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STPS80H100CY
HIGH VOLTAGE POWER SCHOTTKY RECTIFIER
STPS80H100CY
PRELIMINARY DATASHEETNovember 1999 - Ed: 1B
HIGH VOLTAGE POWER SCHOTTKY RECTIFIER
MAIN PRODUCT CHARACTERISTICSHIGH REVERSE VOLTAGE
NEGLIGIBLE SWITCHING LOSSES
LOW FORWARD VOLTAGE DROP
LOW LEAKAGE CURRENT
HIGH TEMPERATURE
LOW THERMAL RESISTANCE
FEATURES AND BENEFITSDual center tap Schottky rectifier suited for
Switched Mode Power Supplies and high
frequency DC to DC converters.
Packaged in Max247, this device is intended for
use in high frequency computer and telecom
converters.
DESCRIPTION
ABSOLUTE RATINGS (limiting values, per diode)* : dPtot
dTj < 1
Rth(j−a) thermal runaway condition for a diode on its own heatsink
1/4
THERMAL RESISTANCESPulse test : * tp = 5 ms, δ < 2 %
** tp = 380 μs, δ < 2%
To evaluate the maximum conduction losses use the following equation :
P = 0.56 x IF(AV) + 0.0035 x IF2 (RMS)
STATIC ELECTRICAL CHARACTERISTICS (per diode) 5 10 15 20 25 30 35 40 45 500
PF(av)(W)
Fig. 1: Average forward power dissipation versusaverage forward current (per diode). 25 50 75 100 125 150 1750
IF(av)(A)
Fig. 2: Average forward current versus ambient
temperature (δ=0.5, per diode).
When the diodes 1 and 2 are used simultaneously :
Δ Tj(diode 1) = P(diode1) x Rth(j-c)(Per diode) + P(diode 2) x Rth(c)
STPS80H100CY2/4
1E-3 1E-2 1E-1 1E+00
IM(A)
Fig. 3: Non repetitive surge peak forward current
versus overload duration (maximum values, per
diode).
1E-3 1E-2 1E-1 1E+00.0
Zth(j-c)/Rth(j-c)
Fig. 4: Relative variation of thermal impedance
junction to case versus pulse (per diode). 10203040 5060708090 1001E-1
1E+0
1E+1
1E+2
1E+3
1E+4
IR(μA)
Fig. 5: Reverse leakage current versus reverse
voltage applied (typical values, per diode). 2 5 10 20 50 1000.1
C(nF)
Fig. 6: Junction capacitance versus reverse
voltage applied (typical values, per diode).
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.01
IFM(A)
Fig. 7: Forward voltage drop versus forward
current (maximum values, per diode).
STPS80H100CY3/4
. consequences of
use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written ap-
proval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics
© 1999 STMicroelectronics - Printed in Italy - All rights reserved.
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http://
PACKAGE MECHANICAL DATAMax247
Epoxy meets UL94,V0
STPS80H100CY4/4
:
www.ic-phoenix.com
.
