TMP37FS ,Low Voltage Temperature SensorsSpecifications subject to change without notice.REV. A–2–TMP35/TMP36/TMP37WAFER TEST LIMITS (V = +5 ..
TMP37FS ,Low Voltage Temperature Sensorsapplications over the range +5°C to+100°C, and provides an output scale factor of 20 mV/°C. TheTMP3 ..
TMP37FS-REEL ,Low Voltage Temperature Sensor Vo=500FEATURES FUNCTIONAL BLOCK DIAGRAMLow Voltage Operation (2.7 V to 5.5 V)+V (2.7V to 5.5V)sCalibrated ..
TMP37FT9 ,Low Voltage Temperature Sensorsapplications over the range +5°C to+100°C, and provides an output scale factor of 20 mV/°C. TheTMP3 ..
TMP37GRT-REEL7 ,Low Voltage Temperature Sensor Vo=500SPECIFICATIONSParameter Symbol Conditions Min Typ Max UnitACCURACYTMP35/TMP36/TMP37F T = 25°C ±1 ±2 ..
TMP37GRT-REEL7 ,Low Voltage Temperature Sensor Vo=500characteristics.TMP37FT9 ±2.0 5°C to 100°C TO-92TMP37GT9 ±3.0 5°C to 100°C TO-92Table I. TMP3x Outp ..
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TPA0212PWPR G4 ,Stereo Class-AB Audio Amplifier with Stereo Headphone Drive and Integrated Gain 24-HTSSOP -40 to 85maximum ratings may cause permanent damage to the device. These are stress ratingsonly, and functio ..
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TMP35FS-TMP35GS-TMP35GT9-TMP36FS-TMP36GRT-TMP36GS-TMP36GT9-TMP37FS-TMP37FT9-TMP37GS
Low Voltage Temperature Sensors
REV.A
Low Voltage Temperature Sensors
FUNCTIONAL BLOCK DIAGRAMFEATURES
Low Voltage Operation (+2.7 V to +5.5 V)
Calibrated Directly in 8C
10 mV/8C Scale Factor (20 mV/8C on TMP37)628C Accuracy Over Temperature (typ)
60.58C Linearity (typ)
Stable with Large Capacitive Loads
Specified –408C to +1258C, Operation to +1508C
Less than 50 mA Quiescent Current
Shutdown Current 0.5 mA max
Low Self-Heating
APPLICATIONS
Environmental Control Systems
Thermal Protection
Industrial Process Control
Fire Alarms
Power System Monitors
CPU Thermal Management
PRODUCT DESCRIPTIONThe TMP35, TMP36 and TMP37 are low voltage, precision
centigrade temperature sensors. They provide a voltage output
that is linearly proportional to the Celsius (Centigrade) tem-
perature. The TMP35/TMP36/TMP37 do not require any
external calibration to provide typical accuracies of ±1°C at
+25°C and ±2°C over the –40°C to +125°C temperature range.
The low output impedance of the TMP35/TMP36/TMP37, and
its linear output and precise calibration simplify interfacing to
temperature control circuitry and A/D converters. All three devices
are intended for single-supply operation from 2.7 V to 5.5 V maxi-
mum. Supply current runs well below 50 μA providing very low
self-heating—less than 0.1°C in still air. In addition, a shutdown
function is provided to cut supply current to less than 0.5 μA.
The TMP35 is functionally compatible with the LM35/LM45
and provides a 250 mV output at +25°C. The TMP35 reads
temperatures from +10°C to +125°C. The TMP36 is speci-
fied from –40°C to +125°C, provides a 750 mV output at
+25°C and operates to +125°C from a single 2.7 V supply. The
TMP36 is functionally compatible with the LM50. Both the
TMP35 and TMP36 have an output scale factor of +10mV/°C.
The TMP37 is intended for applications over the range +5°C to
+100°C, and provides an output scale factor of 20mV/°C. The
TMP37 provides a 500 mV output at +25°C. Operation extends
to +150°C with reduced accuracy for all devices when operating
from a 5 V supply.
The TMP35/TMP36/TMP37 are all available in low cost 3-pin
TO-92, and SO-8 and 5-pin SOT-23 surface mount packages.
