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STTH110-STTH110A
HIGH VOLTAGE ULTRAFAST RECTIFIER
STTH110/AJanuary 2003- Ed:1
HIGH VOLTAGE ULTRAFAST RECTIFIER
The STTH110, whichis using ST ultrafast high
voltage planar technology,is specially suited for
free-wheeling, clamping, snubbering, demagneti-
zationin power supplies and other power switching
applications.
DESCRIPTION Low forward voltage drop High reliability High surge current capability Soft switchingfor reduced EMI disturbances Planar technology
FEATURES AND BENEFITS
ABSOLUTE RATINGS (limiting values)
MAIN PRODUCT CHARACTERISTICS
STTH110/A evaluate the maximum conduction losses use the following equation:
P=1.20xIF(AV)+ 0.225xIF2 (RMS)
STATIC ELECTRICAL CHARACTERISTICS
THERMAL PARAMETERS
DYNAMIC ELECTRICAL CHARACTERISTICS
STTH110/A
P(W)0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2
Fig.1: Conduction losses versus averagecurrent.
(A)FM0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
Fig. 2: Forward voltage drop versus forward
current.
Z/Rth(j-c) th(j-c)1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Fig. 3-1: Relative variationof thermal impedance
junction ambient versus pulse duration (epoxy
FR4, Lleads= 10mm) (DO-41).
Z/Rth(j-c) th(j-c)1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Fig. 3-2: Relative variationof thermal impedance
junction ambient versus pulse duration (epoxy
FR4) (SMA).
(°C/W)th(j-a)012 34567 89 10
Fig. 4-1: Thermal resistance junctionto ambient
versus copper surface under each lead (epoxy
printed circuit board FR4, copper thickness: 35μm)
(DO-41).
(°C/W)th(j-a)0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Fig. 4-2: Thermal resistance junctionto ambient
versus copper surface under each lead (epoxy
printed circuit board FR4, copper thickness: 35μm)
(SMA).
STTH110/A
PACKAGE MECHANICAL DATASMA
FOOTPRINT (in millimeters)
STTH110/A
PACKAGE MECHANICAL DATADO-41 Epoxy meets UL 94,V0
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implicationor otherwise underany patentor patent rightsof STMicroelectronics. Specifications mentionedinthis publicationare subjectto
change without notice. This publication supersedesand replacesall information previously supplied.
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