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TPS65708YZHRTIN/a480avai4 Channel Power Management IC (PMIC) in Small Chipscale 16-DSBGA -40 to 85


TPS65708YZHR ,4 Channel Power Management IC (PMIC) in Small Chipscale 16-DSBGA -40 to 85Features 2 Applications1• Two 400-mA Step-Down Converters • Monitors• Up to 95% Efficiency • Laptop ..
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TPS65708YZHR
4 Channel PMU in Small Chipscale
LDO1200 mA
FB2
1.5HmL2
DCDC2400 mA
TPS65708
Vout2
Vout3VIN1
VIN2
PGND1
PGND2
VCC
MODE
VLDO2
LDO2200 mA
VINLDO1Fm
2.2Fm
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TPS65708

SLVSAE1B –OCTOBER 2010–REVISED SEPTEMBER 2015
TPS65708 PMU for Embedded Camera Module Features 2 Applications
Two 400-mA Step-Down Converters • Monitors Upto 95% Efficiency • Laptops VIN Rangefor DC-DC Converters From • Handheld Equipment
3.6Vto6V• 2.25-MHz Fixed-Frequency Operation
The TPS65708 deviceisa power management unit• Power Save Modeat Light Load Current targeted for embedded camera modules or other• Output Voltage Accuracyin PWM mode ±1.5% portable low-power consumer end equipment. The• 100% Duty Cyclefor Lowest Dropout device contains two high-efficiency step-down
converters, two low-dropout linear regulators, anda• 180° Out-of-Phase Operation
7.5-mA current sink for drivinga LED. The 2.25-MHz• 2 General Purpose 200-mA LDOs step-down converter entersa low-power modeat light• LDOs Optionally Powered From Step-Down load for maximum efficiency across the widestConverters possible range of load currents. For low-noise
applications, the devices can be forced into fixed-• 7.5-mA PWM Dimmable Current Sink
frequency PWM mode using the MODE pin. The• Availableina 16-Ball DSBGA (WCSP) With device allows the use of small inductors and0.5-mm Pitch capacitors to achievea small solution size. The Device Options: TPS65708 device provides an output currentofupto
400 mAon both DC-DC converters andupto 200 mA– VDCDC1= 3.3V on eachof the LDOs. The enable signalto the DC-– VDCDC2= 1.8V DC converters and LDOsis generated internally by– VLDO1= 2.8V the undervoltage lockout circuit. VLDO2= 1.2V The TPS65708 comesina small 16-pin wafer chip- ISINK(PWM=1)= 7.5 mA scale package (WCSP) with 0.5-mm ball pitch. SEQUENCING: DCDC1, LDO1, DCDC2, Device Information(1)LDO2
(1) Forall available packages, see the orderable addendumat
the endofthe data sheet.
Application Circuit
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