TOTX179PL ,TOSLINK Fiberoptic Devices
TOTX179PL ,TOSLINK Fiberoptic Devices
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TOTX179PL
TOSLINK Fiberoptic Devices
TOSHIBA TOTX179PL
FIBER OPTIC TRANSMITTING MODULE
TOTX179PL
FIBER OPTIC TRANSMITTING MODULE FOR
DIGITAL AUDIO EQUIPMENT 9,710.3 13.5w:
Unit:mm
O Conform to JEITA Standard CP-1201 (For b
Digital Audio Interfaces including Fiber _ .
Optic inter-connections). . f) "37 n E
O TTL Interface. " E F
o LED is driven by differential circuit. mr'
o Mini package type with Shutter system , i ;i 531 g H
(2.54) . c.
I l‘OjStOJ
5.61:0.2 (6.01) v:
I WM) _ Lu. 625)
Cl = l E ( ) reference value
(i) g . Shutter Color 2 Gray
" "s, Pin connection
© irrx:a) © I. GND
7 I- 's 2. Vee
. 3. Input
co © co 4. N.C.
1 . Maximum Ratings (Ta=25°C)
ITEM SYMBOL RATING UNIT
Storage Temperature Tstg -40 to 70 'C
Operating Temperature Topr -20 to 70 'C
Supply Voltage Vcc -0.5 to 7 V
Input Voltage VIN -0.5 to Vcc+0.5 mA
Soldering Temperature Tsol 260 (1) "C
Note (l) Soldering time s 10 seconds. (At a distance of 1mm from the package)
2 . Recommended Operating Conditions
ITEM SYMBOL MIN. TYP. MAX. UNIT
Supply Voltage Vcc 4.75 5.00 5.25 V
High Level Input Voltage v, H 2.0 - Vcc V
Low Level Input Voltage v, L O - 0.8 V
Handing precaution : The LED's used in this product contain GaAs (Gallium Arsenide).
Care must be taken to protect the safety of people and the
environment when scrapping or terminal processing.
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TOSHIBA
TOTX179PL
3 . Electrical and Optical Characteristics (Ta=25°C. Vcc=5V)
ITEM SYMBOL CONDITION MIN. TYP. MAX. UNIT
Date Rate NRZ code (g) DC - 12.8 Mb/s
Transmission Distance 1.351611%; :gPL and 0.2 - 5 m
Pulse Width 78ns
Pulse Width Distortion (4) Atw Pulse Cycle 156ns -25 - 25 ns
Using TORX179PL
CL=10pF
Fiber Optic Power (s) Pf --21 - - 15 dBm
Center Emission Wavelength l c -_ 650 - nm
Current Consumption Icc - 15 20 mA
High Level Input Voltage v, H 2.0 - - V
Low Level Input Voltage VI L - - 0.8 V
Note (2) LED is on when input signal is high level, it is off when low level.
The duty factor must be kept 25 to 75%.
(3) All Plastic Fiber (970/1000 p m)
(4) Between input of TOTX179PL and output of TORX179PL.
(5) Measure with a standard optical fiber. Peak value,
4 . Mechanical Characteristics (Ta=25°C)
ITEM CONDITION MIN. TYP. MAX. UNIT
Mating force Using TOCP172 , Initial value - - 39.2 N
Unmating force Using TOCP 172 , Initial value 5.9 - 39.2 N
5 . Application Circuit
Fiber optic connector insertion side
Fiber optic
Soldered to transmitting Soldered to
PC board o-Ct module G) 0 PC board
© Less than 7mm
Input Vcc GND
(Bottom View)
6 . Applicable optical fiber with fiber optic connectors.
TOCP172- C] C] B
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TOSHIBA TOTX179PL
7. Foot Layout (reference)
2-- d) 1.1dc0.05
2-- ¢1.7i0.05 3- '0.8-+c0.05
K. l l, AK
2.54 TYP.
5.6 TYP. O I
2.54 TYP.
N C) O Cy
Unit : mm
2.61 TYP. ' , 2.625 TYP. Recommended PCB thickness : 1.6mm
8 . Precaution on Use
(1) Maximum Rating
The maximum ratings are the limit values which must not be exceeded during operation
of device. None of these rating value must not be exceeded. If the maximum rating value is
exceeded, the characteristics of devices may never be restored. In extreme cases, the device
may be permanently damages.
(2) Lifetime of light emitters
If an optical module is used for a long period of time, degeneration in the characteristics will
mostly be due to a lowering of the fiber output power (Pf). This is caused by the degradation
of the optical output of the LED's used as the light source. The cause of degradation of the
optical output of the LED's may be defects in wafer crystallization or mold resin stress.
The detailed causes are, however, not clear.
The lifetime of light emitters is greatly influenced by the operating conditions and the
environment in which it is used as well as the lifetime characteristics unique to the device
type. Thus, when a light emitting device and its operating conditions, Toshiba recommends
that lifetime characteristics be checked.
Depending on the environment conditions, Toshiba recommend that maintenance such as
regular checks of the amount of optical output in accordance with the condition of operating
environment.
