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V23848-H18-C56
iSFP-Intelligent Small Form-factor Pluggable SONET OC-12/OC-3 IR-1 / SDH STM S-4.1/S-1.1 Multirate Applications up to 622 Mbit/s
iSFP™ - Intelligent Small Form-factor Pluggable
SONET OC-12/OC-3 IR-1 / SDH STM S-4.1/S-1.1
Multirate Applications up to 622 Mbit/s
Single Mode 1310 nm Transceiver with LC™ Connector
Fiber Optics
V23848-H18-C56
V23848-H19-C56
FeaturesSmall Form-factor Pluggable (SFP) MSA compatible
transceiver1)Fully SFF-8472 compatibleIncorporating Intelligent – Digital Diagnostic
Monitoring InterfaceInternal calibration implementationAdvanced release mechanismEasy access, even in belly to belly applicationsWire handle release for simplicityColor coded blue tab (single mode)PCI height compatibleExcellent EMI performanceSeparate and common chassis/signal ground module
concepts availableRJ-45 style LC™ connector systemSingle power supply (3.3 V)Low power consumptionSmall size for high channel densityUL-94 V-0 certifiedESD Class 1C per JESD22-A114-B (MIL-STD 883D Method 3015.7)According to FCC (Class B) and EN 55022For distances of up to 21 km (see Supported Link Lengths)Fabry Perot laser, PIN photo diodeLaser safety according to Class 1 FDA and IECAC/AC Coupling according to MSASuitable for multirate applications up to 622 Mbit/sFast Ethernet (FE) compatibleExtended operating temperature range of –40°C to 85°CSFP evaluation kit V23848-S5-V4 available upon requestA press fit cage and cage plugs are available as accessory products from Infineon (see
SFP Accessories)MSA documentation can be found at www.infineon.com/fiberoptics under Transceivers, SFP Transceivers.
Pin Configuration
Figure1iSFP™ Transceiver Electrical Pad Layout
Ordering Information
Pin DescriptionCommon transmitter and receiver ground within the module.A high signal indicates a laser fault of some kind and that laser is switched off.A low signal switches the transmitter on. A high signal or when not connected switches the transmitter off.MOD-DEF(2) is the data line of two wire serial interface for serial ID.MOD-DEF(1) is the clock line of two wire serial interface for serial ID.MOD-DEF(0) is grounded by the module to indicate that the module is present.A low signal indicates normal operation, light is present at receiver input. A high signal indicates the received
optical power is below the worst case receiver sensitivity.Should be pulled up on host board to VCC by 4.7 - 10 kΩ.AC coupled inside the transceiver. Must be terminated with 100 Ω differential at the user SERDES.
10)AC coupled and 100 Ω differential termination inside the transceiver.
DescriptionThe Infineon OC-12 transceiver – part of Infineon iSFP™ family – is compatible to the
Physical Medium Depend (PMD) sublayer and baseband medium compatible to SONET
OC-12/OC-3 IR-1 (Telcordia GR-253-CORE) and SDH STM-4 S-4.1/S-1.1 (ITU-T
G.957).
The appropriate fiber optic cable is 9 µm single mode fiber with LC™ connector.
The Infineon iSFP™ single mode transceiver is a single unit comprised of a transmitter,
a receiver, and an LC™ receptacle.
This transceiver supports the LC™ connectorization concept. It is compatible with RJ-45
style backpanels for high end datacom and telecom applications while providing the
advantages of fiber optic technology.
The Infineon single mode OC-12 transceiver is a single unit comprised of a transmitter,
a receiver, and an LC receptacle. This design frees the customer from many alignment
and PC board layout concerns. The module is designed for low cost LAN and
applications with datarates from 125 to 622 Mbit/s. It can be used as the network end
device interface in workstations, servers, and storage devices, and in a broad range of
network devices such as bridges, routers, and intelligent hubs, as well as local and wide
area ATM switches.
This transceiver operates at up to OC-12 datarates from a single power supply (+3.3 V).
The 100 Ω differential data inputs and outputs are LVPECL and CML compatible.
Supported Link LengthsMaximum reach over fiber type SM-G.652 as defined by ITU-T G.957 and Telcordia GR-253-CORE standards.
Longer reach possible depending upon link implementation.
Functional Description of iSFP™ TransceiverThis transceiver is designed to transmit serial data via single mode cable.
