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TPA2000D4-TPA2000D4DAP-TPA2000D4DAPG4-TPA2000D4DAPR
Filterless 2-W Class-D Audio Power Amplifier With Stereo Headphone Drive
Second-Generation Modulation Technique− Filterless Operation
− Improved Efficiency Low Supply Current ...9 mA typ at 5 V Shutdown Control ...< 0.05 µA Typ Shutdown Pin Is TTL Compatible −40°C to 85°C Operating Temperature
Range Space-Saving, Thermally-Enhanced
PowerPAD Packaging
descriptionThe TPA2000D4 is a 2-W stereo bridge-tied-load
(BTL) class-D amplifier designed to drive
speakers with as low as 4-Ω impedance. The amplifier uses TI’s second-generation modulation technique,
which results in improved efficiency and SNR, and also allows the device to be connected directly to the speaker
without the use of the LC output filter commonly associated with class-D amplifiers (this will result in an EMI
which must be shielded at the system level). These features make the device ideal for use in notebook PCs
where high-efficiency is needed to extend battery run-time. For speakers powered off the USB bus, the
high-efficiency allows for higher output power levels without tripping the USB’s overcurrent circuitry.
The gain of the amplifier is controlled by two input terminals, GAIN1, and GAIN0. This allows the amplifier to
be configured for a gain of 6, 12, 18, and 23.5 dB. The differential input terminals are high-impedance CMOS
inputs, and can be used as summing nodes.
The headphone amplifier is a stereo single-ended (SE) class-AB amplifier which requires two external resistors
per channel to set the gain. The MODE pin selects which amplifier is active; the unused amplifier is placed in
shutdown to reduce supply current.
Both the class-D BTL amplifier, and the class-AB SE amplifier include depop circuitry to reduce the amount of
turnon pop at power up, when cycling SHUTDOWN, and when switching modes of operation.
The TPA2000D4 is available in the 32-pin thermally-enhanced TSSOP package (DAP) which allows stereo 2-W
continuous output power levels in 4-Ω loads when placed on a board with proper thermal board design. The
TPA2000D4 operates over an ambient temperature range of −40°C to 85°C.
These packages deliver levels of thermal performance that were previously only achievable in TO-220-type
packages. Thermal impedances of less than 35°C/W are readily realized in multilayer PCB applications when
using the DAP package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
