leads;
body width 2.3 mm
SOT765-1
74HCT3G34DC
74HC3G34GD 40 C to +125 C XSON8 plastic extremely thin small outline package; no leads; terminals; body 3  2  0.5 mm
SOT996-2
74HCT3G34GD
NXP Semiconductors 74HC3G34; 74HCT3G34
Triple buffer gate
4. Marking

[1] The pin 1 indicator is located on the lower left corner of the device, below the marking code.
5. Functional diagram

6. Pinning information
6.1 Pinning

Table 2. Marking

74HC3G34DP H34
74HCT3G34DP T34
74HC3G34DC P34
74HCT3G34DC U34
74HC3G34GD P34
74HCT3G34GD U34
NXP Semiconductors 74HC3G34; 74HCT3G34
Triple buffer gate
6.2 Pin description

7. Functional description

[1] H= HIGH voltage level; L= LOW voltage level.
8. Limiting values

[1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
[2] For TSSOP8 package: above 55 C the value of Ptot derates linearly with 2.5 mW/K.
For VSSOP8 package: above 110 C the value of Ptot derates linearly with 8 mW/K.
For XSON8 package: above 118 C the value of Ptot derates linearly with 7.8 mW/K.
Table 3. Pin description

1A, 2A, 3A 1, 3, 6 data input , 2Y, 3Y 7, 5, 2 data output
GND 4 ground (0V)
VCC 8 supply voltage
Table 4. Function table[1]

Table 5. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
VCC supply voltage 0.5 +7.0 V
IIK input clamping current VI < 0.5 V or VI >VCC+ 0.5 V [1]- 20 mA
IOK output clamping current VO< 0.5 V or VO >VCC +0.5V [1]- 20 mA output current VO = 0.5 V to (VCC +0.5V) - 25 mA
ICC quiescent supply current - 50 mA
IGND ground current 50 - mA
Tstg storage temperature 65 +150 C
Ptot total power dissipation Tamb= 40 C to +125C [2]- 300 mW
NXP Semiconductors 74HC3G34; 74HCT3G34
Triple buffer gate
9. Recommended operating conditions

10. Static characteristics

Table 6. Recommended operating conditions

Voltages are referenced to GND (ground = 0 V).
VCC supply voltage 2.0 5.0 6.0 4.5 5.0 5.5 V input voltage 0 - VCC 0- VCC V output voltage 0 - VCC 0- VCC V
Tamb ambient temperature 40 +25 +125 40 +25 +125 C
t/V input transition rise
and fall rate
VCC = 2.0 V - - 625 - - - ns/V
VCC = 4.5 V - 1.67 139 - 1.67 139 ns/V
VCC = 6.0 V - - 83 - - - ns/V
Table 7. Static characteristics

Voltages are referenced to GND (ground = 0 V).
74HC3G34

VIH HIGH-level input
voltage
VCC = 2.0 V 1.5 1.2 - 1.5 - V
VCC = 4.5 V 3.15 2.4 - 3.15 - V
VCC = 6.0 V 4.2 3.2 - 4.2 - V
VIL LOW-level input
voltage
VCC = 2.0 V - 0.8 0.5 - 0.5 V
VCC = 4.5 V - 2.1 1.35 - 1.35 V
VCC = 6.0 V - 2.8 1.8 - 1.8 V
VOH HIGH-level output
voltage = VIH or VIL = 20 A; VCC= 2.0V 1.9 2.0 - 1.9 - V = 20 A; VCC= 4.5V 4.4 4.5 - 4.4 - V = 20 A; VCC= 6.0V 5.9 6.0 - 5.9 - V = 4.0 mA; VCC=4.5V 4.13 4.32 - 3.7 - V = 5.2 mA; VCC=6.0V 5.63 5.81 - 5.2 - V
VOL LOW-level output
voltage = VIH or VIL = 20 A; VCC= 2.0V - 0 0.1 - 0.1 V = 20 A; VCC= 4.5V - 0 0.1 - 0.1 V = 20 A; VCC= 6.0V - 0 0.1 - 0.1 V = 4.0 mA; VCC= 4.5V - 0.15 0.33 - 0.4 V = 5.2 mA; VCC= 6.0V - 0.16 0.33 - 0.4 V input leakage current VI =VCCor GND; VCC =6.0V - - 1.0 - 1.0 A
ICC supply current per input pin; VI =VCCor GND; =0A; VCC =6.0V 10 - 20 A input capacitance - 1.5 - - - pF
NXP Semiconductors 74HC3G34; 74HCT3G34
Triple buffer gate

