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TCA4311DGKRTIN/a6246avaiHot Swappable 2-Wire Bus Buffers 8-VSSOP -40 to 85
TCA4311DGKRG4TIN/a7919avaiHot Swappable 2-Wire Bus Buffers 8-VSSOP -40 to 85
TCA4311DRG4TIN/a117avaiHot Swappable 2-Wire Bus Buffers 8-SOIC -40 to 85


TCA4311DGKRG4 ,Hot Swappable 2-Wire Bus Buffers 8-VSSOP -40 to 85maximum ratings" may cause permanent damage to the device. These are stress ratingsonly, and functi ..
TCA4311DRG4 ,Hot Swappable 2-Wire Bus Buffers 8-SOIC -40 to 85Features 2 Description2The TCA4311 is a hot swappable I C bus buffer that1• Operating Power-Supply ..
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TCA4311DGKR-TCA4311DGKRG4-TCA4311DRG4
Hot Swappable 2-Wire Bus Buffers 8-SOIC -40 to 85
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TCA4311

SCPS173A –DECEMBER 2008–REVISED JUNE 2014
TCA4311 Hot Swappable 2-Wire Bus Buffers
Not Recommended for New Designs Features 2 Description

The TCA4311isa hot swappableI2C bus buffer that Operating Power-Supply Voltage Rangeof 2.7-V supports I/O card insertion intoa live backplaneto 5.5-V without corruption of the data and clock busses.• Supports Bidirectional Data TransferofI2C Bus Control circuitry prevents the backplane from beingSignals connectedto the card untila stop commandor bus
idle occurs on the backplane without bus contention• SDA and SCL Lines Are Buffered Which the card. When the connectionis made, thisIncreases Fanout device provides bidirectional buffering, keeping the• 1-V PrechargeonAll SDA and SCL Lines backplane and card capacitances isolated. DuringPrevents Corruption During Live Board Insertion insertion, the SDA and SCL lines are prechargedto1and Removal From Backplane V to minimize the current required to charge the SDA and SCL Input Lines Are Isolated From parasitic capacitanceof the chip.
Outputs When theI2C busis idle, the TCA4311 can be put• Accommodates Standard Mode and Fast Mode into shutdown modeby setting the EN pin low. WhenI2C Devices ENis high, the TCA4311 resumes normal operation. also includes an open drain READY output pin,• Applications Include Hot Board Insertion and Bus
which indicates that the backplane and card sides areExtension connected together. When READY is high, the• Low ICC Chip Disableof<1 μA SDAIN and SCLIN are connectedto SDAOUT and
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