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TAS5613PHD
150W Stereo PurePath(TM) HD Analog-Input Power Stage 64-HTQFP 0 to 70
PurePath Digital
0,1
4Ohm(6kHz)
4Ohm(1kHz)
TOTALHARMONICDISTORTION+NOISE
0,1 1 100
arm OutputPower-W
4Ohm(6kHz)
4Ohm(1kHz)
TOTALHARMONICDISTORTION+NOISE
www.ti.com
150W STEREO/ 300W MONO PurePath™ HD ANALOG-INPUT POWER
Checkfor Samples: TAS5613A
1FEATURES •
Thermally Enhanced Package Options: PHD (64-pin QFP)
23• Active Enabled Integrated Feedback Provides:
(PurePath™ HD) –
DKD (44-pin PSOP3) Signal Bandwidth upto 80kHz for High APPLICATIONSFrequency Content From HD Sources Ultra Low 0.03% THDat 1W into 4Ω •
Home Theater Systems Flat THDatall Frequencies for Natural •
AV Receivers
Sound •
DVD/ Blu-ray Disk™ Receivers 80dB PSRR (BTL, No Input Signal) •
Mini Combo Systems >100dB
(A Weighted) SNR •
Active Speakers and Subwoofers Click and Pop Free Startup and Stop
DESCRIPTION•
Pin compatible with TAS5630, TAS5615 andThe TAS5613Aisa high-performance analog input
TAS5611Class D amplifier with integrated closed loop•
Multiple Configurations Possible on the Same feedback technology (known as PurePath™ HD).It
PCB: has the abilityto driveupto 150 W.(1) Stereo into 4Ω–
Mono Parallel Bridge Tied Load (PBTL) speakers froma single 36V supply.
Stereo Bridge Tied Load (BTL) PurePath™ HD technology enables traditional
2.1 Single Ended (SE) Stereo Pair and AB-Amplifier performance (<0.03% THD) levels while
Bridge Tied Load Subwoofer providing the power efficiencyof traditional classD
amplifiers.
at 10%THD+NUnlike traditional Class-D amplifiers, the distortion
Configurationcurve only increases once the output levels move into
in Stereo BTLPurePath™ HD technology enables lower idle losses
at making more efficient.
160W 125W 85W Stereo 65W Stereo >90%
Efficient Power With 60-mΩ
Output MOSFETs Self-Protection Design (Including
Undervoltage, Overtemperature, Clipping, and
Short Circuit Protection) With Error Reporting EMI Compliant When Used With(1) Achievable output power levelsare dependentonthe thermal
configurationofthe target application.A high performance
thermal interface material betweenthe package exposed
heatslug andthe heat sink shouldbe usedto achieve high
output power levels
