TLV2362IDR ,Dual High-Performance, Low-Voltage Operational AmplifierTLV2361, TLV2362HIGH-PERFORMANCE LOW-VOLTAGE OPERATIONAL AMPLIFIERSSLOS195H − FEBRUARY 1997 − REVI ..
TLV2362IP ,Dual High-Performance, Low-Voltage Operational Amplifier/sc/package.‡DBV: The actual top-side marking has one additional character that designates the wafe ..
TLV2362IPSR , HIGH-PERFORMANCE LOW-VOLTAGE OPERATIONAL AMPLIFIERS
TLV2362IPWR ,Dual High-Performance, Low-Voltage Operational Amplifiermaximum ratings” may cause permanent damage to the device. These are stress ratings only, andfuncti ..
TLV2362IPWRG4 ,Dual High-Performance, Low-Voltage Operational Amplifier 8-TSSOP -40 to 85TLV2361, TLV2362HIGH-PERFORMANCE LOW-VOLTAGE OPERATIONAL AMPLIFIERSSLOS195H − FEBRUARY 1997 − REVI ..
TLV2362IPWRG4 ,Dual High-Performance, Low-Voltage Operational Amplifier 8-TSSOP -40 to 85maximum ratings over operating free-air temperature range (unless otherwise noted)Supply voltage, V ..
TMS38054FNLR ,TMS38054 RING INTERFACE DEVICE
TMS380SRAFNL ,Source-Routing Accelerator 44-PLCC
TMS4116 , 16,384-BIT DYNAMIC RANDOM-ACCESS MEMORY
TMS4256 , 262,144-BIT DYNAMIC RANDOM-ACCESS MEMORIES
TMS4256-10SDL , 262,144-BIT DYNAMIC RANDOM-ACCESS MEMORIES
TMS4256-12SDL , 262,144-BIT DYNAMIC RANDOM-ACCESS MEMORIES
TLV2362ID-TLV2362IDGKR-TLV2362IDR-TLV2362IP-TLV2362IPWR-TLV2362IPWRG4
Dual High-Performance, Low-Voltage Operational Amplifier
VCC± = ±2.5 V Wide Output Voltage Swing... ±2.4 V Typ
at VCC± = ±2.5 V, RL = 10 kΩ Low Noise ...8 nV/√Hz Typ at f = 1 kHz
description/ordering informationThe TLV236x devices are high-performance dual
operational amplifiers built using an original
Texas Instruments bipolar process. These
devices can be operated at a very low supply
voltage (±1 V), while maintaining a wide output swing. The TLV236x devices offer a dramatically improved
dynamic range of signal conditioning in low-voltage systems. The TLV236x devices also provide higher
performance than other general-purpose operational amplifiers by combining higher unity-gain bandwidth and
faster slew rate. With their low distortion and low-noise performance, these devices are well suited for audio
applications.
ORDERING INFORMATION Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package. DBV: The actual top-side marking has one additional character that designates the wafer fab/assembly site.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
1OUT
1IN−
1IN+
VCC−
VCC+
2OUT
2IN−
2IN+
TLV2362... D, DGK, P, PS, OR PW PACKAGE
(TOP VIEW)