Figure2Functional DiagramThe receiver component converts the optical serial data into CML compatible electrical
data (RD+ and RD–). The Loss Of Signal (LOS) shows whether an optical signal is
present.
The transmitter converts CML compatible electrical serial data (TD+ and TD–) into
optical serial data. Data lines are differentially 100 Ω terminated.
The transmitter contains a laser driver circuit that drives the modulation and bias current
of the laser diode. The currents are controlled by a power control circuit to guarantee
constant output power of the laser over temperature and aging. The power control uses
the output of the monitor PIN diode (mechanically built into the laser coupling unit) as a
controlling signal, to prevent the laser power from exceeding the operating limits.
Single fault condition is ensured by means of an integrated automatic shutdown circuit
that disables the laser when it detects laser fault to guarantee the laser Eye Safety.
The transceiver contains a supervisory circuit to control the power supply. This circuit
makes an internal reset signal whenever the supply voltage drops below the reset
threshold. It keeps the reset signal active for at least 140 milliseconds after the voltage
has risen above the reset threshold. During this time the laser is inactive.
A low signal on TxDis enables transmitter. If TxDis is high or not connected the
transmitter is disabled.
An enhanced Digital Diagnostic Monitoring Interface (Intelligent) has been incorporated
into the Infineon Small Form-factor Pluggable (SFP) transceiver. This allows real time
access to transceiver operating parameters, based on the SFF-8472.
This transceiver features Internal Calibration. Measurements are calibrated over
operating temperature and voltage and must be interpreted as defined in SFF-8472.
The transceiver generates this diagnostic data by digitization of internal analog signals
monitored by a new diagnostic Integrated Circuit (IC).
This diagnostic IC has inbuilt sensors to include alarm and warning thresholds. These
threshold values are set during device manufacture and therefore allow the user to
determine when a particular value is outside of its operating range.
Alarm and Warning Flags are given. Alarm Flags indicate conditions likely to be
associated with an inoperational link and cause for immediate action. Warning Flags
indicate conditions outside the normally guaranteed bounds but not necessarily causes
of immediate link failures.
These enhanced features are in addition to the existing SFP features provided by the
manufacturer i.e. serial number and other vendor specific data.
The serial ID interface defines a 256 byte memory map in EEPROM, accessible over a
2 wire, serial interface at the 8 bit address 1010000X (A0h).
The Digital Diagnostic Monitoring Interface makes use of the 8 bit address 1010001X
(A2h), so the originally defined serial ID memory map remains unchanged and is
therefore backward compatible.
Digital Diagnostic Monitoring Parameters
Regulatory Compliance (EMI)Only for V23848-H18-C56.Any kind of modification not expressly approved by Infineon Technologies may affect the regulatory
compliance of the concerned product. As a consequence thereof this could void the user’s authority to operate
the equipment.
Technical DataExceeding any one of these values may permanently destroy the device.
Absolute Maximum RatingsOperating case temperature measured at transceiver reference point (in cage through 2nd centre hole from
rear, see Figure
9).
Electrical Characteristics (VCC = 2.97 V to 3.63 V, TC = –40°C to 85°C)
Common
Transmitter
ReceiverMeasured with MSA recommended supply filter network (Figure7). Maximum value above that of the steady
state value.Internally AC coupled. Typical 100 Ω differential input impedance.MSA defines maximum current at 300 mA.Internally AC coupled. Load 50Ω to GND or 100Ω differential. For dynamic measurement a tolerance ofmV should be added.Measured values are 20% - 80%.Measured using a 20 Hz to 1 MHz sinusoidal modulation with the MSA recommended power supply filter
network (Figure7) in place. A change in sensitivity of less than 1 dB can be typically expected.Supply current excluding Rx output load.
Optical Characteristics (VCC = 2.97 V to 3.63 V, TC = –40°C to 85°C)
TransmitterInto single mode fiber, 9 µm diameter.Transmitter eye is according to ITU-T G.957 S-4.1 and SONET OC-12 IR-1. Measured with 20% eye mask
margin.The transceiver is specified to meet the SONET/SDH Jitter performance as outlined in ITU-T G.958 and
Telcordia GR-253. Jitter Generation is defined as the amount of jitter that is generated by the transceiver. The
Jitter Generation specifications are referenced to the optical OC-12 signals. If no or minimum jitter is applied
to the electrical inputs of the transmitter, then Jitter Generation can simply be defined as the amount of jitter
on the Tx optical output. The SONET specifications for Jitter Generation are 0.01 UI rms, maximum and 0.1
UI pk-pk, maximum. For SDH, 10 mUI rms, maximum. Both are measured with a 12 kHz - 5 MHz filter in line.
