TLP781 ,Photocoupler (phototransistor output)Pin Configurations (top view) • Construction mechanical rating 7.62mm Pitch 10.16mm Pitch1 4 Stand ..
TLP781F ,Photocoupler (phototransistor output)TLP781/TLP781F TOSHIBA Photocoupler GaAs IRED & Photo−Transistor TLP781,TLP781F TLP781 Unit in ..
TLP785 ,Photocoupler (phototransistor output)TLP785,TLP785F TOSHIBA Photocoupler GaAs IRED & Photo−Transistor TLP785,TLP785F TLP785 Unit: mmOf ..
TLP795G , PHOTO RELAY
TLP797J ,PHOTOCOUPLER PHOTO RELAYPIN CONFIGURATION (TOL VIEW) TOSHIBA 11-7A8 Weight: 0.4 g 1 : ANODE 2 : CATHODE 1 6 3 : N.C. 4 : D ..
TLP814 ,PHOTO-INTERRUPTER INFRARED LED + PHOTOTRANSISTORTI P214CAMERASTRACK DETECTION IN MICRO FLOPPY DISKDRIVEVery small packageHigh resolution : Slit wid ..
TMS320DM335ZCE270 ,Digital Media System-on-Chip (DMSoC) 337-NFBGA 0 to 85 SPRS528C–JULY 2008–REVISED JUNE 20101.2 DescriptionThe DM335 processor is a low-cost, low-power pr ..
TMS320DM355ZCE216 , Digital Media System-on-Chip (DMSoC)
TMS320DM355ZCE216 , Digital Media System-on-Chip (DMSoC)
TMS320DM357ZWT ,Digital Media System-on-Chip (DMSoC) 361-NFBGA • IEEE-1149.1 (JTAG) Boundary- • 0.09-μm/6-Level Cu Metal Process (CMOS)Scan-Compatible• 3.3-V and ..
TMS320DM365 ,DaVinci Digital Media Processor• Hardware 3A statistics collection module• Four 64-Bit General-Purpose Timers (each(H3A) configura ..
TMS320DM365ZCE27 ,DaVinci Digital Media Processor 338-NFBGA 0 to 85features a suite of peripheralssaving developers on system costs.This ARM9-based DM365 device offer ..
TLP781-TLP781F
Photocoupler (phototransistor output)
1rt9Slll4llllBlh
TLP781/TLP781 F
TOSHIBA Photocoupler GaAs IRED & Photo-Transistor
TLlP781 ,TLP781I F
Office Equipment
Household Appliances
Solid State Relays
Switching Power Supplies
Various Controllers
Signal Transmission Between Different Voltage
Circuits
The TOSHIBA TLP781 consists of a silicone photo-transistor
optically coupled to a gallium arsenide infrared emitting diode in a
four lead plastic DIP (DIP4) with having high isolation voltage
(AC: 5kVRMS (min)).
I TLP781 I 7.62mm pitch type DIP4
I TLP781F I 10.16mm pitch type DIP4
I Collector-emitter voltage: 80V (min.)
I Current transfer ratio: 50% (min.)
Rank GB: 100% (min.)
I Isolation voltage: 5000Vrms (min.)
I UL recognized: UL1577, file No. E67349
I BSI approved: BS EN60065:2002
Approved no.8961
BS EN60950-1:2006
Approved no.8962
I SEMKO approved:EN60065:2002
Approved no.800514
EN60950- 1:2001, EN60335- 1:2002
Approved no.8005 17
I Option(D4)type
VDE approved 3 DIN EN60747-5-2
Certificate No. 40021173
(Note): When an EN60747-5-2 approved type is needed,
Please designate "Option (D4)"
TLP781 Unit in mm
6.5t0V25
4.61:0.25
3.5i0.25
,.v-rl,'rir, ,
0.5:0.l
MlNl‘ ‘ ‘
"_,,, ,
25410.25 cd
TOSHIBA
Weight: 0.259 (typ.)
TLP781F Unit in mm
l 'd 'd
4.6:0.75 L”.
k F -r- 4:
l 2 / \
c ' / \
12in 15 L 7E£ M q
-..- l w' *b []_25i0.1 l
0 5:0 I 7: I0~12 rl
L E %—4
2.54:0.25 NI
TOSHIBA
Weight: 0.259 (typ.)
