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2PA1774QNXP/PHILIPSN/a6100avaiPNP general purpose transistor
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2PA1774Q-2PA1774R-2PA1774S
PNP general-purpose transistor
Product profile1.1 General description
PNP transistor in a SOT416 (SC-75) plastic package. The NPN complement is 2PC4617.
1.2 Features
Low current (max. 150 mA) Low voltage (max. 50V)
1.3 Applications
General-purpose switching and amplification in communication, Electronic Data
Processing (EDP) and consumer applications. Pinning information Ordering information A1774
PNP general-purpose transistor
Rev. 05 — 17 November 2009 Product data sheet
Table 1. Pinning

1base
2emitter collector
Table 2. Ordering information

2PA1774Q SC-75 plastic surface mounted package; 3 leads SOT416
2PA1774R
2PA1774S
NXP Semiconductors 2PA1774
PNP general-purpose transistor Marking
Limiting values
[1] Transistor mounted on an FR4 printed-circuit board, single-sided copper, tin-plated and standard footprint. Thermal characteristics
[1] Transistor mounted on an FR4 printed-circuit board, single-sided copper, tin-plated and standard footprint.
Table 3. Marking codes

2PA1774Q YQ
2PA1774R YR
2PA1774S YS
Table 4. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).
VCBO collector-base voltage open emitter - −60 V
VCEO collector-emitter voltage open base - −50 V
VEBO emitter-base voltage open collector - −6V collector current (DC) - −150 mA
ICM peak collector current - −200 mA
IBM peak base current - −100 mA
Ptot total power dissipation Tamb≤25°C [1] -150 mW
Tstg storage temperature −65 +150 °C junction temperature - 150 °C
Tamb ambient temperature −65 +150 °C
Table 5. Thermal characteristics

Rth(j-a) thermal resistance from
junction to ambient
[1] --833 K/W
NXP Semiconductors 2PA1774
PNP general-purpose transistor Characteristics

[1] Pulse test: tp≤ 300 μs; δ≤ 0.02.
Table 6. Characteristics

Tamb = 25 °C unless otherwise specified.
ICBO collector-base
cut-off current =0 A; VCB= −30V - - −100 nA =0 A; VCB= −30V; = 150°C −5 μA
IEBO emitter-base
cut-off current =0 A; VEB= −4V - - −100 nA
hFE DC current gain IC= −1mA; VCE= −6V [1]
2PA1774Q 120 - 270
2PA1774R 180 - 390
2PA1774S 270 - 560
VCEsat collector-emitter
saturation
voltage= −50 mA; = −5mA
[1] -- −200 mV collector
capacitance =ie =0 A;
VCB= −12 V; f=1 MHz 2.2 pF transition
frequency= −2mA;
VCE= −12V; = 100 MHz
[1] 100 --MHz
NXP Semiconductors 2PA1774
PNP general-purpose transistor Package outline

NXP Semiconductors 2PA1774
PNP general-purpose transistor Revision history
Table 7. Revision history
2PA1774_5 20091117 Product data sheet - 2PA1774_4
Modifications: This data sheet was changed to reflect the new company name NXP Semiconductors,
including new legal definitions and disclaimers. No changes were made to the technical
content. Figure 1 “Package outline SOT416 (SC-75)”: updated
2PA1774_4 20041124 Product data sheet - 2PA1774_3
2PA1774_3 20001212 Product specification - 2PA1774_2
2PA1774_2 19990601 Preliminary specification- 2PA1774_1
2PA1774_1 19970709 Preliminary specification- -
NXP Semiconductors 2PA1774
PNP general-purpose transistor
10. Legal information
10.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://.
10.2 Definitions
Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
10.3 Disclaimers
General — Information in this document is believed to be accurate and

reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold

subject to the general terms and conditions of commercial sale, as published
at http:///profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted or

construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
10.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
11. Contact information

For more information, please visit: http://
For sales office addresses, please send an email to:
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
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