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T6668 ,-0.3 to +6.0V; V(in/out): -0.3 to +0.3V; CMOS LSI for voice recording and reproducing using the ADM systemELIE D " '3tP17iiYH1 DDELI‘ILIE Ell: .TOSB T6668_1||
TOSHIBA (UC/UP)
1. GENERAL
The T6668 is ..
STTH506B-STTH506B-TR
Turbo 2 ultrafast _ high voltage rectifier
November 2014 DocID12380 Rev 3 1/10
STTH506Turbo 2 ultrafast high voltage rectifier
Datasheet - production data
Features Ultrafast switching Low reverse current Low thermal resistance Reduces conduction and switching losses ECOPACK® 2 compliant component for DPAK
on demand
DescriptionThe STTH506 has been developed using ST’s
Turbo 2 600 V technology. It is well suited for use
in switching power supplies and industrial
applications.
Table 1. Device summary
Characteristics STTH5062/10 DocID12380 Rev 3
1 Characteristics o evaluate the conduction losses use the following equation:
P = 1.07 x IF(AV) + 0.066 IF2 (RMS)
Table 2. Absolute ratings (limiting values at 25° C, unless otherwise specified)
Table 3. Thermal parameters
Table 4. Static electrical characteristics Pulse test: tp = 5 ms, δ < 2% Pulse test: tp = 380 µs, δ < 2%
STTH506 Characteristics
Table 5. Dynamic characteristics
Figure 1. Conduction losses versus average
current
Figure 2. Forward voltage drop versus forward
current
Figure 3. Relative variation of thermal
impedance junction to case versus pulse
duration (TO-220AC, DPAK)
Figure 4. Peak reverse recovery current versus
dIF/dt (typical values)
Characteristics STTH5064/10 DocID12380 Rev 3
Figure 5. Reverse recovery time versus dIF /dt
(typical values)
Figure 6. Reverse recovery charges versus F /dt (typical values)
Figure 7. Softness factor versus dIF /dt
(typical values)
Figure 8. Relative variations of dynamic
parameters versus junction temperature
Figure 9. Transient peak forward voltage versus
dIF/dt (typical values)
Figure 10. Forward recovery time versus dIF/dt
(typical values)
DocID12380 Rev 3 5/10
STTH506 Characteristics Figure 11. Junction capacitance versus reverse
voltage applied (typical values)
Figure 12. Thermal resistance junction to
ambient versus copper surface under tab
Package Information STTH5066/10 DocID12380 Rev 3
2 Package InformationNote: This package drawing may slightly differ from the physical package. However, all the
specified dimensions are guaranteed.
