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STTH6006W
Turbo 2 ultrafast
July 2007 Rev 2 1/7
STTH6006W urbo 2 ultrafast - high voltage rectifier
Features and benefits Ultrafast switching Low reverse current Low thermal resistance Reduces conduction and switching losses
DescriptionThe STTH6006W uses ST Turbo 2 600 V
technology. This device is specially suited for use
in switching power supplies, and industrial
applications. The VF / Trr trade-off has been
specially established to increase the performance
in welding applications.
Table 1. Main product characteristics
Table 2. Order code
Table 3. Absolute ratings (limiting values per diode at 25° C, unless otherwise specified) to avoid thermal runaway for a diode on its own heatsinkdPtotj
--------------- 1thja–()
------- -------------------<
Characteristics STTH6006W2/7
1 Characteristics To evaluate the conduction losses use the following equation:
P = 1.07 x IF(AV) + 0.006 IF2 (RMS)
Table 4. Thermal parameters
Table 5. Static electrical characteristics Pulse test: tp = 5 ms, δ < 2 % Pulse test: tp = 380 µs, δ < 2 %
Table 6. Dynamic characteristics
STTH6006W Characteristics 3/7
Figure 1. Conduction losses versus
average current
Figure 2. Forward voltage drop versus
forward current
Figure 3. Relative variation of thermal
impedance junction to case versus
pulse duration
Figure 4. Peak reverse recovery current
versus dIF
/dt (typical values)
Figure 5. Reverse recovery time versus
dIF/dt (typical values)
Figure 6. Reverse recovery charges versus
dIF/dt (typical values)
Characteristics STTH6006W4/7
Figure 7. Softness factor versus
dIF/dt (typical values)
Figure 8. Relative variations of dynamic
parameters versus junction
temperature
Figure 9. Transient peak forward voltage
versus dIF
/dt (typical values)
Figure 10. Forward recovery time versus F
/dt (typical values)
Figure 11. Junction capacitance versus
reverse voltage applied
(typical values)
STTH6006W Package mechanical data 5/7
Package mechanical data Epoxy meets UL94, V0 Cooling method: by conduction (C) Recommended torque value: 0.80 Nm Maximum torque value: 1.0 Nm
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOP ACK specifications are available at: .
Table 7. DO-247 dimensions
Ordering information STTH6006W6/7
3 Ordering information
4 Revision history
Table 8. Ordering information
Table 9. Revision history