A UI is a Unit Interval, which is equivalent to one bit slot.Values are 20% - 80%, filtered and measured at nominal data rate.
Receiver5)Receiver characteristics are measured with a worst case reference laser.
Figure3Minimum average optical power at which the BER is less than 1x10–10. Measured with a 223–1 NRZ PRBS as
recommended by ANSI T1E1.2, SONET, and ITU-T G.957.See Figure
3.
Timing of Control and Status I/O
I/O Timing of Soft Control and Status FunctionsMeasured from falling clock edge after stop bit of write transaction.See Gigabit Interface Converter (GBIC). SFF-0053, Rev. 5.5, September 27, 2000.Not implemented.The maximum clock rate of the serial interface is defined by the I2C bus interface standard.
Eye Safety
This laser based single mode transceiver is a Class 1 product. It complies with IEC
60825-1/A2: 2001 and FDA performance standards for laser products (21 CFR 1040.10
and 1040.11) except for deviations pursuant to Laser Notice 50, dated July 26, 2001.
CLASS 1 LASER PRODUCT
To meet laser safety requirements the transceiver shall be operated within the Absolute
Maximum Ratings.
Note:All adjustments have been made at the factory prior to shipment of the devices.
No maintenance or alteration to the device is required.
Tampering with or modifying the performance of the device will result in voided
product warranty.
Failure to adhere to the above restrictions could result in a modification that is
considered an act of “manufacturing”, and will require, under law, recertification of
the modified product with the U.S. Food and Drug Administration (ref. 21 CFR
1040.10 (i)).
Figure4Required Labels
Laser Emission Data
Application Notes
EMI Recommendations
To avoid electromagnetic radiation exceeding the required limits set by the standards,
please take note of the following recommendations.
When Gigabit switching components are found on a PCB (e.g. multiplexer,
serializer-deserializer, clock data recovery, etc.), any opening of the chassis may leak
radiation; this may also occur at chassis slots other than that of the device itself. Thus
every mechanical opening or aperture should be as small as feasible and its length
carefully considered.
On the board itself, every data connection should be an impedance matched line (e.g.
strip line or coplanar strip line). Data (D) and Data-not (Dn) should be routed
symmetrically. Vias should be avoided. Where internal termination inside an IC or a
transceiver is not present, a line terminating resistor must be provided. The decision of
how best to establish a ground depends on many boundary conditions. This decision
may turn out to be critical for achieving lowest EMI performance. At RF frequencies the
ground plane will always carry some amount of RF noise. Thus the ground and VCC
planes are often major radiators inside an enclosure. As a general rule, for small systems
such as PCI cards placed inside poorly shielded enclosures, the common ground
scheme has often proven to be most effective in reducing RF emissions. In a common
ground scheme, the PCI card becomes more equipotential with the chassis ground. As
a result, the overall radiation will decrease. In a common ground scheme, it is strongly
recommended to provide a proper contact between signal ground and chassis ground at
every location where possible. This concept is designed to avoid hotspots which are
places of highest radiation, caused when only a few connections between chassis and
signal grounds exist. Compensation currents would concentrate at these connections,
causing radiation. However, as signal ground may be the main cause for parasitic
radiation, connecting chassis ground and signal ground at the wrong place may result in
enhanced RF emissions.
For example, connecting chassis ground and signal ground at a front
panel/bezel/chassis by means of a fiber optic transceiver/cage may result in a large
amount of radiation especially where combined with an inadequate number of grounding
points between signal ground and chassis ground. Thus the transceiver becomes a
single contact point increasing radiation emissions. Even a capacitive coupling between
signal ground and chassis ground may be harmful if it is too close to an opening or an
aperture. For a number of systems, enforcing a strict separation of signal ground from
chassis ground may be advantageous, providing the housing does not present any slots
or other discontinuities. This separate ground concept seems to be more suitable in large
systems where appropriate shielding measures have also been implemented.