(3) Soldering
Optical modules are comprised of internal semiconductor devices. However, in principle,
optical modules are optical components. During soldering, ensure that flux dose not contact
with the emitting surface or detecting surface. Also ensure that proper flux removal is
conducted after soldering.
Some optical modules come with protective cap. The protective cap is used to avoid
malfunction when the optical module is not in use. Note that it is not dust or waterproof.
As mentioned before, optical modules are optical components. Thus, in principle, soldering
where there may be flux residue or flux removal after soldering is not recommended.
Toshiba recommend that soldering be performed without the optical module mounted
on the board. Then, after the board has been cleaned, the optical module should be soldered
on to the board manually.
If the optical module cannot be soldered manually, use non-halogen (chlorine-free) flux and
make sure, without cleaning, there is no residue such as chlorine. This is one of the ways
to eliminate the effects of flux. In such a case, check the reliability.
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TOTX179PL
(4) Vibration and Shock
This module is plastic sealed and has its wire fixed by resin. This structure is relatively
resistant to vibration and shock. In actual equipment, there are sometime cases in which
vibration, shock, or stress is applied to soldered parts or connected parts, resulting in line cut.
A care must be taken in the design of equipment which will be subject to high levels of vibration.
for applications which are subject to large amounts of vibration.
(5) Support Pin
The optical transmitting module TOTX179PL has support pins in order to fix itself to the PCB
temporary. Please make the hole for these pins in the PCB under the condition described in
board layout hole pattern.
(6) Attaching the fiber optic receiving module
Solder the fixed pins (pins 4 and 5) of the fiber optic transmitting module TOTX179PL to the
printed circuit board in order to fix it to the board.
(7) Solvent
When using solvent for flux removal, do not use a high acid or high alkali solvent. Be careful
not to pour solvent in to the optical connector ports. If solvent is inadvertently poured in to
them, clean it off using cotton tips.
(8) Supply voltage
Use the supply voltage within the recommended operating condition (Vcc=5ce0.25V). Make
sure that supply voltage does not exceed the maximum rating value of 7V, even for an instant.
(9) Input voltage
If a voltage exceeding the maximum rating value (Vcc+0.5V) is applied to the transmitter’s
input, the internal IC may suffer damage. If there is a possibility that excessive voltage due
to surges may be added to the input terminal, insert a protective circuit.
(10) Soldering condition
Solder at 260'C or less for no more than ten seconds.
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TOSHIBA TOTX179PL
(11) Case(receptacle) material
The case is made of polycarbonate. Polycarbonate is usually stable with acid, alcohol, and
aliphatic hydrocarbons however, with petrochemicals (such as benzene, toluene, and acetone),
alkali, aromatic hydrocarbons, or chloric hydrocarbons, polycarbonate becomes cracked, swollen,
or melted. Please take care when choosing a packaging material by referencing the table below.
(Chemicals to avoid with polycarbonate)
PHENOMENON CHEMICALS
A Little deterioration . nitric acid(low concentration), hydrogen peroxide, chlorine
But staining
B Cracked, crazed, or . acetic acid(70% or more)
Swollen . gasoline
. methyl ethyl ketone, ehtyl aetate, butyl acetate
. ethyl methacrylate, ethyl ether, MEK
. acetone, m-amino alcohol, carbon tetrachloride
. carbon disulfide, trichloroethylene, cresol
. thinners, oil of turpentine
. triethanolamine
C Melted . concentrated sulfuric acid
( ) : used as solvent . benzene
. styrene, acrylonitrile, vinyl acetate
. ethylenediamine, diethylenediamine
(chloroform, methyl chloride, tetrachloromethane, dioxane}
{1,2-dichlor0ethane}
D Decomposed . ammonia water
. other alkali
(12) Precautions when disposing of devices and packing materials
When discarding devices and packing materials, follow the procedures stipulated by local
regulations in order to protect the environment against contamination.
Compound semiconductors such as GaAs are used LED materials in this module. When devices
are disposed of, worker safety and protection of the environment must be taken into account.
(13) Precautions during use
Toshiba is continually working to improve the quality and the reliability of their products.
Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent
electrical sensitivity and their vulnerability to physical stress. It is the responsibility of the
buyer, when utilizing Toshiba products, to observe standards of safety, and to avoid situations
in which a malfunction or failure of a Toshiba product could cause loss of human life, bodily
injury or damage to property.
When developing equipment, please ensure that Toshiba products are used within specified
operating ranges as set forth in the most recent product specifications. Also, please keep in
mind the precautions and conditions set forth in the Toshiba Semiconductor Reliability
Handbook.
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TOSHIIA TOTX179PL
O TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design forthe entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability
Handbook" etc..
The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
eta). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury( "Unintended usage" ). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instmments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer's own risk.
Gallium arsenide (GaAs) is a substance used in the products described in this document. GaAs dust and fumes
are toxic. Do not break, cut or pulverize the product, or use chemicals to dissolve them. When disposing of the
products, follow the appropriate regulations. Do not dispose of the products with other Industrial waste or with
domestic garbage.
The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other
rights of the third parties which may result from its use. No license is granted by implication or otherwise under
any intellectual property or other rights of TOSHIBA CORPORATION or others.
The information contained herein is subject to change without notice.
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