STPS20L25CG-TR ,LOW DROP POWER SCHOTTKY RECTIFIERAPPLICATIONSn AVALANCHE CAPABILITY SPECIFIED2TO-220AB D PAKSTPS20L25CT STPS20L25CGDESCRIPTIONDual c ..
STPS20L25CT ,LOW DROP POWER SCHOTTKY RECTIFIERAPPLICATIONS2TO-220AB D PAKSTPS20L25CT STPS20L25CGDESCRIPTIONDual center tap Schottky rectifier sui ..
STPS20L40CF ,LOW DROP POWER SCHOTTKY RECTIFIERapplications.ABSOLUTE RATINGS (limiting values, per diode)Symbol Parameter Value UnitV 40 VRRMRepet ..
STPS20L40CFP ,LOW DROP POWER SCHOTTKY RECTIFIERFEATURES AND BENEFITSA2Kn Low forward voltage drop meaning very smallA2 A1Kconduction lossesA1TO-22 ..
STPS20L45CFP ,LOW DROP POWER SCHOTTKY RECTIFIERapplications.ABSOLUTE RATINGS (limiting values, per diode)Symbol Parameter Value UnitV 45 VRRMRepet ..
STPS20L45CG-TR ,LOW DROP POWER SCHOTTKY RECTIFIERapplications.ABSOLUTE RATINGS (limiting values, per diode)Symbol Parameter Value UnitV 45 VRRMRepet ..
T1121NL , TELECOMMUNICATIONS PRODUCTS
T1122 , T1/CEPT/ISDN-PRI TRANSFORMERS Dual Surface Mount, 1500Vrms, Extended and Standard Temperature Range
T1124NL , TELECOMMUNICATIONS PRODUCTS
T1129NL , TELECOMMUNICATIONS PRODUCTS
T1133 , TRIANGULAR TYPE
T1136 , T1/CEPT/ISDN-PRI TRANSFORMERS Dual Surface Mount, 1500 Vrms, Extended and Standard Temperature Range
STPS20L25CG-TR
LOW DROP POWER SCHOTTKY RECTIFIER
STPS20L25CT/CGJuly 2003-Ed:4A
LOW DROP POWER SCHOTTKY RECTIFIER
MAIN PRODUCT CHARACTERISTICS VERY LOW FORWARD VOLTAGE DROP FOR
LESS POWER DISSIPATION AND REDUCED
HEATSINK OPTIMIZED CONDUCTION/REVERSE LOSSES
TRADE-OFF WHICH MEANS THE HIGHEST
EFFICIENCYIN THE APPLICATIONS AVALANCHE CAPABILITY SPECIFIED
FEATURES AND BENEFITSDual center tap Schottky rectifier suitedto
Switched Mode Power Supplies and high
frequencyDCtoDC converters.
Packagedin TO-220AB andD2 PAK,this deviceis
especially intendedfor useasa rectifieratthe
secondaryof 3.3V SMPS units.
DESCRIPTION
ABSOLUTE RATINGS (limiting values,per diode) dPtot
dTj Rthja< − thermal runaway conditionfora diodeonits own heatsink
STPS20L25CT/CG
THERMAL RESISTANCES
STATIC ELECTRICAL CHARACTERISTICS (per diode)Pulsetest:*tp=380μs,δ <2% evaluatethe maximum conduction lossesusethe following equation:
P=0.22xIF(AV)+ 0.013IF2 (RMS) 23456789 10 110
PF(av)(W)
Fig.1: Average forward power dissipation versus
average forward current. 25 50 75 100 125 1500
IF(av)(A)
Fig.2: Average forward current versus ambient
temperature(δ= 0.5).
Whenthe diodes1 and2are used simultaneously: Tj(diode1)= P(diode1)x Rth(j-c)(Per diode)+ P(diode2)x Rth(c)
1.2 25 50 75 100 125 150
P(t) (25°C)
ARMp
ARM
Fig.4: Normalized avalanche power derating
versus junction temperature.
0.10.01 1
0.1 100 1000
P(t) (1μs)
ARMp
ARM
Fig.3: Normalized avalanche power derating
versus pulse duration.
STPS20L25CT/CG1E-3 1E-2 1E-1 1E+00
IM(A)
Fig.5: Non repetitive surge peak forward current
versus overload duration (maximum values). 5 10 15 20 251E-2
1E-1
1E+0
1E+1
1E+2
5E+2
IR(mA)
Fig.7: Reverse leakage current versus reverse
voltage applied (typical values).
1.0E-4 1.0E-3 1.0E-2 1.0E-1 1.0E+00.0
Zth(j-c)/Rth(j-c)
Fig.6: Relative variationof thermal impedance
junctionto case versus pulse duration. 5 10 20 500.1
C(nF)
Fig.8: Junction capacitance versus reverse
voltage applied (typical values).
IFM(A)0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.00.1
Fig.9: Forward voltage drop versus forward
current (maximum values). 4 8 12 16 20 24 28 32 36 400
Rth(j-a) (°C/W)
Fig. 10: Thermal resistance junctionto ambient
versus copper surface undertab (Epoxy printed
circuit board FR4, copper thickness:35 μm).
(STPS20L25G only)
STPS20L25CT/CG
PACKAGE MECHANICAL DATA2 PAK
FOOTPRINT DIMENSIONS (in millimeters) n COOLING METHOD: BY CONDUCTION
(METHODC)
STPS20L25CT/CGInformationfurnishedis believedtobeaccurateand reliable.However, STMicroelectronics assumesno responsibilityforthe consequencesof
useof suchinformation norfor anyinfringementof patentsorotherrightsofthird partieswhichmay result fromitsuse. Nolicenseis grantedby
implicationor otherwise underany patentor patent rightsof STMicroelectronics. Specifications mentionedinthis publicationare subjectto
change withoutnotice.Thispublication supersedesand replacesall information previouslysupplied.
STMicroelectronics productsarenot authorizedforuseas critical componentsinlife support devicesor systems without express written
approvalof STMicroelectronics.
TheST logoisa registered trademarkof STMicroelectronics 2003 STMicroelectronics- PrintedinItaly-All rights reserved.
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PACKAGE MECHANICAL DATATO-220AB COOLING METHOD:C RECOMMENDED TORQUE VALUE: 0.55 M.N MAXIMUM TORQUE VALUE: 0.70 M.N EPOXY MEETS UL94,V0
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