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T62M0002A , Digital Sound Processor Embedded SRAM
T62M0002A , Digital Sound Processor Embedded SRAM
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T6668 ,-0.3 to +6.0V; V(in/out): -0.3 to +0.3V; CMOS LSI for voice recording and reproducing using the ADM systemELIE D " '3tP17iiYH1 DDELI‘ILIE Ell: .TOSB T6668_1||
TOSHIBA (UC/UP)
1. GENERAL
The T6668 is ..
STTH20R04FP
High efficiency recrifier
November 2007 Rev 1 1/10
STTH20R04High efficiency rectifier
Features Ultrafast recovery Low power losses High surge capability Low leakage current High junction temperature
DescriptionThe STTH20R04 is an ultrafast recovery power
rectifier dedicated to energy recovery in PDP
application.It is especially designed for clamping function in
energy recovery block.
The compromise between forward voltage drop
and recovery time offers optimized performances.
Table 1. Device summary
Characteristics STTH20R04
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1 Characteristics
To evaluate the conduction losses use the following equation:
P = 1.05 x IF(AV) + 0.015 IF2 (RMS)
Table 2. Absolute ratings (limiting values)
Table 3. Thermal parameters
Table 4. Static electrical characteristics Pulse test: tp = 5 ms, δ < 2% Pulse test: tp = 380 µs, δ < 2%
Table 5. Recovery characteristics
STTH20R04 Characteristics
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Figure 1. Conduction losses versus
average forward current
Figure 2. Forward voltage drop versus
forward current
Figure 3. Relative variation of thermal
impedance junction to case versus
pulse duration
Figure 4. Relative variation of thermal
impedance junction to case versus
pulse duration
Figure 5. Peak reverse recovery current
versus dIF /dt (typical values)
Figure 6. Reverse recovery time versus F /dt (typical values)
Characteristics STTH20R04
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Figure 7. Reverse recovery charges versus
dIF/dt (typical values)
Figure 8. Reverse recovery softness factor
versus dIF/dt (typical values)
Figure 9. Relative variations of dynamic
parameters versus junction
temperature
Figure 10. Transient peak forward voltage
versus dIF /dt (typical values)
Figure 11. Forward recovery time
versus dIF /dt (typical values)
Figure 12. Junction capacitance versus
reverse voltage applied (typical
values)
STTH20R04 Package information
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2 Package information Epoxy meets UL94, V0 Cooling method: by conduction (C) Recommended torque calue: 0.8 N·m Maximum torque value: 1.0 N·m
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOP ACK specifications are available at: .
Table 6. DO-247 dimensions
Package information STTH20R04
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Table 7. TO-220AC dimensions
