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TDA7263SASTN/a5avai12 + 12W STEREO AMPLIFIER WITH MUTING


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TDA7263SA
12 + 12W STEREO AMPLIFIER WITH MUTING
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TDA7263SA

September 2003 WIDE SUPPLY VOLTAGE RANGE HIGH OUTPUT POWER
12+12W @ VS=28V, RL = 8Ω, THD=10% MUTE FACILITY (POP FREE) WITH LOW
CONSUMPTION AC SHORT CIRCUIT PROTECTION THERMAL OVERLOAD PROTECTION
DESCRIPTION

The TDA7263SA is class AB dual audio power am-
plifier assembled in the Clipwatt package, specially
designed for high quality sound application as HI-FI
music centers and stereo TV sets.
Pin to pin compatible with the TDA7253L,
TDA7263L
12 + 12W STEREO AMPLIFIER WITH MUTING
TEST AND APPLICATION DIAGRAM
TDA7263SA
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ABSOLUTE MAXIMUM RATINGS
PIN CONNECTION (Top view)
BLOCK DIAGRAM
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TDA7263SA
THERMAL DATA
ELECTRICAL CHARACTERISTCS (Refer to the stereo test and application circuit, VS = 28V; RL = 8Ω;

Gv = 30dB; f = 1KHz; Tamb = 25°C unless otherwise specified.)
TYPICAL CHARACTERISTICS (referred to the typical Application Circuit, VS = 28V, RL = 8Ω, unless oth-

erwise specified)
Figure 1. Output Power vs. Supply Voltage Figure 2. Distortion vs. Output Power
TDA7263SA
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Figure 3. Quiescent Current vs. Supply Voltage
Figure 4. Supply Voltage Rejection vs. Freq.
Figure 5. Crosstalk vs. Frequency
Figure 6. Output Attenuation & Quiescent
Current vs. Vpin5
Figure 7. Total Power Dissipation vs. Output
Power
BUILT-IN PROTECTION SYSTEMS
Thermal Shut-down

The presence of a thermal limiting circuit offers the
following advantages:
1 an overload on the output (even if it is perma-
nent), or an excessive ambient temperature can
be easily withstood.
2 the heatsink can have a smaller factor of safety
compared with that of a conventional circuit.
There is no device damage in the case of exces-
sive junction temperature; all that happens is
that PO (and therefore PO) and IO are reduced.
Short Circuit (AC Conditions)

The TDA7263SA can withstand accidental short
circuits across the speaker made by a wrong con-
nection during normal play operation.
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TDA7263SA
HEAT SINK DIMENSIONING:

In order to avoid the thermal protection intervention, that is placed approximatively at Tj = 150°C, it is important
the dimensioning of the Heat Sinker RTh (°C/W).
The parameters that influence the dimensioning are: Maximum dissipated power for the device (Pdmax) Max thermal resistance Junction to case (RTh j-c) Max. ambient temperature Tamb max Quiescent current Iq (mA)
Example:
VCC = 28V, Rload = 8ohm, RTh j-c = 3.5 °C/W , Tamb max = 50°C
Pdmax = (N° channels) ·
Pdmax = 2 · ( 4.9 ) + 1.9 = 11.3W
(Heat Sinker)
In figure 8 is shown the Power derating curve for the device.
Figure 8. Power derating curve
cc2 R load⋅
----- --------------- ----------IqVcc⋅+ Th c-a
150 T amb max– d max
--------- ---------------- ---------------- R Th j-c– 150 50–
11.3--- ------------------- 3.5– 5.3°C/W== =
TDA7263SA
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Clipwatt Assembling Suggestions

The suggested mounting method of Clipwatt on external heat sink, requires the use of a clip placed as much
as possible in the plastic body center, as indicated in the example of figure 9.
A thermal grease can be used in order to reduce the additional thermal resistance of the contact between pack-
age and heatsink.
A pressing force of 7 - 10 Kg gives a good contact and the clip must be designed in order to avoid a maximum
contact pressure of 15 Kg/mm2 between it and the plastic body case.
As example , if a 15Kg force is applied by the clip on the package , the clip must have a contact area of 1mm2
at least.
Figure 9. Example of right placement of the clip
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