Pin Configurations
(top view)
I Construction mechanical rating
7.62mm Pitch 10.16mm Pitch 1 . 34
Standard Type TLPxxxF Type 3K:
Creepage distance 6.5mm(min) 8.0mm(min) 2 l: Cl 3
Clearance 6.5mm(min) 8.0mm(min)
Insulationthickness 0.4mm(min) 0.4mm(min) 1 :Anode
2 : Cathode
3 : Emitter
4 : Collector
1 2008-01 -1 7
1rt9Slll4llllBlh
TLP781/TLP781 F
Current Transfer Ratio
Cl a s si- Current Transfer Ratio (%)
. (lc / IF) . . .
Type (loci???) IF = 5mA, VCE = 5V, Ta = 25°C Marking Of Classification
Min Max
(None) 50 600 Blank, Y, Y+, YE,G, G+, B, B+,BL,GB
Rank Y 50 150 YE
Rank GR 100 300 GR
Rank BL 200 600 BL
TLP781 Rank GB 100 600 GB
Rank YH 75 150 Y+
Rank GRL 100 200 G
Rank GRH 150 300 G+
Rank BLL 200 400 B
(Note I): Ex. rank GB: TLP781 (GB)
(Note 2): Application type name for certification test, please use standard product type name, i. e.
TLP781 (GB): TLP781
Absolute Maximum Ratings (Ta = 25°C)
Characteristic Symbol Rating Unit
Forward current IF 60 mA
Forward current derating (Ta 2 39°C) AIF / "C A).? mA/ "C
Pulse forward current (Note 3) In: 1 A
fi] Power dissipation PD 100 mW
Power dissipation derating APD / ''C -1.0 mW/ "C
Reverse voltage VR 5 V
Junction temperature Tj 125 "C
Collector-emitter voltage VCEO 80 V
Emitter-collector voltage VECO 7 V
i5. Collector current k: 50 mA
iii-,', Power dissipation (single circuit) PC 150 mW
(Prrf,1tt')i'lg1t)netirllii't? APC/t -1.5 WC
Junction temperature Tj 125 °C
Operating temperature range Topr -55 to 110 ''C
Storage temperature range Tstg -55 to 125 "C
Lead soldering temperature (1 Os) Tsol 260 ''C
Total package power dissipation PT 250 mW
(T‘I9atazl 223896 power dissipation derating APT / "C -2.5 mW / DC
Isolation voltage (Note 4) BVS 5000 vrms
(Note): Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
("Handling Precautions”/“Derating Concept and Methods") and individual reliability data (Le. reliability test
report and estimated failure rate, etc).
(Note 3): 100 us pulse, 100 Hz frequency
(Note 4): AC, 1 min., R.H.s 60%. Apply voltage to LED pin and detector pin together.
Recommended Operating Conditions
Characteristic Symbol Min Typ. Max Unit
Supply voltage Vcc - 5 24 V
Forward current IF - 16 25 mA
Collector current IC - 1 10 mA
Operating temperature Top, -25 - 85 ''C
(Note): Recommended operating conditions are given as a design guideline
to obtain expected performance of the device.
Additionally, each item is an independent guideline respectively.
In developing designs using this product, please confirm
specified characteristics shown in this document.
Individual Electrical Characteristics (Ta = 25°C)
Characteristic Symbol Test Condition Min Typ. Max Unit
Forward voltage VF IF = 10 mA 1.0 1.15 1.3 V
fi?,, Reverse current IR VR = 5 V - - 10 pA
Capacitance CT V = 0, f= 1 MHz - 3O - pF
Collector-emitter -
breakdown voltage V(BR) CEO lc - 0.5 mA 80 - - V
Emitter-collector -
" breakdown voltage V(BR) ECO IE - 0.1 mA 7 - - V
u v = 24 v 0.01 0.1
It,. CE - pA
D Collector dark current |D(|CEO)
VCE = 24 V - 0.6 50 A
Ta = 85''C u
Capacitance - -
(collector to emitter) CCE V - O, f-- 1 MHz - IO - pF
Coupled Electrical Characteristics (Ta = 25°C)
Characteristic Symbol Test Condition Min Typ. Max Unit
= = 50 - 600
Current transfer ratio IC / IF IF 5 mA, VCE 5 V Rank GB %
100 - 600
Saturated CTR lc / IF F = 1 mA, VCE = 0.4 V - 60 - %
(sat) Rank GB 30 - -
IC = 2.4 mA, IF = 8 mA - - 0.4
Collector-emitter saturation V V
voltage CE (sat) IC = 0.2 mA, IF = 1 mA - 0.2 -
Rank GB - - 0 4
Isolation Characteristics (Ta = 25°C)
Characteristic Symbol Test Condition Min Typ. Max Unit
Capacitance Cs vs = o f= 1 MHz - o 8 - pF
(input to output) , .