PACKAGE TYPES AVAILABLE
RT-5 (SOT-23)
NC = NO CONNECT
VOUT
SHUTDOWN
GND
+VS
SO-8
NC = NO CONNECT
VOUT
SHUTDOWN
+VS
GND
TO-9232
BOTTOM VIEW
(Not to Scale)
PIN 1 - +Vs, PIN 2 - VOUT, PIN 3 - GND
+Vs (2.7V to 5.5V)
VOUT
SHUTDOWN
TMP35/TMP36/TMP37F/G–SPECIFICATIONS1(VS = +2.7 V to +5.5 V, –408C ≤ TA ≤ +1258C
unless otherwise noted)OUTPUT
NOTESDoes not consider errors caused by self-heating.Guaranteed but not tested.
Specifications subject to change without notice.
WAFER TEST LIMITS(VS = +5 V, GND = O V, TA = +258C, unless otherwise noted)OUTPUT
NOTES
Electrical tests are performed at wafer probe to the limits shown. Due to variations in assembly methods and normal yield loss, yield after packaging is not guaranteed
for standard product dice. Consult factory to negotiate specifications based on dice lot qualification through sample lot assembly and testing.Guaranteed but not tested.
DICE CHARACTERISTICSDie Size 0.027 × 0.030 inch, 810 sq. mils
(0.685 × 0.762 mm, 0.522 sq. mm)
TRANSISTOR COUNT: 25Substrate is connected to +VS
WARNING!
CAUTIONESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000V readily
accumulate on the human body and test equipment and can discharge without detection.
For additional DICE ordering information, refer to databook.
1. VOUT
2. GND
3. SHUTDOWN
4. +VS
TMP35/TMP36/TMP37
ABSOLUTE MAXIMUM RATINGS*Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +7 V
Shutdown Pin . . . . . . . . . . . . . . GND ≤ SHUTDOWN ≤ +VS
Output Pin . . . . . . . . . . . . . . . . . . . . . . GND # VOUT # +VS
Operating Temperature Range . . . . . . . . . . –55°C to +150°C
Dice Junction Temperature . . . . . . . . . . . . . . . . . . . . . +175°C
Storage Temperature Range . . . . . . . . . . . . –65°C to +160°C
Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . . +300°C
*CAUTIONStresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation at or above this specifica-
tion is not implied. Exposure to the above maximum rating
conditions for extended periods may affect device
reliability.Digital inputs are protected; however, permanent damage may
occur on unprotected units from high-energy electrostatic fields.
Keep units in conductive foam or packaging at all times until
ready to use. Use proper antistatic handling procedures.Remove power before inserting or removing units from their
sockets.
θJA is specified for device in socket (worst case conditions).
ORDERING GUIDETMP37FT9
NOTESSO = Small Outline; RT = Plastic Surface Mount; TO = Plastic.Consult factory for availability.
FUNCTIONAL DESCRIPTIONAn equivalent circuit for the TMP3x family of micropower,
centigrade temperature sensors is shown in Figure 1. At the
heart of the temperature sensor is a bandgap core, which is
comprised of transistors Q1 and Q2, biased by Q3 to approxi-
mately 8 μA. The bandgap core operates both Q1 and Q2 at the
same collector current level; however, since the emitter area of
Q1 is 10 times that of Q2, Q1’s VBE and Q2’s VBE are not equal
by the following relationship:
ΔVBE=VT×lnAE,Q1
AE,Q2
Figure 1.Temperature Sensor Simplified Equivalent Circuit
Resistors R1 and R2 are used to scale this result to produce the
output voltage transfer characteristic of each temperature sensor
and, simultaneously, R2 and R3 are used to scale Q1’s VBE as
an offset term in VOUT. Table I summarizes the differences
between the three temperature sensors’ output characteristics:
Table I. TMP3x Output CharacteristicsThe output voltage of the temperature sensor is available at the
emitter of Q4, which buffers the bandgap core and provides load
current drive. Q4’s current gain, working with the available base
current drive from the previous stage, sets the short-circuit
current limit of these devices to 250 μA.
