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STPS2150A
POWER SCHOTTKY RECTIFIER
1/6
Table 1: Main Product Characteristics
STPS2150POWER SCHOTTKY RECTIFIER
REV. 4
Table 3: Absolute Ratings (limiting values)* : thermal runaway condition for a diode on its own heatsinkdPtot
dTj--------------- 1
Rthja–()-------------------------->
August 2004
FEATURES AND BENEFITS Negligible switching losses Low forward voltage drop for higher efficiency
and extented battery life Low thermal resistance Surface mount miniature package Avalanche capability specified
DESCRIPTION150V Power Schottky rectifier are suited for switch
Mode Power Supplies on up to 24V rails and high
frequency converters.
Packaged in SMA and Axial, this device is
intended for use in consumer and computer
applications like TV, STB, PC and DVD where low
drop forward voltage in required to reduce power
dissipation.
Table 2: Order Codes
STPS2150
Table 4: Thermal Resistance
Table 5: Static Electrical CharacteristicsPulse test: * tp = 380 µs, δ < 2%
To evaluate the conduction losses use the following equation: P = 0.59 x I F(AV) + 0.04 IF2 (RMS)
Figure 1: Average forward power dissipation
versus average forward current
Figure 2: Average forward current versus
ambient temperature (δ = 0.5)
Figure 3: Normalized avalanche power
derating versus pulse duration
Figure 4: Normalized avalanche power
derating versus junction temperature
STPS21503/6
Figure 5: Non repetitive surge peak forward
current versus overload duration (maximum
values) (SMA)
Figure 6: Non repetitive surge peak forward
current versus overload duration (maximum
values) (DO-15)
Figure 7: Relative variation of thermal
impedance junction to ambient versus pulse
duration (epoxy printed circuit board,
e(Cu)=35µm, recommended pad layout) (SMA)
Figure 8: Relative variation of thermal
impedance junction to ambient versus pulse
duration (DO-15)
Figure 9: Reverse leakage current versus
reverse voltage applied (typical values)
Figure 10: Junction capacitance versus
reverse voltage applied (typical values)
STPS2150
Figure 11: Forward voltage drop versus
forward current (maximum values, high level)
(SMA)
Figure 12: Forward voltage drop versus
forward current (maximum values, low level)
(DO-15)
Figure 13: Thermal resistance junction to
ambient versus copper surface under each
lead (Epoxy printed circuit board FR4, copper
thickness: 35µm) (SMA)
Figure 14: Thermal resistance versus lead
length (DO-15)
STPS21505/6
Figure 15: SMA Package Mechanical Data
Figure 16: SMA Foot Print Dimensions(in millimeters)
STPS2150
Figure 17: DO-15 Package Mechanical Data. consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics.
All other names are the property of their respective owners
© 2004 STMicroelectronics - All rights reserved
STMicroelectronics group of companies - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -
Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
Table 6: Ordering Information Epoxy meets UL94, V0
Table 7: Revision History
