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STPS60H100CTSTMN/a10000avaiPOWER SCHOTTKY RECTIFIER


STPS60H100CT ,POWER SCHOTTKY RECTIFIERSTPS60H100C®POWER SCHOTTKY RECTIFIERMAIN PRODUCT CHARACTERISTICSI 2 x 30 AF(AV)A1KV 100 VRRMA2T 175 ..
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STPS60H100CT
POWER SCHOTTKY RECTIFIER
1/5
MAIN PRODUCT CHARACTERISTICS
STPS60H100C

POWER SCHOTTKY RECTIFIER
REV. 1
ABSOLUTE RATINGS (limiting values, per diode)

* : thermal runaway condition for a diode on its own heatsinkdPtot
dTj--------------- 1
Rthja–()-------------------------->
August 2004
FEATURES AND BENEFITS
High junction temperature capabiliy Low leakage current Low thermal resistance High frequency operation Avalanche specification
DESCRIPTION

Dual center tab Schottky rectifier suited for High
Frequency server and telecom base station
SMPS. Packaged in TO-220AB, this device com-
bines high current rating and low volume to en-
hance both reliability and power density of the
application.
Order Codes
STPS60H100C
THERMAL RESISTANCE
STATIC ELECTRICAL CHARACTERISTICS (per diode)

Pulse test: * tp = 5 ms, δ < 2%
** tp = 380 µs, δ < 2%
To evaluate the conduction losses use the following equation: P = 0.6 x IF(AV) + 0.004 IF2 (RMS)
When the diodes 1 and 2 are used simultaneously:
∆ Tj(diode 1) = P(diode 1) x R th(j-c) (Per diode) + P(diode 2) x R th(c)
STPS60H100C
3/5
Fig 1: Average forwatd power dissipation versus

average forward current (per diode).
Fig. 2:
Average forward current versus ambient
temperature (δ = 0.5, per diode).
Fig. 3:
Normalized avalanche power derating
versus pulse duration.
Fig. 4:
Normalized avalanche power derating
versus junction temperature.
Fig. 5: Non repetitive surge peak forward current

versus overload duration.
Fig. 6: Relative
variation of thermal impedance
junction to case versus pulse.
STPS60H100C
Fig. 7: Reverse
leakage current versus reverse
voltage applied (typical values).
Fig. 8:
Junction capacitance versus reverse
voltage applied (typical values).
Fig. 9:
Forward voltage drop versus forward
current.
STPS60H100C
5/5
PACKAGE MECHANICAL DATA

TO-220AB
. consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics.
All other names are the property of their respective owners
© 2004 STMicroelectronics - All rights reserved
STMicroelectronics GROUP OF COMPANIES

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ORDERING INFORMATION
Epoxy meets UL94, V0 Cooling method: by conduction (C) Recommended torque value: 0.8 m.N. Maximum torque value: 1.0 m.N.
REVISION HISTORY
Table 1: Revision history
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