Isolation resistance Rs Vs = 500 V Ix1012 1014 - n
AC, 1 minute 5000 - -
. . . Vrms
Isolation voltage BVS AC, 1 second, In oil - 10000 -
DC, 1 minute, in oil - 10000 - Vdc
3 2008-01 -1 7
TOSHIBA TLP781/TLP781 F
Switching Characteristics (Ta = 25°C)
Characteristics Symbol Test Condition Min Typ. Max Unit
Risetime tr - 2 -
Fall time tr Vcc = 10 V, Ic = 2 mA - 3 - ys
Turn-on time ton RL = 1000 - 3 -
Turn-off time toft - 3 -
Turn-on time tON - 2 -
. R = 1.9 k0 N t 5
Storage time ts (ki, = 5 V, IF = 16 mA ( o e ) - 25 - us
Turn-off time tOFF - 50 -
IF r--hNV--0 Vcc - t
RL s '_-_" Vcc
—0 V _ 4.5V
CE VCE
ON = tOFF
(Note 5): Switching time test circuit
Surface-Mount Lead Form Options
TLP781(LF6) Unit in mm TLP781F(LF7) Unit in mm
a a H a
rt,'; 3-.
F) ao' O :
4.6i0f25 .- 1 2
c; 4.6i0_25
ae j: ". T
r , 3 E _iii. E" g cf,e';
2 _<'V> , N /,9 Tt v/e
I.2i0.l5 l, 2 0 5 u; Tcr- th m.
r - 1. , .1 " -,
. 10.3 MAX j- v't,z.',; 0.75k0.25
2.54:0.25 2_s't0.'is Z 12 MAX
TOSHIBA - TOSHIBA -
Weight 0.249 (typ.) Weight 0.249 (typ.)
4 2008-01-17
TOSHIBA TLP781/TLP781F
Specifications for Embossed-Tape Packing: (TP6), (TP7)
1. Applicable Package
Package Name Product Type
DIP4LF6 TLP781
DIP4LF7 TLP781 F
2. Product Naming System
Type of package used for shipment is denoted by a symbol suffix after a product number. The method of
classification is as below.
(Example 1)
TLP78 1 (BL-TP6)
'—> Tape type
—> CTR rank
—> Device name
(Example 2)
TLP78 1F (BL-TP7)
"wraps type
—>CTR rank
—>Device name
3. Tape Dimensions
3.1 Orientation of Device in Relation to Direction of Tape Movement
Device orientation in the recesses is as shown in Figure 1.
Tapefeedmt
fl fl l o o o o o 0
pp " RF]
C) O O
" " UU
Figure1 Device Orientation
3.2 Tape Packing Quantity:2000 devices per reel
3.3 Empty Device Recesses Are as Shown in Table 1.
Table1 Empty Device Recesses
Standard Remarks
seuceugdl,"di1Up't%'0g,' 0 VWhin any given 40-mm section of
recesses tape, not including leader and trailer
Single empty device 6 devices (max.) per reel Not including leader and trailer
recesses
3.4 Start and End of Tape
The start of the tape has 30 or more empty holes. The end of the tape has 50 or more empty holes.
5 2008-01-17
TOSHIBA TLP781/TLP781 F
3.5 Tape Specification
[1] TLP781 (TP6)
(1)Tape material: Plastic
(2)Dimensions: The tape dimensions are as shown in Figure 2.
2.0i0.1
0.33:0.02
¢15+0.1 8.0iO.1 4-0i0-1
- r-hir-o-tir-ty-c- _
ll "j.
175:01
- - - _§ -1 1ir
4.2i0.1 4.45i0.1
Figure 2 Tape Forms
[2] TLP781 F (TP7)
(1)Tape material: Plastic
(2)Dimensions: The tape dimensions are as shown in Figure 3.
0.33:0.02 3010.1 / 40:01
24.0 _0']
5.05:0.1
Figure 3 Tape Forms
6 2008-01-17
TOSHIBA TLP781/TLP781 F
3.6 Reel Specification
[1] TLP781 (TP6)
(1)Material: Plastic
(2)Dimensions: The reel dimensions are as shown in Figure 4.
3.6_0.8 16.4:3'0
d) 10211.5
$332 max
d)13.0i0.5
1.5:05
23max .
Unit: mm
Figure 4 Reel Forms
[2] TLP781 F (TP7)
(1)Material: Plastic
(2)Dimensions: The reel dimensions are as shown in Figure 5.
24.4%")
d) 1001'15
$330 max
¢13.0i0.5
1.9:05 l--
31 max
Figure 5 Reel Forms
4. Packing
One reel of photocouplers is packed in a shipping carton.
