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TORX141PL
TOSLINK Fiberoptic Devices
TOSHIBA
TORX141PL
FIBER OPTIC RECEIVING MODULE
TORX141PL
FIBER OPTIC RECEIVING MODULE FOR
DIGITAL AUDIO INTERFACE
O Conform to JEITA Standard CP-1201 (For
Digital Audio Interfaces including Fiber
Optic inter-connections).
0 Mini package type with Shutter System
Shutter Color I
Un i t : mm
9.710.; 13.5:o.3
n g n.
h' - T 'it
Pt i ". S
, _ _ V‘ |_I
i i I n.
i 's,'l I,'!,
(2.54) -rs
55:01 (6.01) ‘1 ,¢o.65:to.1
t (2. MI - (2. 625)
( ): reference value
Pin connection
1. Output
"-vf----i-f- 2. GND
© © co 3. Vce
4. N.C.
5. N.C,
1 . Maximum Ratings (Ta=25°C)
ITEM SYMBOL RATING UNIT
Storage Temperature Tstg -40 to 70 'C
Operating Temperature Topr -20 to 70 'C
Supply Voltage Vcc -0.5 to 4.5 V
High Level Output Current ICE --2 mA
Low Level Output Current IOL 2 mA
Soldering Temperature Tsol 260 (1) 'C
Note (1) Soldering time s
2 . Recommended Operating Conditions
10 seconds. (At a distance of 1 mm from the package)
ITEM SYMBOL MIN. TYP. MAX. UNIT
Supply Voltage Vcc 2.7 3.0 3.6 V
2002-02-01 1/6
TOSHIBA
3. Electrical and OpticalCharacteristics (Ta=25°C, Vcc=3V)
TORX141PL
ITEM SYMBOL CONDITION MIN. TYP. MAX. UNIT
Date Rate NRZ code (2) 0.1 - 15 Mb/s
. . . Using APF (3) and -
Transmission Distance T O TX141PL 0.2 10 m
Atw Pulse Width 67ns
Pulse Width Distortion (4) Pulse Cycle 134ns ---20 - 20 ns
CL=10pF
Using TOTX141PL
Maximum Receivable Power (5) PMAX, 15Mb/s, Using APF - 14.5 - - dBm
Minimum Receivable Power (5) PM I N, 15Mb/s, Using APF - - --27 dBm
Current Consumption Icc - 10 15 mA
High Level Output Voltage kv, 2.1 2.5 - V
Low Level Output Voltage Vo L - 0.2 0.4 V
Note (2) When non-modulated signal (optical all high or all low level signal) is inputted, output
signal is not stable. When modulated optical high level signal is received, output signal is high.
When modulated optical low level signal is received, output signal is low.
The duty factor must be maintained between 25 to 75%.
(3) A11 Plastic Fiber (970/1000 u m)
(4) Between input of TOTX141PL and output of TORX141PL.
(5) BERS 1 0 --9 ,Peak.value
4. Mechanical Characteristics (Ta=25°C)
CONDITION
Mating force
Using TOCP172 , Initial value
Unmating force
Using TOCP172 , Initial value
5. Application Circuit
Fiber optic connector insertion side
Soldered to
PC board o-Ci)
Less than 7mm7V
_ co Q)
Fiber optic
receiving
module
Vcc GND Output
(Bottom View)
6 . Applicable optical fiber with fiber optic connectors.
TOCP172-- Cl DB
Soldered to
6)--o PC board
TOSHIBA TORX141PL
7. Foot Layout (reference)
2-- <1) 1.1Hc0.05
2- ¢1.7i0.05 3- ' 0.8ce0.05
9 K. l, c, A
h 2.54 TYP.
5.6 TYP. 'sl A
2.54 TYP.
C) O 0
Unit : mm
2.61 TYP. 2 625 TYP Recommended PCB thickness : 1.6mm
_ , . .
8 . Precaution on Use
(1) Maximum Rating
The maximum ratings are the limit values which must not be exceeded during operation
of device. None of these rating value must not be exceeded. If the maximum rating value is
exceeded, the characteristics of devices may never be restored. In extreme cases, the device
may be permanently damages.
(2) Soldering
Optical modules are comprised of internal semiconductor devices. However, in principle,
optical modules are optical components. During soldering, ensure that flux dose not contact
with the emitting surface or detecting surface. Also ensure that proper flux removal is
conducted after soldering.
Some optical modules come with protective cap. The protective cap is used to avoid
malfunction when the optical module is not in use. Note that it is not dust or waterproof.
As mentioned before, optical modules are optical components. Thus, in principle, soldering
where there may be flux residue or flux removal after soldering is not recommended.
Toshiba recommend that soldering be performed without the optical module mounted
on the board. Then, after the board has been cleaned, the optical module should be soldered
on to the board manually.
If the optical module cannot be soldered manually, use non-halogen (chlorine-free) flux and
make sure, without cleaning, there is no residue such as chlorine. This is one of the ways
to eliminate the effects of flux. In such a case, check the reliability.