TEMPERATURE – 8C
2.0OUTPUT VOLTAGE – Volts
Figure 2.Output Voltage vs. Temperature
TEMPERATURE – 8C20406080100120140
ACCURACY ERROR – Figure 3.Accuracy Error vs. Temperature
TEMPERATURE – 8C
0.3250
125225
0255075100
POWER SUPPLY REJECTION – 8C/V
Figure 4.Power Supply Rejection vs. Temperature
Figure 5.Power Supply Rejection vs. Frequency
TEMPERATURE – 8C250
125225
0255075100
MINIMUM SUPPLY VOLTAGE – VoltsFigure 6.Minimum Supply Voltage vs. Temperature
SUPPLY CURRENT – μA
TEMPERATURE – 8C250
125225
0255075100Figure 7.Supply Current vs. Temperature
TMP35/TMP36/TMP37
SUPPLY VOLTAGE – Volts123456
SUPPLY CURRENT – μAFigure 8.Supply Current vs. Supply Voltage
TEMPERATURE – 8C250
125225
0255075100
SUPPLY CURRENT – nAFigure 9.Supply Current vs. Temperature (Shutdown = 0 V)
TEMPERATURE – 8C
100250
125225
0255075100
RESPONSE TIME – μsFigure 10.VOUT Response Time for V+ Power-Up/Power-
Down vs. Temperature
TEMPERATURE – 8C
100250
125225
0255075100
= SHUTDOWN PIN
LOW TO HIGH (0V TO 3V)
VOUT SETTLES WITHIN ±1°C
RESPONSE TIME – μsFigure 11.VOUT Response Time for Shutdown Pin vs.
Temperature
Figure 12.VOUT Response Time to Shutdown and V+
Pins vs. Time
TIME – sec
PERCENT OF CHANGE – %Figure 13.Thermal Response Time in Still Air
APPLICATIONS SECTION
Shutdown OperationAll TMP3x devices include a shutdown capability that reduces
the power supply drain to less than 0.5 μA, maximum. This
feature, available only in the SO-8 and the SOT-23 packages, is
TTL/CMOS level compatible, provided that the temperature
sensor supply voltage is equal in magnitude to the logic supply
voltage. Internal to the TMP3x at the SHUTDOWN pin, a
pull-up current source to VIN is connected. This permits the
SHUTDOWN pin to be driven from an open-collector/drain
driver. A logic LOW, or zero-volt condition on the SHUTDOWN
pin, is required to turn the output stage OFF. During shut-
down, the output of the temperature sensors becomes a high
impedance state where the potential of the output pin would
then be determined by external circuitry. If the shutdown fea-
ture is not used, it is recommended that the SHUTDOWN pin
be connected to VIN (Pin 8 on the SO-8, Pin 2 on the SOT-23).
Mounting ConsiderationsIf the TMP3x temperature sensors are thermally attached and
protected, they can be used in any temperature measurement
application where the maximum temperature range of the me-
dium is between –40°C to +125°C. Properly cemented or glued
to the surface of the medium, these sensors will be within 0.01°C
of the surface temperature. Caution should be exercised, espe-
cially with TO-92 packages, because the leads and any wiring to
the device can act as heat pipes, introducing errors if the sur-
rounding air-surface interface is not isothermal. Avoiding this
condition is easily achieved by dabbing the leads of the tempera-
ture sensor and the hookup wires with a bead of thermally con-
ductive epoxy. This will ensure that the TMP3x die temperature
is not affected by the surrounding air temperature.
Because plastic IC packaging technology is used, excessive me-
chanical stress should be avoided when fastening the device with
a clamp or a screw-on heat tab. Thermally conductive epoxy or
AIR VELOCITY – FPM
TIME CONSTANT – sec
700Figure 14.Thermal Response Time Constant in Forced Air
TIME – sec
CHANGE – %Figure 15.Thermal Response Time in Stirred Oil Bath
TIME/DIVISION
VOLT/DIVISION Figure 16.Temperature Sensor Wideband Output
Noise Voltage. Gain = 100, BW = 157 kHz
Figure 17.Voltage Noise Spectral Density vs. Frequency
TMP35/TMP36/TMP37These temperature sensors, as well as any associated circuitry,
should be kept insulated and dry to avoid leakage and corrosion.
In wet or corrosive environments, any electrically isolated metal
or ceramic well can be used to shield the temperature sensors.
Condensation at very cold temperatures can cause errors and
should be avoided by sealing the device, using electrically non-
conductive epoxy paints or dip or any one of many printed
circuit board coatings and varnishes.
