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STPS3L60-STPS3L60U
POWER SCHOTTKY RECTIFIER
STPS3L60/Q/UNovember 2002- Ed:4A
POWER SCHOTTKY RECTIFIER
Axial and Surface Mount Power Schottky rectifier
suited for Switch Mode Power Supplies and high
frequency DC to DC converters. Packagedin
DO-201AD, DO-15 and SMB, this deviceis
intended for usein low voltage, high frequency
inverters and small battery chargers.
For applications where there are space
constraints, e.g Telecom battery charger.
DESCRIPTION NEGLIGIBLE SWITCHING LOSSES LOW THERMAL RESISTANCE
FEATURES AND BENEFITS
ABSOLUTE RATINGS (limiting values)
MAIN PRODUCT CHARACTERISTICS dPtot
dTj Rthj a< − thermal runaway conditionfora diodeonits own heatsink
STPS3L60/Q/UPulse test:*tp= 380 μs,δ <2% evaluate the maximum conduction losses use the following equation:
P=0.44xIF(AV) +0.05xIF2 (RMS)
STATIC ELECTRICAL CHARACTERISTICS
THERMAL RESISTANCES0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
2.5
(W)F(AV)
Fig.1: Average forward power dissipation versus
average forward current. 25 50 75 100 125 150
3.5
(A)F(AV)
Fig. 2-1: Average forward current versus ambient
temperature(δ= 0.5) (DO-201AD, SMB).
STPS3L60/Q/U1E-3 1E-2 1E-1 1E+0
(A)M
Fig. 3-1: Non repetitive surge peak forward
current versus overload duration (maximum
values) (DO-201AD, SMB).
1E-1 1E+0 1E+1 1E+2 1E+3
Z/Rth(j-a) th(j-a)
Fig. 4-1: Relative variationof thermal impedance
junction to ambient versus pulse duration
(DO-201AD, SMB). 5 10 15 20 25 30 35 40 45 50 55 60
1E-3
1E-2
1E-1
1E+0
1E+1
5E+1
(mA)R
Fig.5: Reverse leakage current versus reverse
voltage applied (typical values).
3.5 25 50 75 100 125 150
(A)F(AV)
Fig. 2-2: Average forward current versus ambient
temperature(δ= 0.5) (DO-15).
1.E-03 1.E-02 1.E-01
(A)M
Fig. 3-2: Non repetitive surge peak forward
current versus overload duration (maximum
values) (DO-15).
1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Z/Rth(j-a) th(j-a)
Fig.4: Relative variationof thermal impedance
junctionto ambient versus pulse duration (DO-15).
STPS3L60/Q/U0.0 0.5 1.0 1.5 2.0 2.5
(A)FM
Fig. 7-1: Forward voltage drop versus forward
current (high level, maximum values).
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
(A)FM
Fig. 7-2: Forward voltage drop versus forward
current (low level, maximum values). 10 100
C(pF)
Fig. 6: Junction capacitance versus reverse
voltage applied (typical values).
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
120
(°C/W)th(j-)
Fig.8: Thermal resistance junctionto ambient
versus copper surface under each lead (Epoxy
printed circuit board FR4, Cu: 35μm) (SMB).
STPS3L60/Q/U
PACKAGE MECHANICAL DATASMB (JEDEC DO-214AA)
FOOT PRINT DIMENSIONS (in millimeters)
STPS3L60/Q/U
PACKAGE MECHANICAL DATADO-15 plastic