(3) Noise resistance
It is believed that the use of optical transfer devices improve noise resistance. In theory, optical
fiber is not affected by noise at all. However, receiving modules which handle signals whose level
is extremely small, are susceptible to noise.
TOSLINK improve noise resistance to use a conductive case. However, the current signal output
by the optical receiving module's photodiode is extremely small. Thus, in some environments,
shielding the case may not achieve sufficient noise resistance.
For systems which incorporate TOSLINK, Toshiba recommend testing using the actual device
to check its noise resistance.
Use a simple noise filter on the TOSLINK fiber optic transceiving module's power line. If the
ripple in the power supply used is significant, reinforce the filter.
The optical module is to be used in an area which is susceptible to radiated noise, increase the
shielding by covering the optical module and the power line filter with a metallic cover .
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TORX141PL
(4) Vibration and Shock
This module is plastic sealed and has its wire fixed by resin. This structure is relatively
resistant to vibration and shock. In actual equipment, there are sometime cases in which
vibration, shock, or stress is applied to soldered parts or connected parts, resulting in line cut.
A care must be taken in the design of equipment which will be subject to high levels of vibration.
for applications which are subject to large amounts of vibration.
(5) Support Pin
The optical receiving module TORX141PL has support pins in order to fix itself to the PCB
temporary. Please make the hole for these pins in the PCB under the condition described in
board layout hole pattern.
(6) Attaching the fiber optic receiving module
Solder the fixed pins (pins 4 and 5) of the fiber optic receiving module TORX141PL to the
printed circuit board in order to fix it to the board.
(7) Solvent
When using solvent for flux removal, do not use a high acid or high alkali solvent. Be careful
not to pour solvent in to the optical connector ports. If solvent is inadvertently poured in to
them, clean it off using cotton tips.
(8) Supply voltage
Use the supply voltage within the recommended operating condition (Vcc=2.7 to 3.6V). Make
sure that supply voltage does not exceed the maximum rating value of 4.5V, even for an instant.
(9) Output
If the receiver output is at low and is connected to the power supply, or if the output is high
and is connected to GND, the internal IC may be destroyed.
(10) Soldering condition
Solder at 260°C or less for no more than ten seconds.
2002-02-01 4/6
TOSHIBA TORX141PL
(11) Case(receptacle) material
The case is made of polycarbonate. Polycarbonate is usually stable with acid, alcohol, and
aliphatic hydrocarbons however, with petrochemicals (such as benzene, toluene, and acetone),
alkali, aromatic hydrocarbons, or chloric hydrocarbons, polycarbonate becomes cracked, swollen,
or melted. Please take care when choosing a packaging material by referencing the table below.
(Chemicals to avoid with polycarbonate)
PHENOMENON CHEMICALS
A Little deterioration . nitric acid(low concentration), hydrogen peroxide, chlorine
But staining
B Cracked, crazed, or . acetic acid(70% or more)
Swollen . gasoline
. methyl ethyl ketone, ehtyl aetate, butyl acetate
. ethyl methacrylate, ethyl ether, MEK
. acetone, m-amino alcohol, carbon tetrachloride
. carbon disulfide, trichloroethylene, cresol
. thinners, oil of turpentine
. triethanolamine
C Melted . concentrated sulfuric acid
( } : used as solvent . benzene
. styrene, acrylonitrile, vinyl acetate
. ethylenediamine, diethylenediamine
. (chloroform, methyl chloride, tetrachloromethane, dioxane}
{1,2-dichlor0ethane}
D Decomposed . ammonia water
. other alkali
(12) Precautions when disposing of devices and packing materials
When discarding devices and packing materials, follow the procedures stipulated by local
regulations in order to protect the environment against contamination.
Compound semiconductors such as GaAs are used LED materials in this module. When devices
are disposed of, worker safety and protection of the environment must be taken into account.
(13) Precautions during use
Toshiba is continually working to improve the quality and the reliability of their products.
Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent
electrical sensitivity and their vulnerability to physical stress. It is the responsibility of the
buyer, when utilizing Toshiba products, to observe standards of safety, and to avoid situations
in which a malfunction or failure of a Toshiba product could cause loss of human life, bodily
injury or damage to property.
When developing equipment, please ensure that Toshiba products are used within specified
operating ranges as set forth in the most recent product specifications. Also, please keep in
mind the precautions and conditions set forth in the Toshiba Semiconductor Reliability
Handbook.
2002-02-01 5/6
TOSHIIA TORX141PL
O TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design forthe entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability
Handbook" etc..
0 The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury ( "Unintended usage" ). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer's own risk.
o Gallium arsenide (GaAs) is a substance used in the products described in this document. GaAs dust and fumes
are toxic. Do not break, cut or pulverize the product, or use chemicals to dissolve them. When disposing of the
products, follow the appropriate regulations. Do not dispose of the products with other Industrial waste or with
domestic garbage.
O The information contained herein is presented only as a guide forthe applications of our products. No
responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other
rights of the third parties which may result from its use. No license is granted by implication or otherwise under
any intellectual property or other rights of TOSHIBA CORPORATION or others.
0 The information contained herein is subject to change without notice.
2002-02-01 6/6
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