TYN625RG ,25A SCRs, 600VTN25 and TYNx25 Series®STANDARD 25A SCRs MAIN
TYN625RG ,25A SCRs, 600Vapplications.Using clip assembly technology, they provide asuperior performance in surge current ca ..
TYN625RG ,25A SCRs, 600VFEATURES:ASymbol Value UnitGI25 AT(RMS)KV /V600 to 1000 VDRM RRMAAI40 mAGTKAGKAGDESCRIPTION2D PAKTO ..
TYN640RG ,40A SCRs, 600Vapplications AGwhere in-rush current conditions are critical, suchas overvoltage crowbar protection ..
TYN685 ,SCRFEATURES. HIGH SURGE CAPABILITY. HIGH ON-STATE CURRENT. HIGH STABILITY AND RELIABILITYDESCRIPTIONTh ..
TYN688 ,SCRTYN 682 ---> TYN 692SCR
UCC28061DR ,Natural Interleaving(TM) Transition-Mode PFC Controller with Improved Audible Noise Immunity 16-SOIC -40 to 125MAXIMUM RATINGSAll voltages are with respect to GND, –40°C < T = T < +125°C, and currents are posit ..
UCC28061DRG4 ,Natural Interleaving(TM) Transition-Mode PFC Controller with Improved Audible Noise Immunity 16-SOIC -40 to 125FEATURES• Improved Audible Noise Performance23• Phase Management Capability• Soft Start on Overvolt ..
UCC2806D ,Low Power, Dual Output, Current Mode PWM Controller
UCC2806DWTR ,Low Power, Dual Output, Current Mode PWM Controller
UCC2806M ,Low Power, Dual Output, Current Mode PWM ControllerUCC1806UCC2806UCC3806SLUS272F -- FEBRUARY 2000 -- REVISED AUGUST 2006Thesedeviceshavelimitedbuilt-i ..
UCC2806N ,Low Power, Dual Output, Current Mode PWM Controller
TYN625RG-TYN825RG
N-Channel Enhancement Mode MOSFETs
1/7
TN25 and TYNx25 Series
STANDARD 25A SCRs
April 2002 - Ed: 4A
MAIN FEATURES:
DESCRIPTIONThe TYN / TN25 SCR Series is suitable for
general purpose applications.
Using clip assembly technology, they provide a
superior performance in surge current capabilities.
ABSOLUTE RATINGS (limiting values)
TN25 and TYNx25 Series2/7
ELECTRICAL CHARACTERISTICS (Tj = 25°C, unless otherwise specified)
THERMAL RESISTANCESS = Copper surface under tab
PRODUCT SELECTOR
TN25 and TYNx25 Series3/7
ORDERING INFORMATION
OTHER INFORMATION
Note: x = voltage
TN25 and TYNx25 Series4/7
Fig. 1: Maximum average power dissipation
versus average on-state current.
Fig. 2-1: Average and D.C. on-state current
versus case temperature.
Fig. 2-2: Average and D.C. on-state current
versus ambient temperature (copper surface
under tab: S = 1 cm² (for D²PAK).
Fig. 3: Relative variation of thermal impedanceversus pulse duration.
Fig. 4: Relative variation of gate trigger current,holding current and latching current versus
junction temperature.
Fig. 5: Surge peak on-state current versus
number of cycles.
TN25 and TYNx25 Series5/7
Fig. 6: Non-repetitive surge peak on-state
current for a sinusoidal pulse with width<10 ms, and corresponding values of I²t.
Fig. 7: On-state characteristics (maximum
values).
Fig. 8: Thermal resistance junction to ambient
versus copper surface under tab (Epoxy printed
circuit board FR4, copper thickness: 35 μm)2 PAK).
TN25 and TYNx25 Series6/7
PACKAGE MECHANICAL DATA2 PAK (Plastic)
FOOTPRINT DIMENSIONS (in millimeters)2 PAK (Plastic)
