T1235H-600G ,12A TRIACSFEATURES:A2Symbol Value UnitGI12 AT(RMS)A1V /V600 VDRM RRMA2A2IGT (Q ) 35 mA1DESCRIPTIONA1A2A1Speci ..
T1235H-600TRG ,12A TRIACSFEATURES:A2Symbol Value UnitGI12 AT(RMS)A1V /V600 VDRM RRMA2A2IGT (Q ) 35 mA1DESCRIPTIONA1A2A1Speci ..
T1235H-600TRG ,12A TRIACST1235H Series®SNUBBERLESS™ HIGH TEMPERATURE 12A TRIACS MAIN
T1235H-600TRG ,12A TRIACSABSOLUTE MAXIMUM RATINGSSymbol Parameter Value UnitI RMS on-state current (full sine wave) ATc = 13 ..
T1235H-6I ,High-temperature 12A Triacsapplications such as vacuum cleaner and washing machine drum motor, these 12 A Triacs provide a ver ..
T1235H-6T ,High-temperature 12A TriacsAbsolute maximum ratingsSymbol Parameter Value Unit2D PAK, TO-220AB T = 130 °CcI On-state rms curre ..
TAJD226M025RNJ , General purpose SMT chip tantalum series
TAJD227K010RNJ , Standard Tantalum
TAJD227M010RNJ , General purpose SMT chip tantalum series
TAJD475K050RNJ , TAJ Series Standard Tantalum
TAJD476M025RNJ , General purpose SMT chip tantalum series
TAJD686K016RNJ , General purpose SMT chip tantalum series
T1235H-600G
12A TRIACS
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T1235H Series
SNUBBERLESS™ HIGH TEMPERATURE 12A TRIACS
April 2002 - Ed: 5A
MAIN FEATURES:
DESCRIPTIONSpecifically designed for use in high temperature
environment (found in hot appliances such as
cookers, ovens, hobs, electric heaters, coffee
machines...), the new 12 Amps T1235H triacs
provide an enhanced performance in terms of
power loss and thermal dissipation. This allows for
optimization of the heatsinking dimensioning,
leading to space and cost effectivness when
compared to electro-mechnical solutions.
Based on ST snubberless technology, they offer
high commutation switching capabilities and high
noise immunity levels. And, thanks to their clip
assembly technique, they provide a superior
performance in surge current handling.
ABSOLUTE MAXIMUM RATINGS
T1235H Series2/7
ELECTRICAL CHARACTERISTICS (Tj = 25°C, unless otherwise specified)
STATIC CHARACTERISTICS
Note 1: minimum IGT is guaranted at 10% of IGT max.
Note 2: for both polarities of A2 referenced to A1
THERMAL RESISTANCESS: Copper surface under tab
PRODUCT SELECTOR
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OTHER INFORMATION
Fig. 1: Maximum power dissipation versus RMSon-state current (full cycle).
Fig. 2-1: RMS on-state current versus case
temperature (full cycle).
Fig. 2-2: RMS on-state current versus ambient
temperature (printed circuit board FR4, copper
thickness: 35 μm), full cycle.
Fig. 3: Relative variation of thermal impedanceversus pulse duration.
T1235H Series4/7
Fig. 4: Relative variation of gate trigger current,holding current and latching current versus
junction temperature (typical values).
Fig. 5: Surge peak on-state current versus
number of cycles.
Fig. 6: Non-repetitive surge peak on-state
current for a sinusoidal pulse with width< 10ms, and corresponding value of I²t.
Fig. 7: On-state characteristics (maximum
values).
Fig. 8: Relative variation of critical rate of
decrease of main current versus junction
temperature (typical values).
Fig. 9: Relative variation of critical rate of decreaseof main current versus (dV/dt)c (typical values).
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Fig. 10: Leakage current versus junction
temperature for different values of blocking
voltage (typical values).
Fig. 11: Acceptable repetitive peak off-state
voltage versus case-ambient thermal resistance.
Fig. 12: D²PAK Thermal resistance junction to
ambient versus copper surface under tab (printed
circuit board FR4, copper thickness: 35 μm).
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PACKAGE MECHANICAL DATATO-220AB (Plastic)
