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1N4150TRPHIN/a10000avaiHigh Conductance Ultra Fast Diode


1N4150TR ,High Conductance Ultra Fast Diode1N4150 / FDLL4150Discrete POWER & SignalTechnologies1N4150 / FDLL4150COLOR BAND MARKING DEVICE 1ST ..
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1N4150TR
High Conductance Ultra Fast Diode
1N4150 / FDLL4150 Discrete POWER & Signal Technologies 1N4150 / FDLL4150 COLOR BAND MARKING DEVICE 1ST BAND 2ND BAND FDLL4150 BLACK ORANGE LL-34 THE PLACEMENT OF THE EXPANSION GAP DO-35 HAS NO RELATIONSHIP TO THE LOCATION OF THE CATHODE TERMINAL High Conductance Ultra Fast Diode Sourced from Process 1R. See MMBD1201-1205 for characteristics. Absolute Maximum Ratings* TA = 25°C unless otherwise noted Symbol Parameter Value Units W Working Inverse Voltage 50 V IV I Average Rectified Current 200 mA O I DC Forward Current 400 mA F Recurrent Peak Forward Current 600 mA i f i Peak Forward Surge Current f(surge) Pulse width = 1.0 second 1.0 A Pulse width = 1.0 microsecond 4.0 A T Storage Temperature Range -65 to +200 °C stg T Operating Junction Temperature 175 C J ° *These ratings are limiting values above which the serviceability of any semiconductor device may be impaired. NOTES: 1) These ratings are based on a maximum junction temperature of 200 degrees C. 2) These are steady state limits. The factory should be consulted on applications involving pulsed or low duty cycle operations. Thermal Characteristics TA = 25°C unless otherwise noted Symbol Characteristic Max Units 1N / FDLL 4150 P Total Device Dissipation 500 mW D Derate above 25 C 3.33 mW/ C ° ° Thermal Resistance, Junction to Ambient 300 R °C/W θJA ã1997
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