[1] All typical values are measured at Tamb = 25C.
11. Dynamic characteristics

74HCT3G34

VIH HIGH-level input
voltage
VCC = 4.5 V to 5.5 V 2.0 1.6 - 2.0 - V
VIL LOW-level input
voltage
VCC = 4.5 V to 5.5 V - 1.2 0.8 - 0.8 V
VOH HIGH-level output
voltage = VIH or VIL = 20 A; VCC= 4.5V 4.4 4.5 - 4.4 - V = 4.0 mA; VCC=4.5V 4.13 4.32 - 3.7 - V
VOL LOW-level output
voltage = VIH or VIL = 20 A; VCC= 4.5V - 0 0.1 - 0.1 V = 4.0 mA; VCC= 4.5V - 0.15 0.33 - 0.4 V input leakage current VI =VCCor GND; VCC =5.5V - - 1.0 - 1.0 A
ICC supply current VI =VCCor GND; IO =0A;
VCC =5.5V 10 - 20 A
ICC additional supply
current
per input; VCC= 4.5Vto 5.5V; =VCC 2.1 V; IO =0A - 375 - 410 A input capacitance - 1.5 - - - pF
Table 7. Static characteristics …continued

Voltages are referenced to GND (ground = 0 V).
Table 8. Dynamic characteristics

Voltages are referenced to GND (ground =0 V); for test circuit see Figure6.
74HC3G34

tpd propagation delay nAto nY; see Figure5 [2]
VCC = 2.0 V - 29 95 - 125 ns
VCC = 4.5 V - 9 19 - 25 ns
VCC = 6.0 V - 8 16 - 20 ns transition time nY; see Figure5 [3]
VCC = 2.0 V - 18 95 - 125 ns
VCC = 4.5 V - 6 19 - 25 ns
VCC = 6.0 V - 5 16 - 20 ns
CPD power dissipation
capacitance =GNDto VCC [4] -10- - - pF
NXP Semiconductors 74HC3G34; 74HCT3G34
Triple buffer gate

[1] All typical values are measured at Tamb = 25C.
[2] tpd is the same as tPLH and tPHL.
[3] tt is the same as tTLH and tTHL.
[4] CPD is used to determine the dynamic power dissipation (PD in W).
PD = CPD  VCC 2  fi  N + (CL  VCC 2  fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in V;
N = number of inputs switching;
(CL  VCC 2  fo) = sum of outputs.
12. Waveforms

74HCT3G34

tpd propagation delay nAto nY; see Figure5 [2]
VCC = 4.5 V - 10 23 - 29 ns transition time nY; VCC = 4.5 V; see Figure5 [3] -6 19 - 25 ns
CPD power dissipation
capacitance =GNDto VCC 1.5V [4] -9- - - pF
Table 8. Dynamic characteristics …continued

Voltages are referenced to GND (ground =0 V); for test circuit see Figure6.
Table 9. Measurement points

74HC3G34 0.5 VCC 0.5 VCC
74HCT3G34 1.3V 1.3V
NXP Semiconductors 74HC3G34; 74HCT3G34
Triple buffer gate

Table 10. Test data

74HC3G34 GND to VCC  6ns 50 pF 1k open
74HCT3G34 GND to 3V  6ns 50 pF 1k open
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