Thermal Environment EffectsThe thermal environment in which the TMP3x sensors are used
determines two important characteristics: self-heating effects
and thermal response time. Illustrated in Figure 18 is a thermal
model of the TMP3x temperature sensors that is useful in un-
derstanding these characteristics.
q
JCTC
CCHCCPDTACAFigure 18.TMP3x Thermal Circuit Model
In the TO-92 package, the thermal resistance junction-to-case,
θJC, is 120°C/W. The thermal resistance case-to-ambient, θCA,
is the difference between θJA and θJC, and is determined by
the characteristics of the thermal connection. The tempera-
ture sensor’s power dissipation, represented by PD, is the
product of the total voltage across the device and its total supply
current (including any current delivered to the load). The rise in
die temperature above the medium’s ambient temperature is
given by:TJ=PD×θJC+θCA()+TA
Thus, the die temperature rise of a TMP35 “RT” package
mounted into a socket in still air at 25°C and driven from a
+5 V supply is less than 0.04°C.
The transient response of the TMP3x sensors to a step change
in the temperature is determined by the thermal resistances and
the thermal capacities of the die, CCH, and the case, CC. The
thermal capacity of the case, CC, varies with the measurement
medium since it includes anything in direct contact with the
package. In all practical cases, the thermal capacity of the case is
the limiting factor in the thermal response time of the sensor
and can be represented by a single-pole RC time constant re-
sponse. Figures 13 and 15 illustrate the thermal response time
of the TMP3x sensors under various conditions. The thermal
time constant of a temperature sensor is defined as the time
required for the sensor to reach 63.2% of the final value for a
step change in the temperature. For example, the thermal time
constant of a TMP35 “S” package sensor mounted onto a 0.5"
by 0.3" PCB is less than 50 sec in air, whereas in a stirred oil
bath the time constant is less than 3 sec.
Basic Temperature Sensor ConnectionsThe circuit in Figure 19 illustrates the basic circuit configura-
tion for the TMP3x family of temperature sensors. The table
shown in the figure illustrates the pin assignments of the tem-
perature sensors for the three package types. For the SOT-23,
Pin 3 is labeled as “NC” are as Pins 2, 3, 6 and 7 on the SO-8
package. It is recommended that no electrical connections be
made to these pins. If the shutdown feature is not needed on the
SOT-23 or the SO-8 package, the SHUTDOWN pin should be
connected to VS.
2.7V < Vs < 5.5V
VOUT
0.1μF
PACKAGEVSGNDVOUTSHDN
SO-88415
SOT-23-52514
TO-92132NA
PIN ASSIGNMENTS
SHDNFigure 19.Basic Temperature Sensor Circuit Configuration
Note the 0.1 μF bypass capacitor on the input. This capacitor
should be a ceramic type, have very short leads (surface mount
would be preferable), and located as close a physical proximity
to the temperature sensor supply pin as practical. Since these
temperature sensors operate on very little supply current and
could be exposed to very hostile electrical environments, it is
important to minimize the effects of RFI (Radio-Frequency
Interference) on these devices. The effect of RFI on these tem-
perature sensors in specific and analog ICs in general is mani-
fested as abnormal dc shifts in the output voltage due to the
rectification of the high frequency ambient noise by the IC. In
those cases where the devices are operated in the presence of
high frequency radiated or conducted noise, a large value tanta-
lum capacitor (.2.2 μF) placed across the 0.1 μF ceramic may
offer additional noise immunity.
Fahrenheit ThermometersAlthough the TMP3x temperature sensors are centigrade tem-
perature sensors, a few components can be used to convert the
output voltage and transfer characteristics to directly read Fahr-
enheit temperatures. Shown in Figure 20a is an example of a
simple Fahrenheit thermometer using either the TMP35 or the
TMP37. This circuit can be used to sense temperatures from
41°F to 257°F, with an output transfer characteristic of 1 mV/°F
using the TMP35, and from 41°F to 212°F using the TMP37
with an output characteristic of 2 mV/°F. This particular ap-
proach does not lend itself well to the TMP36 because of its
inherent 0.5 V output offset. The circuit is constructed with an
AD589, a 1.23 V voltage reference, and four resistors whose values
for each sensor are shown in the figure table. The scaling of the
