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STPS8L30B
LOW DROP POWER SCHOTTKY RECTIFIER
STPS8L30B
October 1998- Ed:4A
LOW DROP POWER SCHOTTKY RECTIFIER
IF(AV) 8A
VRRM 30V (max) 150°C
(max) 0.40V
MAIN PRODUCT CHARACTERISTICSLOW COST DEVICE WITH LOW DROP FOR-
WARD VOLTAGE FOR LESS POWER
DISSIPATION AND REDUCED HEATSINK
OPTIMIZED CONDUCTION/REVERSE LOSSES
TRADE-OFFWHICH LEADS TO THEHIGHEST
YIELDIN THE APPLICATIONS
HIGH POWER SURFACE MOUNT MINIATURE
PACKAGE
FEATURES AND BENEFITSSingle Schottky rectifier suitedto Switched Mode
Power Supplies andhigh frequencyDCto DCcon-
verters.
Packagedin DPAK, this deviceis especiallyin-
tended for useasa Rectifierat the secondaryof
3.3V SMPSor DC/DCunits.
DESCRIPTION
DPAK3 (TAB)3 4
Symbol Parameter Value UnitVRRM Repetitive peak reverse voltage 30 V
IF(RMS) RMS forward current 7 A
IF(AV) Averageforward current Tc= 135°C δ = 0.5 8 A
IFSM Surge non repetitive forward current tp=10 ms Sinusoidal 75 A
IRRM Repetitive peak reverse current tp=2μsF= 1kHz square 1 A
IRSM Non repetitive peak reverse current tp= 100μs square 2 A
Tstg Storagetemperaturerange -65to+ 150 °C Maximum junctiontemperature 150 °C
dV/dt Critical rateof riseof reverse voltage 10000 V/μs
ABSOLUTE RATINGS(limiting values) dPtot
dTj < 1
Rth(j−a) thermal runaway conditionfora diodeonits own heatsink
1/4
Symbol Parameter Value UnitRth(j-c) Junctionto case 2.5 °C/W
THERMAL RESISTANCES
Symbol Tests Conditions Tests Conditions Min. Typ. Max. Unit* Reverse leakage current Tj= 25°CVR =VRRM 1mA= 100°C15 40* Forward voltage drop Tj= 25°CIF=8A 0.49 V= 125°C 0.35 0.4= 25°CIF= 16A 0.63= 125°C 0.48 0.57
STATIC ELECTRICAL CHARACTERISTICSPulse test: *tp= 380μs,δ <2%
Toevaluatethe maximum conduction losses use the following equation:= 0.23x IF(AV)+ 0.021IF2 (RMS) 2468 100.0
IF(av)(A)
PF(av)(W)=1=0.5δ=0.2δ=0.1
δ=0.05
δ=tp/T tp
Fig.1: Average forward power dissipation versus
averageforward current. 25 50 75 100 125 1500
IF(av)(A)Rth(j-a)=70°C/W
Rth(j-a)=Rth(j-c)
Tamb(°C)δ=tp/T tp
Fig.2: Average forward current versus ambient
temperature(δ=0.5).
STPS8L30B2/4
1E-3 1E-2 1E-1 1E+00
IM(A)
Tc=25°C
Tc=125°C
Tc=75°C
δ=0.5
t(s)
Fig.3: Non repetitive surge peak forward current
versus overload duration(maximum values).
1E-4 1E-3 1E-2 1E-1 1E+00.0
tp(s)
Zth(j-c)/Rth(j-c)
δ=tp/T tpSinglepulse
δ=0.10.2
δ=0.5
Fig.4: Relative variationof thermal impedance
junctionto ambient versus pulse duration. 5 10 15 20 25 301E-3
1E-2
1E-1
1E+0
1E+1
1E+2
3E+2
IR(mA)Tj=125°C
Tj=25°C
Tj=150°C
VR(V)
Fig.5: Reverse leakage current versus reverse
voltage applied (typicalvalues).
110 40100
VR(V)
C(pF)
F=1MHz
Tj=25°C
Fig.6: Junction capacitance versus reverse
voltage applied (typical values).
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.00.1
VFM(V)
IFM(A)
Typicalvalues
Tj=150°C
Tj=25°C
Tj=125°C
Fig.7: Forward voltage drop versus forward cur-
rent (maximum values). 2468 10 12 14 16 18 200
S(Cu) (cm )
Rth(j-a) (°C/W)
Fig.8: Thermal resistance junctionto ambient ver-
suscopper surfaceunder tab (Epoxyprinted circuit
board FR4,copper thickness: 35μm).
STPS8L30B3/4
PACKAGE MECHANICAL DATADPAK
REF.
DIMENSIONS
Millimeters Inches
Min. Typ. Max Min. Typ. Max. 2.20 2.40 0.086 0.094 0.90 1.10 0.035 0.043 0.03 0.23 0.001 0.009 0.64 0.90 0.025 0.035 5.20 5.40 0.204 0.212 0.45 0.60 0.017 0.023 0.48 0.60 0.018 0.023 6.00 6.20 0.236 0.244 6.40 6.60 0.251 0.259 4.40 4.60 0.173 0.181 9.35 10.10 0.368 0.397 0.80 0.031 0.60 1.00 0.023 0.039 0° 8° 0° 8°
FOOT PRINT DIMENSIONS(in millimeters)
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Orderingtype Marking Package Weight Base qty Delivery modeSTPS8L30B STPS8L30B DPAK 0.3g 75 Tube
STPS8L30B-TR STPS8L30B DPAK 0.3g 2500 Tape& reel
Epoxy meetsUL94,V0
STPS8L30B4/4
:
www.ic-phoenix.com
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