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STPSC406D
600 V power Schottky silicon carbide diode
September 2009 Doc ID 16283 Rev 1 1/8
STPSC406600 V power Schottky silicon carbide diode
Features No or negligible reverse recovery Switching behavior independent of
temperature Dedicated to PFC boost diode
DescriptionThe SiC diode is an ultrahigh performance power
Schottky diode. It is manufactured using a silicon
carbide substrate. The wide bandgap material
allows the design of a Schottky diode structure
with a 600 V rating. Due to the Schottky
construction no recovery is shown at turn-off and
ringing patterns are negligible. The minimal
capacitive turn-off behavior is independent of
temperature.
ST SiC diodes will boost the performance of PFC
operations in hard switching conditions.
Table 1. Device summary
Characteristics STPSC406
2/8 Doc ID 16283 Rev 1
1 Characteristics
o evaluate the conduction losses use the following equation:
P = 1.20x IF(AV) + 0.3 x IF2 (RMS)
Table 2. Absolute ratings (limiting values at 25 °C unless otherwise specified) condition to avoid thermal runaway for a diode on its own heatsink
Table 3. Thermal resistance
Table 4. Static electrical characteristics tp = 10 ms, δ < 2% tp = 500 µs, δ < 2%
Table 5. Other parameters
STPSC406 Characteristics
Doc ID 16283 Rev 1 3/8
Figure 1. Forward voltage drop versus
forward current (typical values)
Figure 2. Reverse leakage current versus
reverse voltage applied
(maximum values)
Figure 3. Peak forward current versus case
temperature (TO-220AC)
Figure 4. Peak forward current versus case
temperature (DPAK)
Figure 5. Junction capacitance versus
reverse voltage applied
(typical values)
Figure 6. Relative variation of thermal
impedance junction to case
versus pulse duration (TO-220AC)
Characteristics STPSC406
4/8 Doc ID 16283 Rev 1
Figure 9. Total capacitive charges versus dIF /dt (typical values)
Figure 7. Relative variation of thermal
impedance junction to case
versus pulse duration (DPAK)
Figure 8. Non-repetitive peak surge forward
current versus pulse duration
(sinusoidal waveform)
STPSC406 Package information
Doc ID 16283 Rev 1 5/8
2 Package information Epoxy meets UL94, V0 Cooling method: convection (C) Recommended torque: 0.4 to 0.6 N·m
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOP ACK®
specifications, grade definitions and product status are available at: .
ECOPACK® is an ST trademark.
Table 6. TO-220AC dimensions
Package information STPSC406
6/8 Doc ID 16283 Rev 1
Figure 10. Footprint (dimensions in mm)
Table 7. DPAK dimensions
