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STPS5L25BSTN/a1250avaiLOW DROP POWER SCHOTTKY RECTIFIER


STPS5L25B ,LOW DROP POWER SCHOTTKY RECTIFIERAPPLICATIONSn HIGH POWER SURFACE MOUNT MINIATUREPACKAGEn AVALANCHE RATEDDESCRIPTIONSingle Schottky ..
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STPS5L25B
LOW DROP POWER SCHOTTKY RECTIFIER
STPS5L25B
July 2001- Ed:4A
LOW DROP POWER SCHOTTKY RECTIFIER
MAIN PRODUCT CHARACTERISTICS
VERY LOW FORWARD VOLTAGE DROP FOR
LESS POWER DISSIPATION AND REDUCED
HEATSINK OPTIMIZED CONDUCTION/REVERSE LOSSES
TRADE-OFF WHICH MEANS THE HIGHEST
EFFICIENCYIN THE APPLICATIONS HIGH POWER SURFACE MOUNT MINIATURE
PACKAGE AVALANCHE RATED
FEATURES AND BENEFITS

Single Schottky rectifier suitedto Switched Mode
Power Supplies and high frequency DCto DC con-
verters.
This deviceis especially intended for use asa
Rectifierat the secondaryof 3.3V SMPS units.
DESCRIPTION
ABSOLUTE RATINGS
(limiting values) dPtot
dTj Rthj a< − thermal runaway conditionfora diodeonits own heatsink
STPS5L25B
THERMAL RESISTANCES
STATIC ELECTRICAL CHARACTERISTICS

Pulse test:*tp= 380μs,δ <2% evaluate the maximum conduction losses use the following equation:
P=0.2xIF(AV)+ 0.030IF2 (RMS) 1 2345 60.0
PF(av)(W)
Fig.1: Average forward power dissipation versus
average forward current. 25 50 75 100 125 1500 IF(av)(A)
Fig.2:
Average forward current versus ambient
temperature (δ=0.5).
STPS5L25B
1E-3 1E-2 1E-1 1E+00
100 IM(A)
Fig.3:
Non repetitive surge peak forward current
versus overload duration (maximum values).
1.0E-4 1.0E-3 1.0E-2 1.0E-1 1.0E+00.0
Zth(j-c)/Rth(j-c)
Fig.4: Relative variationof thermal impedance
junctionto case versus pulse duration. 5 10 15 20 251E-3
1E-2
1E-1
1E+0
1E+1
1E+2
3E+2 IR(mA)
Fig.5:
Reverse leakage current versus reverse
voltage applied (typical values). 5 10 20 30100
C(pF)
Fig. 6: Junction capacitance versus reverse
voltage applied (typical values).
IFM(A)

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.00.1
Fig.7: Forward voltage drop versus forward cur-
rent (maximum values). 2 4 6 8 1012 14 1618 200
S(Cu) (cm²)
Rth(j-a) (°C/W)
Fig.8: Thermal resistance junctionto ambient ver-
sus copper surface under tab (Epoxy printed cir-
cuit board FR4, copper thickness: 35μm).
STPS5L25B
PACKAGE MECHANICAL DATA

DPAK Epoxy meets UL94,V0
Information furnishedisbelievedtobe accurate andreliable. However,STMicroelectronics assumesnoresponsibility fortheconsequencesof
use ofsuch informationnor forany infringementof patentsor other rights ofthird parties whichmayresultfromits use.No licenseis grantedby
implicationor otherwise under any patentor patent rightsof STMicroelectronics. Specifications mentionedinthis publicationare subjectto
changewithout notice. This publication supersedesand replacesall information previously supplied.
STMicroelectronics productsarenot authorizedforuseas critical componentsinlife support devicesor systems without express writtenap-
provalof STMicroelectronics.
TheST logoisa registered trademarkof STMicroelectronics 2001 STMicroelectronics- Printedin Italy-All rights reserved.
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