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STPS30H60CT
Power Schottky Rectifier
STPS30H60CPower Schottky rectifier
Features High junction temperature capability Avalanche rated Low leakage current Good trade-off between leakage current and
forward voltage drop High frequency operation
DescriptionDual centre tab Schottky rectifier suited for high
frequency switch mode power supply.
Packaged in TO-220FP AB, TO-220AB, TO-247, 2 PAK, and D2P AK, this device is intended to be
used in notebook and LCD adaptors and desktop
SMPS. In these applications the STPS30H60C
provides a good margin between the remaining
voltages applied on the diode and the voltage
capability of the diode.
Table 1. Device summary
Characteristics STPS30H60C
1 Characteristics
To evaluate the conduction losses use the following equation: P = 0.45 x IF(AV) + 0.008 x IF2 (RMS)
Table 2. Absolute ratings (limiting values per diode) condition to avoid thermal runaway for a diode on its own heatsink
Table 3. Thermal parameters
Table 4. Static electrical characteristics Pulse test: tp = 5 ms, δ < 2% Pulse test: tp = 380 µs, δ < 2%
STPS30H60C Characteristics
Figure 1. Conduction losses versus
average forward current
Figure 2. Average forward current versus
ambient temperature
(δ = 0.5, per diode)
Figure 3. Normalized avalanche power
derating versus pulse duration
Figure 4. Normalized avalanche power
derating versus junction
temperature
Figure 5. Non repetitive surge peak forward
current versus overload duration
(maximum values, per diode)
Figure 6. Non repetitive surge peak forward
current versus overload duration
(maximum values, per diode)
Characteristics STPS30H60C
Figure 7. Relative variation of thermal
impedance junction to case versus
pulse duration
Figure 8. Relative variation of thermal
impedance junction to case versus
pulse duration
Figure 9. Reverse leakage current versus
reverse voltage applied
(typical values, per diode)
Figure 10. Junction capacitance versus
reverse voltage applied
(typical values, per diode)
Figure 11. Forward voltage drop versus
forward current (per diode)
Figure 12. Thermal resistance junction to
ambient versus copper surface
under tab
STPS30H60C Package information
2 Package information Epoxy meets UL94, V0 Cooling method: by conduction (C) Recommended torque values: TO-220FPAB and TO-220AB 0.4 to 0.6 N·m TO-247 0.9 to 1.2 N·m
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: .
ECOPACK® is an ST trademark.
Table 5. TO-220FPAB dimensions
Package information STPS30H60C
Table 6. TO-220AB dimensions
