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STPS5L60S
Low Drop Power Schottky Rectifier
May 2008 Rev 3 1/8
STPS5L60Power Schottky rectifier
Features Negligible switching losses Low forward voltage drop for higher
efficiency Low thermal resistance Avalanche capability specified
DescriptionPower Schottky rectifier suited for switch mode
power supplies and high frequency inverters.
This device is intended for use in low voltage
output for small battery chargers and consumer
SMPS such as DVD and set-top-box.
Table 1. Device summary
Characteristics STPS5L60
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1 Characteristics
o evaluate the conduction losses use the following equation :
P = 0.39 x I F(AV) + 0.028x IF2 (RMS)
Table 2. Absolute ratings (limiting values) condition to avoid thermal runaway for a diode on its own heatsinkdPtot
dTj--------------- 1
Rthja–()--------------------------<
Table 3. Thermal parameters
Table 4. Static electrical characteristics Pulse test : tp = 380 µs, δ < 2%
STPS5L60 Characteristics
3/8
Figure 1. Conduction losses versus average
current
Figure 2. Average forward current versus
ambient temperature (δ = 0.5)
Figure 3. Normalized avalanche power
Figure 4. Normalized avalanche power
Figure 5. Non repetitive surge peak forward
current versus overload duration
(maximum values) DO-201AD
Figure 6. Non repetitive surge peak forward
current versus overload duration
(maximum values) SMC
Characteristics STPS5L60
4/8
Figure 7. Relative variation of thermal
impedance junction to ambient
versus pulse duration, DO-201AD
Figure 8. Relative variation of thermal
impedance junction to ambient
versus pulse duration, SMC
Figure 9. Reverse leakage current versus
reverse voltage applied (typical
values)
Figure 10. Junction capacitance versus
reverse voltage applied (typical
values)
STPS5L60 Characteristics
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Figure 15. Thermal resistances versus leads length DO-201AD
Figure 11. Forward voltage drop versus
forward current (low level)
Figure 12. Forward voltage drop versus
forward current (high level)
Figure 13. Thermal resistance junction to
ambient versus copper surface
under each lead (epoxy printed
board FR4, Cu = 35 µm) SMC
Figure 14. Thermal resistance junction to
ambient versus copper surface
under each lead (epoxy printed
board FR4, Cu = 35 µm), DO-201AD
Package information STPS5L60
6/8
2 Package information Epoxy meets UL94, V0
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at .
Figure 16. Footprint, dimensions in mm (inches)
Table 5. SMC dimensions
