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SW06FQ-SW06GP-SW06GS
Quad SPST JFET Analog Switch
FUNCTIONAL BLOCK DIAGRAM
IN 1
IN 2
IN 3
IN 4
DIS
GND

REV.AQuad SPST JFET
Analog Switch
FEATURES
Two Normally Open and Two Normally Closed SPST
Switches with Disable
Switches Can Be Easily Configured as a Dual SPDT or
a DPDT
Highly Resistant to Static Discharge Destruction
Higher Resistance to Radiation than Analog Switches
Designed with MOS Devices
Guaranteed RON Matching: 10% max
Guaranteed Switching Speeds
TON = 500 ns max
TOFF = 400 ns max
Guaranteed Break-Before-Make Switching
Low “ON” Resistance: 80 V max
Low RON Variation from Analog Input Voltage: 5%
Low Total Harmonic Distortion: 0.01%
Low Leakage Currents at High Temperature
TA = +1258C: 100 nA max
TA = +858C: 30 nA max
Digital Inputs TTL/CMOS Compatible and Independent
of V+
Improved Specifications and Pin Compatible to
LF-11333/13333
Dual or Single Power Supply Operation
Available in Die Form
GENERAL DESCRIPTION

The SW06 is a four channel single-pole, single-throw analog
switch that employs both bipolar and ion-implanted FET
devices. The SW06 FET switches use bipolar digital logic inputs
which are more resistant to static electricity than CMOS devices.
Ruggedness and reliability are inherent in the SW06 design and
construction technology.
Increased reliability is complemented by excellent electrical
specifications. Potential error sources are reduced by minimizing
“ON” resistance and controlling leakage currents at high tem-
peratures. The switching FET exhibits minimal RON variation
over a 20 V analog signal range and with power supply voltage
changes. Operation from a single positive power supply voltage
is possible. With V+ = 36 V, V– = 0 V, the analog signal range
will extend from ground to +32 V.
PNP logic inputs are TTL and CMOS compatible to allow the
SW06 to upgrade existing designs. The logic “0” and logic “1”
input currents are at microampere levels reducing loading on
CMOS and TTL logic.
SW06–SPECIFICATIONS
ELECTRICAL CHARACTERISTICS
(@ V+ = +15 V, V– = –15 V and TA = +258C, unless otherwise noted)
SW06
ELECTRICAL CHARACTERISTICS

NOTES
(@ V+ = +15 V, V– = –15 V, –558C ≤ TA ≤ +1258C for SW06BQ, –408C ≤ TA ≤ +858C for
SW06FQ and –408C ≤ TA ≤ +858C for SW06GP/GS, unless otherwise noted)
VS = 0 V, IS = 100 μA. Specified as a percentage of RAVERAGE where: RAVERAGE =
RON1+RON2+RON3+RON4.Guaranteed by RON and leakage tests. For normal operation maximum analog signal voltages should be restricted to less than (V+) –4 V.Switch being tested ON or OFF as indicated, VINH = 2.0 V or VINL = 0.8 V, per logic truth table.Also applies to disable pin.Current tested at VIN = 2.0 V. This is worst case condition.Sample tested.Switch is guaranteed by design to provide break-before-make operation.Guaranteed by design.Parameter tested only at TA = +125°C for military grade device.
Specifications subject to change without notice.
SW06
WAFER TEST LIMITS

NOTE
Electrical tests are performed at wafer probe to the limits shown. Due to variations in assembly methods and normal yield loss, yield after packaging is not guaranteed
for standard product dice. Consult factory to negotiate specifications based on dice lot qualification through sample lot assembly and testing.
TYPICAL ELECTRICAL CHARACTERISTICS

NOTESPower supply and ground current specified for switch “ON” or “OFF.”Guaranteed by RON and leakage tests.Current tested at VIN = 2.0 V. This is worst case condition.
(@ V+ = +15 V, V– = –15 V, TA = +258C, unless otherwise noted)
(@ V+ = +15 V, V– = –15 V, TA = +258C, unless otherwise noted)
ORDERING GUIDE
TRUTH TABLE
ABSOLUTE MAXIMUM RATINGS1

Operating Temperature Range
SW06BQ, BRC . . . . . . . . . . . . . . . . . . . –55°C to +125°C
SW06FQ . . . . . . . . . . . . . . . . . . . . . . . . . –40°C to +85°C
SW06GP, GS . . . . . . . . . . . . . . . . . . . . . . –40°C to +85°C
Storage Temperature Range . . . . . . . . . . . –65°C to +150°C
Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . . +300°C
Maximum Junction Temperature . . . . . . . . . . . . . . . .+150°C
V+ Supply to V– Supply . . . . . . . . . . . . . . . . . . . . . . . +36 V
V+ Supply to Ground . . . . . . . . . . . . . . . . . . . . . . . . . +36 V
Logic Input Voltage . . . . . . . . . . . (–4 V or V–) to V+ Supply
Analog Input Voltage Range
Continuous . . . . . . . . . . . . . V– Supply to V+ Supply +20 V
Maximum Current Through
Any Pin Including Switch . . . . . . . . . . . . . . . . . . . . . 30 mA
NOTESAbsolute maximum ratings apply to both DICE and packaged parts, unless
otherwise noted.θJA is specified for worst case mounting conditions, i.e., θJA is specified for device
in socket for Cerdip, P-DIP, and LCC packages; θJA is specified for device soldered
to printed circuit board for SO package.
DICE CHARACTERISTICS

Die Size 0.101 × 0.097 inch, 9797 sq. mils
(2.565 × 2.464 mm, 6320 sq. mm)
PIN CONNECTIONS
16-Pin DIP (Q or P-Suffix)
16-Pin SOL (S-Suffix)
SW06BRC/883
LCC Package
(RC-Suffix)
SW06–Typical Performance Characteristics
“ON” Resistance vs. Analog Voltage
Leakage Current vs. Analog Voltage
Supply Current vs. Supply Voltage
RON vs. Temperature
Leakage Current vs. Temperature
Switch Capacitance vs. Analog
Voltage
“ON” Resistance vs. Power Supply
Voltage
Switch Current vs. Voltage
Supply Current vs. Temperature
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