5. Label Indication
The carton bears a label indicating the product number, the symbol representing classification of standard, the
quantity, the lot number and the Toshiba company name.
6. Ordering Information
When placing an order, please specify the product number, the CTR rank, the tape type and the quantity as
shown in the following example.
(Example)
TLP 7 8 1 (BL-TP6) 2000Pcs.
I_, Quantity (must be a multiple of 2000)
—, Tape type
—, CTRrank
- Device name
(Note): The order code may be sufflxed with wither a letter or a digit.
Please contact your nearest Toshiba sales representative for more details.
7 2008-01-17
TOSHIBA TLP781/TLP781 F
Soldering and Storage
1. Soldering
1.1 Soldering
When using a soldering iron or medium infrared ray/hot air reflow, avoid a rise in device temperature as
much as possible by observing the following conditions.
1) Using solder reflow
Temperature profile example of lead (Pb) solder
C This profile is based on the device's
maximum heat resistance guaranteed
value.
Set the preheat temperature/heating
temperature to the optimum temperature
corresponding to the solder paste
type used by the customer within the
described profile.
Package surface temperature
l 60 to 120s less than 30s l
Time (s)
Temperature profile example of using lead (Pb)-free solder
PC) This profile is based on the device's
260 -------------------- maximum heat resistance guaranteed
value.
Set the preheat temperature/heating
temperature to the optimum temperature
corresponding to the solder paste
type used by the customer within the
described profile.
230 -t--.-----i----------------
190 ----
180 - -
Package surface temperature
60 to 120s
l 30 to 50s
Time (s)
2) Using solder flow (for lead (Pb) solder, or lead (Pb)-free solder)
. Please preheat it at 150°C between 60 and 120 seconds.
. Complete soldering within 10 seconds below 260°C. Each pin may be heated at most once.
3) Using a soldering iron
Complete soldering within 10 seconds below 260°C, or within 3 seconds at 350°C. Each pin may
be heated at most once.
8 2008-01-17
TOSHIBA TLP781/TLP781 F
2. Storage
1) Avoid storage locations where devices may be exposed to moisture or direct sunlight.
2) Follow the precautions printed on the packing label of the device for transportation and storage.
3) Keep the storage location temperature and humidity within a range of 5°C to 35°C and 45% to 75%,
respectively.
4) Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty
conditions.
5) Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during
storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the
solderability of the leads.
6) When restoring devices after removal from their packing, use anti-static containers.
7) Do not allow loads to be applied directly to devices while they are in storage.
8) If devices have been stored for more than two years under normal storage conditions, it is recommended
that you check the leads for ease of soldering prior to use.
9 2008-01-17
TOSHIBA TLP781/TLP781 F
EN60747 Isolation Characteristics
Types: TLP781, TLP781F
Type designations for 'option: (D4) ', which are tested under EN60747 requirements.
Ex.: TLP781 (D4-GR-LF6) D4: EN60747 option
GR: CTR rank name
LF6: standard lead bend name
Note: Use TOSHIBA standard type number for safety standard application.
Ex. TLP781 (D4-GR-LF6) _ TLP781
Description Symbol Rating Unit
Application classification
for rated mains voltage s 300 Vrms l-IV -
for rated mains voltage s 600 Vrms l-lll
Climatic classification 55 / 115 l 21 -
Pollution degree 2 -
Maximum operating insulation voltage VIORM 890 Vpk
Input to output test voltage,
Vpr = 1.5XVIQRM, type and sample test Vpr 1335 Vpk
tp = IOS, partial discharge < 5pC
Input to output test voltage,
Vpr = 1.87SXVIORM, 100% production test Vpr 1670 Vpk
tp = 1s, partial discharge < 5pC
Highest permissible overvoltage
(transient overvoltage, tpr = 60s) VTR 6000 Vpk
Safety limiting values (max. permissible ratings in case of
fault)
current (input current IF, Psi = 0) Isi 300 mA
power (output or total power dissipation) Psi 500 mW
temperature Tsi 150 °C
Insulation resistance, lho = 500V,Ta=25°C Rsi 21012 Q
10 2008-01-17
TOSHIBA TLP781/TLP781 F
Insulation Related Specifications
7.62mm pitch 10.16mm pitch
TLPxxx type TLPxxxF type
Minimum creepage distance Cr 6.5mm 8.0mm
Minimum clearance CI 6.5mm 8.0mm
Minimum insulation thickness ti 0.4 mm
Comparative tracking index CTI 175
(1) If a printed circuit is incorporated, the creepage distance and clearance may be reduced below this
value. (e.g.at a standard distance between soldering eye centres of 7.5mm). Ifthis is not permissible,
the user shall take suitable measures.
