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STPS3045CG-TR |STPS3045CGTRSTMN/a2878avaiPOWER SCHOTTKY RECTIFIER


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STPS3045CG-TR
POWER SCHOTTKY RECTIFIER
STPS3045CT/CG/CR/CP/CPI/CW/CFP
July 2003- Ed:6E
POWER SCHOTTKY RECTIFIER
MAIN PRODUCT CHARACTERISTICS
VERY SMALL CONDUCTION LOSSES NEGLIGIBLE SWITCHING LOSSES EXTREMELY FAST SWITCHING LOW THERMAL RESISTANCE INSULATED PACKAGE: TOP-3I
Insulating voltage= 2500V RMS
Capacitance= 12pF AVALANCHE CAPABILITY SPECIFIED
FEATURES AND BENEFITS

Dual center tap Schottky rectifier suited for
SwitchMode Power Supply and high frequency DC DC converters.
Packaged either in TO-220AB, TO-220FPAB,2 PAK,I2 PAK, TO-247, SOT93or TOP-3I, this
deviceis especially intended for usein low volt-
age, high frequency inverters, free wheeling and
polarity protection applications.
DESCRIPTION
STPS3045CT/CG/CR/CP/CPI/CW/CFP
When the diodes1 and2 are used simultaneously:Tj (diode1)=P (diode1)x Rth(j-c) (per diode)+P (diode2)x Rth(c)
THERMAL RESISTANCES
ABSOLUTE RATINGS
(limiting values, per diode) dPtot
dTj Rthj a< − thermal runaway conditionfora diodeonits own heatsink
STATIC ELECTRICAL CHARACTERISTICS
(Per diode)
Pulse test:*tp= 380μs,δ <2% evaluate the conduction losses use the following equation:
P=0.42xIF(AV)+ 0.01IF2 (RMS)
STPS3045CT/CG/CR/CP/CPI/CW/CFP (W)F(AV)
02468 10 12 14 16 18 20
Fig.1:
Average forward power dissipation versus
average forward current (per diode). (A)F(AV) 25 50 75 100 125 150 175
Fig. 2:
Average current versus ambient
temperature(δ= 0.5, per diode). (A)M
1.E-03 1.E-02 1.E-01 1.E+00
Fig. 5-1:
Non repetitive surge peak forward current
versus overload duration (maximum values, per
diode).
1.E-03 1.E-02 1.E-01 1.E+00 (A)M
Fig. 5-2:
Non repetitive surge peak forward current
versus overload duration (maximum values, per
diode).
1.2 25 50 75 100 125 150
P(t) (25°C)
ARMp
ARM
Fig.4:
Normalized avalanche power derating
versus junction temperature.
0.10.01 1
0.1 100 1000
P(t) (1μs)
ARMp
ARM
Fig. 3:
Normalized avalanche power derating
versus pulse duration.
STPS3045CT/CG/CR/CP/CPI/CW/CFP
1.E-03 1.E-02 1.E-01 1.E+00 (A)M
Fig. 5-3:
Non repetitive surge peak forward current
versus overload duration (maximum values, per
diode).
Z/Rth(j-c) th(j-c)

1.E-03 1.E-02 1.E-01 1.E+00 1.E+01
Fig. 6-2:
Relative variationof thermal transient
impedance junctionto case versus pulse duration.
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
1.E+04
1.E+05 5 10 15 20 25 30 35 40 45 (μA)R
Fig.7:
Reverse leakage current versus reverse
voltage applied (typical values, per diode).
C(nF)

10000 10 100
Fig. 8:
Junction capacitance versus reverse
voltage applied (typical values, per diode). (A)FM
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
Fig. 9:
Forward voltage drop versus forward
current (maximum values, per diode).
Z/Rth(j-c) th(j-c)

1.E-03 1.E-02 1.E-01 1.E+00
Fig. 6-1:
Relative variationof thermal transient
impedance junctionto case versus pulse duration.
STPS3045CT/CG/CR/CP/CPI/CW/CFP 5 10 15 20 25 30 35 40 (°C/W)th(j-a)
Fig. 10:
Thermal resistance junctionto ambient
versus copper surface under tab (epoxy printed
board FR4, Cu=35μm).
PACKAGE MECHANICAL DATA

TO-220AB
STPS3045CT/CG/CR/CP/CPI/CW/CFP
PACKAGE MECHANICAL DATA
2 PAK
PACKAGE MECHANICAL DATA

TOP-3I (isolated)
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