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Partno	Mfg	Dc	Qty	Available	Descript
STTH802	ST	N/a	262	avai	Ultrafast recovery diode
STTH802D	ST	N/a	50	avai	Ultrafast recovery diode
STTH802FP |STTH802FP	ST	N/a	2000	avai	Ultrafast recovery diode

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STTH802-STTH802D-STTH802FP
Ultrafast recovery diode
September 2006 Rev 2 1/11
STTH802
Ultrafast recovery diode
Main product characteristics
Features and benefits Very low conduction losses Negligible switching losses Low forward and reverse recovery time High junction temperature
Description
The STTH802 uses ST's new 200 V planar Pt
doping technology, and is specially suited for
switching mode base drive and transistor circuits.
Packaged in TO-220AC, TO-220FPAC, DPAK,
and D2 PAK this device is intended for use in low
voltage, high frequency inverters, free wheeling
and polarity protection.
Order codes
Characteristics STTH802
2/11
1 Characteristics



To evaluate the conduction losses use the following equation:
P = 0.73 x IF(AV) + 0.021 IF2 (RMS)
Table 1. Absolute ratings (limiting values at Tj = 25° C, unless otherwise specified)
Table 2. Thermal parameters
Table 3. Static electrical characteristics Pulse test: tp = 5 ms, δ < 2 % Pulse test: tp = 380 µs, δ < 2 %
STTH802 Characteristics
3/11



Table 4. Dynamic characteristics
Figure 1. Peak current versus duty cycle Figure 2. Forward voltage drop versus
forward current (typical values)
Figure 3. Forward voltage drop versus
forward current (maximum values)
Figure 4. Relative variation of thermal
impedance, junction to case,
versus pulse duration (TO-220AC,
DPAK, D2 PAK)
Characteristics STTH802
4/11



Figure 5. Relative variation of thermal
impedance, junction to case,
versus pulse duration
(TO-220FPAC)
Figure 6. Junction capacitanceversus
reverse applied voltage (typical
values)
Figure 7. Reverse recovery charges versus
dIF/dt (typical values)
Figure 8. Reverse recovery time versus dIF/dt
(typical values)
Figure 9. Peak reverse recovery current
versus dIF /dt (typical values)
Figure 10. Dynamic parameters versus
junction temperature
STTH802 Ordering information scheme
5/11
Ordering information scheme

Figure 11. Thermal resistance, junction to
ambient, versus copper surface
under tab - Epoxy printed circuit
board FR4, eCU = 35 µm (D2 PAK )
Figure 12. Thermal resistance, junction to
ambient, versus copper surface
under tab - Epoxy printed circuit
board FR4, eCU = 35 µm (DPAK)
Package information STTH802
6/11
3 Package information
Epoxy meets UL94, V0
Cooling method: by conduction (C)
Recommended torque value: 0.8 Nm
Maximum torque value: 1.0 Nm
Table 5. T0-220AC dimensions