2SA1774 ,PNP GENERAL PURPOSE AMPLIFIER TRANSISTORS SURFACE MOUNTTHERMAL CHARACTERISTICSCharacteristic Symbol Max UnitPower Dissipation (Note 1) P 150 mWDORDERING I ..
2SA1774 R , General Purpose Transistor
2SA1774 S , General Purpose Transistor
2SA1774 TL R , General Purpose Transistor (−50V, −0.15A)
2SA1774 TLR , General Purpose Transistor (−50V, −0.15A)
2SA1774 Q , General Purpose Transistor
2SC4672-P , NPN Plastic-Encapsulate Transistors
2SC4673 ,NPN Epitaxial Planar Silicon Transistor UHF Low-Noise Amplifier, Wide-Band Amplifier ApplicationsAbsolute Maximum Ratings at Ta = 25˚CPl arameter Ss ymbo Cs ondition Rt ating UniCV ollector-to-Bas ..
2SC4680 , Silicon NPN Epitaxial
2SC4681 ,Transistor Silicon NPN Epitaxial Type Strobe Flash Applications Medium Power Amplifier ApplicationsApplications Excellent h linearity FE : h = 200 to 600 (V = 2 V, I = 0.5 A) FE (1) CE C : h = ..
2SC4682 ,TRANSISTOR SILICON NPN EPITAXIAL TYPE (PCT PROCESS) STROBE FLASH APPLICATIONS MEDIUM POWER AMPLIFIER APPLICATIONSELECTRICAL CHARACTERISTICS (Ta = 25°C)CHARACTERISTIC SYMBOL TEST CONDITION UNITCollector Cut-off Cu ..
2SC4684 ,Transistor Silicon NPN Epitaxial Type Strobe Flash Applications Medium Power Amplifier Applications2SC4684 TOSHIBA Transistor Silicon NPN Epitaxial Type 2SC4684 Strobe Flash
2SA1774
PNP Silicon General Purpose Amplifier Transistor
2SA1774
PNP Silicon General Purpose
Amplifier T ransistor
This PNP transistor is designed for general purpose amplifier
applications. This device is housed in the SC−75/SOT−416/SC−90
package which is designed for low power surface mount
applications, where board space is at a premium.
Features Reduces Board Space High hFE, 210−460 (typical) Low VCE(sat), < 0.5 V Available in 8 mm, 7−inch/3000 Unit Tape and Reel Pb−Free Package is Available*
MAXIMUM RATINGS (TA = 25°C)Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not nor-
mal operating conditions) and are not valid simultaneously. If these limits are ex-
ceeded, device functional operation is not implied, damage may occur and reli-
ability may be affected.
THERMAL CHARACTERISTICS Device mounted on a FR−4 glass epoxy printed circuit board using the mini-
mum recommended footprint.