(2) This photocoupler is suitable for 'safe electrical isolation' only within the safety limit data.
Maintenance of the safety data shall be ensured by means of protective circuits.
VDE test sign: Marking on product
for EN60747 4
Marking on packing
for EN60747
Marking Example: TLP781, TLP781 F
F =Pe--- Lot No.
p t=3me- Device Name
p LI"-CTR Rank Marking
-4.' Mark for option (D4)
1pin indication
11 2008-01-17
1rt9Slll4l ll IA TLP781/TLP781 F
IF -Ta PC-Ta
E " 160
8 A 3"
E < S?
g g g k? 120
o To I
E _ 2 .2
a a J3 80
=0 2 :5
-20 0 20 40 60 80 100 120 -20 0 20 40 60 80 100 120
Ambient temperature Ta (°C) Ambient temperature Ta (t)
AVF/ATa - IF IF-VF
|F (mA)
93 5-)
f; (i'
.si..'Ci; E
75 > y,
m 9 (U
g g o 1.0
LL. o i
on 1 I0 100 0.40 0.60 0.80 1.00 1.20 1.40 1.60
Forward current IF (mA) Fon/vard voltage VF (V)
IFP - VFP
Pulse width s 10ps
a" Repetitive
g, frequency=100Hz
0. Ta = 25°C
3. 100
0.00 0.40 0.80 1.20 1.60 2.00 2.40
Pulse forward voltage VFP (V)
*: The above graphs show typical characteristics.
12 2008-01-17
1rt9Slll4llllBlh
x 0.01
Ath001
0,0001
0 20 40 60 80 100
Ambienttemperature Ta (°C)
IC-VCE
w,,,,--''"'''-
a? 50 w,.,,.,---''''''"
20 /’ 00 /
0 --''"
s,.-'''.
E //// 'KL..--''''''" -.-'"
t "'"'" e,..--'''''':'.'.'.').:---'''''" w.,,,---""'"'
ts 10 I /,4/
s-'''''
O s.,.---''"''" -
IF=2mA
0.0 0.2 0.4 0.0 0.8 1.0 1.2
Collector-emittervoltage VCE (V)
IC /IF--lF
Ta = 25''C
VCE = 5V
- - VCE = 0.4V
Current transfer ratio
0.1 1 10 100
Forward current IF (mA)
*: The above graphs show typical characteristics.
'C (mA)
Collector current
Ic (mA)
Collector current
TLP781/TLP781 F
IC -VCE
Collector-emittervoltage VCE (V)
Ta = 25''C
VCE = 5V
- - VCE = 0.4V
1 10 100
Forward current IF (mA)
1rt9Slll4l ll IA TLP781/TLP781 F
lc - Ta VCE(sat) _ Ta
a? g A
g "tis' Z
O 10 a
_ g ii
- a irf
E; Ca' o
a a g',
13 1 t3 g
g (--':', ,
-40 -20 0 20 40 60 so 100 -40 -20 0 20 40 60 80 100
Ambienttemperature Ta (°C) Ambienttemperature Ta (°C)
Switching Time - RL
1000 _
Ta = 25°C
IF = 16mA
VCC = 5V
1 10 100
Load resistance RL (kQ)
*: The above graphs show typical characteristics.
14 2008-01-17
TOSHIBA TLP781/TLP781 F
RESTRICTIONS ON PRODUCT USE
. Toshiba Corporation, and its subsidiaries and afhliates (collectively "TOSHIBA"), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively "Product") without notice.
. This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.
. Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before creating and producing designs and using, customers must
also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document,
the speciMations, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA
Semiconductor Reliability Handbook" and (b) the instructions for the application that Product will be used with or for. Customers are
solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the
appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any
information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other
referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO
LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
. Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring
equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document.
Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or
reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious
public impact ("Unintended Use"). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used
in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, trafhc signaling
equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric
power, and equipment used in Mance-related felds. Do not use Product for Unintended Use unless specifically permitted in this
document.
. Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
. Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
. The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
. ABSENT AWRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
. GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or
vapor. Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.
. Do not use or otherwise make available Product or related software or technology for any military purposes, including without
limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile
technology products (mass destruction weapons). Product and related software and technology may be controlled under the
Japanese Foreign Exchange and Foreign Trade Law and the US. Export Administration Regulations. Export and re-export of Product
or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations.
. Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of
noncompliance with applicable laws and regulations.
15 2008-01-17
www.ic-phoenix.com
.
