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STPS2L40UF
Low Drop Power Schottky Rectifier
September 2008 Rev 4 1/10
STPS2L40Low drop power Schottky rectifier
Features Very small conduction losses Negligible switching losses Low forward voltage drop Surface mount miniature package Avalanche capability specified ECOPACK2® halogen-free component
(SMAflat and SMBflat)
DescriptionSingle chip Schottky rectifiers suited to Switched
Mode Power Supplies and high frequency DC to
DC converters.
Packaged in SMB, low profile SMB and low profile
SMA, this device is especially intended for surface
mounting and used in low voltage, high frequency
inverters, free wheeling and polarity protection
applications.
Table 1. Device summary
Characteristics STPS2L40
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1 Characteristics
o evaluate the conduction losses use the following equation:
P = 0.22 x I F(AV) + 0.06 IF2 (RMS)
Table 2. Absolute ratings (limiting values)
Table 3. Thermal resistances
Table 4. Static electrical characteristics Pulse test: tp = 380 µs, δ < 2
STPS2L40 Characteristics
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Figure 1. Average forward power dissipation
versus average forward current
Figure 2. Average forward current versus
ambient temperature (δ = 0.5) SMB
Figure 3. Average forward current versus
ambient temperature (δ = 0.5)
SMBflat
Figure 4. Average forward current versus
ambient temperature (δ = 0.5)
SMAflat
Figure 5. Non repetitive surge peak forward
current versus overload duration
(maximum values) SMB
Figure 6. Non repetitive surge peak forward
current versus overload duration
(maximum values) SMBflat
Characteristics STPS2L40
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Figure 7. Non repetitive surge peak forward
current versus overload duration
(maximum values) SMAflat
Figure 8. Normalized avalanche power
derating versus pulse duration
Figure 9. Normalized avalanche power
derating versus junction
temperature
Figure 10. Relative variation of thermal
impedance junction to ambient
versus pulse duration - SMB
Figure 11. Relative variation of thermal
impedance junction to lead
versus pulse duration - SMBflat
Figure 12. Relative variation of thermal
impedance junction to ambient
versus pulse duration - SMAflat
STPS2L40 Characteristics
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Figure 13. Reverse leakage current versus
reverse voltage applied (typical
values)
Figure 14. Junction capacitance versus
reverse voltage applied (typical
values)
Figure 15. Forward voltage drop versus
forward current (high level)
Figure 16. Forward voltage drop versus
forward current (low level)
Figure 17. Thermal resistance junction to
ambient versus copper surface
under each lead, SMB, SMBflat
(epoxy printed board FR4, copper
thickness = 35 µm)
Figure 18. Thermal resistance junction to
ambient versus copper surface
under each lead, SMAflat (epoxy
printed board FR4, copper
thickness = 35 µm)
Package Information STPS2L40
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2 Package Information Epoxy meets UL94,V0
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at .
Table 5. SMB dimensions
